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Texas Instruments SMV512K32HFG
- Part No.:
- SMV512K32HFG
- Manufacturer:
- Texas Instruments
- Category:
- Memory
- Package:
- 76-CBQFP Bumpered
- Datasheet:
-
SMV512K32HFG.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 76CFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,693
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Product details
Overview
SMV512K32HFG from Texas Instruments is a radiation-hardened asynchronous CMOS SRAM organized as 524,288 × 32 bits (16 Mb), featuring dual-voltage operation (1.8 V core / 3.3 V I/O), 20-ns read access time, built-in EDAC with autonomous scrub engine, and master/slave pin-selectable configuration for spaceborne memory subsystems. It delivers SER < 5e−17 upsets/bit-day in geosynchronous orbit.
For engineers reviewing the SMV512K32HFG datasheet, SMV512K32HFG pinout, SMV512K32HFG application, or SMV512K32HFG equivalent, this device is selected for high-reliability embedded memory where TID immunity > 300 krad(Si), latch-up immunity > 110 MeV·cm²/mg, and real-time soft-error correction are mandatory - especially in FPGA co-processing, on-board telemetry buffers, and fault-tolerant avionics controllers.
Technical Context
The SMV512K32HFG implements HardSIL™ technology under license from Silicon Space Technology, combining substrate engineering and radiation-hardening-by-design (HBD) to achieve single-event upset mitigation and latch-up immunity. Its EDAC logic operates per-word (32-bit) with configurable single/multiple-bit error detection via A[12] control bit.
Scrubbing is autonomously managed via programmable BUSYZ/SCRUBZ timing and user-defined scrub rate; master mode drives BUSYZ (output) and SCRUBZ (output), while slave mode uses SCRUBZ as input and leaves BUSYZ unconnected. All four write cycles support write-through with GZ- or WZ-controlled output enable, and three read cycles support address-, chip-enable-, or output-enable–controlled access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 32 bits (16 Mb total) |
| Read Access Time | 20 ns max - determines minimum CPU wait-state insertion for synchronous bus interfacing |
| Write Cycle Time | 13.8 ns min (GZ-high mode) - enables high-throughput burst writes without bus contention |
| Radiation Tolerance | TID > 300 krad(Si); SER < 5e−17 upsets/bit-day (GEO, solar min) - validated for long-duration space missions |
| Supply Voltages | VDD1 = 1.7–1.9 V (core); VDD2 = 3.0–3.6 V (I/O) - requires dual-rail power sequencing and isolation |
| Operating Temperature | −55°C to +125°C case temperature - supports unheated satellite payloads and propulsion bay electronics |
| EDAC Function | Built-in error detection & correction with user-programmable scrub rate and MBE flag behavior - eliminates need for external ECC logic |
Pinout & Package
SMV512K32HFG is housed in a 76-lead ceramic quad flatpack (CQFP) package with 0.025-inch lead pitch, hermetically sealed for space-grade reliability and thermal cycling resilience.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[18:0] | Address Input | 19-bit address bus supporting full 524,288-word addressing; no internal address multiplexing |
| DQ[31:0] | Bidirectional Data Bus | 32-bit CMOS-compatible I/O with tri-state control via GZ/WZ; supports concurrent read/write-through |
| E1Z