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Microchip Technology SMBG5383BE3/TR13
- Part No.:
- SMBG5383BE3/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5383BE3/TR13.pdf
- Description:
- DIODE ZENER 150V 5W DO214AA
- Quantity:
- Payment:
- Shipping:
Inventory:6,757
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Product details
Overview
SMBG5383BE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal breakdown voltage of 150 V, ±5% tolerance (B suffix), RoHS-compliant matte-tin plating (e3), and DO-215AA gull-wing package. It delivers stable voltage regulation at 8.0 mA test current (IZT), exhibits 330 Ω dynamic impedance (ZZT), and supports up to 1.1 A non-repetitive surge current (IZSM) for transient protection in power supply rails.
For engineers reviewing the SMBG5383BE3/TR13 datasheet, SMBG5383BE3/TR13 pinout, SMBG5383BE3/TR13 application, or SMBG5383BE3/TR13 equivalent, key selection criteria include Zener voltage accuracy, thermal resistance (RθJL = 25 °C/W), maximum regulator current (IZM = 31.6 mA), surge capability (8.3 ms half-sine), and moisture sensitivity level (MSL Level 1, no dry pack required).
Technical Context
This device operates as a precision shunt voltage regulator in reverse-biased mode, with cathode indicated by band and rated for junction temperatures from –65 °C to +150 °C. Its DO-215AA gull-wing package enables visible solder joints and high-density PCB placement while maintaining 5.0 W power dissipation at lead temperature <25 °C.
The SMBG5383BE3/TR13 exhibits low dynamic impedance (330 Ω at IZT = 8.0 mA) and minimal voltage drift over current-critical for stable reference generation. Reverse leakage remains ≤0.5 µA at VR = 108 V, and forward voltage is 1.2 V at 1.0 A, supporting bidirectional ESD robustness per MIL-STD-750 Method 1020.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 150 V ±5% at IZT = 8.0 mA - defines precise clamping threshold for overvoltage protection circuits. |
| Power Dissipation (PD) | 5.0 W at TL < 25 °C - requires thermal management via copper pour or heatsinked lead for sustained operation. |
| Dynamic Impedance (ZZT) | 330 Ω at IZT = 8.0 mA - determines regulation stiffness; lower values improve load/line transient response. |
| Max Surge Current (IZSM) | 1.1 A (8.3 ms half-sine) - enables single-event transient suppression without degradation. |
| Thermal Resistance (RθJL) | 25 °C/W - allows direct thermal path from junction to PCB lead, critical for reliability under pulsed loads. |
| Moisture Sensitivity | Level 1 per J-STD-020B - eliminates dry-pack requirement and reflow baking steps during assembly. |
| Reverse Leakage (IR) | ≤0.5 µA at VR = 108 V - ensures minimal standby power loss in high-impedance bias networks. |
Pinout & Package
DO-215AA gull-wing surface-mount package with cathode identified by molded band; terminals are anode (unbanded end) and cathode (banded end). Designed for visible solder joint inspection and compatible with standard SMT reflow profiles (peak 260 °C for 10 s).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal in forward bias; reference ground node in reverse-bias regulation | Connected to system ground or low-impedance return path; must handle full surge current during clamping. |
| Cathode | Current exit terminal in forward bias; regulated output node in reverse-bias operation | Banded end connects to protected rail; voltage at this node is stabilized at 150 V ±5% across operating current range. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC 1N5383B equivalence | Identical electrical specs and test methods to legacy through-hole 1N5383B - enables drop-in replacement in upgraded designs. |
| Gull-wing leadform (DO-215AA) | Enables automated optical inspection (AOI) of solder joints and improves mechanical reliability vs. J-bend packages. |
| RoHS-compliant matte-tin plating (e3) | Eliminates lead-based solder compatibility concerns and meets global environmental compliance mandates. |
| MSL Level 1 rating | Supports unlimited floor life and standard reflow without preconditioning - reduces manufacturing overhead. |
| High IZSM / IZM ratio (1.1 A / 31.6 mA) | Provides >35× surge margin over steady-state current - suitable for lightning-induced transients in industrial power supplies. |
Applications
| Industrial Power Supply Protection | Automotive ECUs |
|---|---|
Use Scenario: Clamping induced transients on 12 V/24 V battery rails during load dump or alternator switching. IC Role / Device Role / Timing Role: Shunt regulator providing fast-response overvoltage protection at input stage of DC-DC converters. Use Value: Withstands 1.1 A surge (8.3 ms) while holding rail voltage ≤150 V - prevents damage to downstream LDOs and microcontrollers. |
Use Scenario: Voltage reference stabilization in engine control unit (ECU) sensor bias networks. IC Role / Device Role / Timing Role: Precision Zener reference source for analog front-end circuitry requiring stable 150 V bias. Use Value: ±5% tolerance and 330 Ω dynamic impedance ensure <±0.5 V drift over 1–10 mA operating range - critical for ADC accuracy. |
| Telecom Line Card Protection | Renewable Energy Inverters |
Use Scenario: Secondary overvoltage clamp on isolated DC bus in PoE-powered line cards. IC Role / Device Role / Timing Role: Fail-safe shunt element activated only during fault conditions to protect Ethernet PHY ICs. Use Value: MSL Level 1 and gull-wing leads enable high-yield SMT assembly without moisture-related defects - essential for telecom volume production. |
Use Scenario: DC-link voltage monitoring reference in solar string inverters with 1000 V+ bus ratings. IC Role / Device Role / Timing Role: High-voltage reference generator for isolation amplifier feedback paths. Use Value: Stable 150 V output at 8.0 mA with ≤0.5 µA leakage at 108 V ensures minimal power loss and long-term calibration stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5383B | Through-hole DO-41 package; identical VZ, IZT, ZZT, and IZM specs; non-RoHS (Sn/Pb plating). | Requires axial or radial through-hole PCB layout; unsuitable for high-density SMT designs. | Select when legacy board reuse or manual prototyping is prioritized over automated assembly. |
| SMBJ5383B | J-bend DO-214AA package; same electrical specs but higher RθJA (100 °C/W vs. 90 °C/W); different pad layout. | Lower thermal performance in ambient-convection environments; less visible solder joints than gull-wing. | Select when existing DO-214AA footprint exists and thermal derating margins exceed 15%. |
Compared with SMBG5383BE3/TR13, 1N5383B offers identical regulation performance but lacks SMT compatibility and RoHS compliance, while SMBJ5383B trades gull-wing inspectability and slightly better thermal resistance for J-bend mount flexibility.
Availability
SMBG5383BE3/TR13 is available at Aetrix Electronics and suitable for industrial power supply protection, automotive ECU biasing, and telecom line card clamping requiring stable component supply, consistent RoHS compliance, and verified surge performance.
Supply support for SMBG5383BE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and RF solutions for aerospace, defense, and industrial markets.
The SMBG53xxB series was designed specifically for surface-mount voltage regulation and transient suppression in space-constrained, high-surge environments where legacy through-hole Zeners were impractical.
FAQ
What is the Zener voltage tolerance of SMBG5383BE3/TR13?
The SMBG5383BE3/TR13 has a ±5% Zener voltage tolerance, indicated by the "B" suffix in the part number. This means its breakdown voltage is guaranteed between 142.5 V and 157.5 V when tested at 8.0 mA (IZT) and 25 °C. The e3 suffix confirms RoHS-compliant matte-tin plating, and TR13 denotes tape-and-reel packaging per EIA-481-1-A standard.
How does SMBG5383BE3/TR13 compare to the through-hole 1N5383B?
SMBG5383BE3/TR13 matches the 1N5383B in all electrical specifications-including 150 V Zener voltage, 8.0 mA test current, 330 Ω dynamic impedance, and 31.6 mA maximum regulator current-but uses a DO-215AA gull-wing surface-mount package instead of DO-41. It also features RoHS-compliant plating (e3) versus Sn/Pb on the 1N5383B, making SMBG5383BE3/TR13 suitable for modern automated assembly.
What is the maximum surge current rating for SMBG5383BE3/TR13?
The SMBG5383BE3/TR13 is rated for a non-repetitive peak surge current (IZSM) of 1.1 A, defined as a single 8.3 ms half-sine waveform. This rating assumes proper PCB thermal design (FR4 with 1 oz Cu and recommended pad layout). Exceeding this value risks irreversible junction damage, even if average power remains within 5 W limits.
Does SMBG5383BE3/TR13 require dry packing before reflow soldering?
No, SMBG5383BE3/TR13 has a moisture sensitivity level (MSL) of Level 1 per IPC/JEDEC J-STD-020B, meaning it has unlimited floor life and does not require dry packing or baking prior to reflow. This simplifies manufacturing logistics and eliminates moisture-related popcorning failures during standard SMT reflow profiles peaking at 260 °C for 10 seconds.
What is the thermal resistance from junction to lead (RθJL) for SMBG5383BE3/TR13?
The SMBG5383BE3/TR13 has a junction-to-lead thermal resistance (RθJL) of 25 °C/W, measured under specified mounting conditions. This parameter enables direct thermal modeling from die to PCB copper, supporting accurate derating calculations when ambient or lead temperature exceeds 25 °C. Its RθJA is 90 °C/W on FR4 with recommended footprint.
SMBG5383BE3/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 150 V
- Tolerance:
- ±5%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 330 Ohms
- Current - Reverse Leakage @ Vr:
- 500 nA @ 108 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5383BE3/TR13 FAQ
1.How can I place an order for SMBG5383BE3/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5383BE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5383BE3/TR13 reliable?
The price and inventory of SMBG5383BE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5383BE3/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5383BE3/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5383BE3/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5383BE3/TR13?
SMBG5383BE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5383BE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5383BE3/TR13?
For technical support, including SMBG5383BE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5383BE3/TR13 requirements.
6.How does Aetrix verify that SMBG5383BE3/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5383BE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5383BE3/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5383BE3/TR13?
All SMBG5383BE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5383BE3/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5383BE3/TR13 part is unused and in its original packaging.
Return procedure for SMBG5383BE3/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5383BE3/TR13 Tags
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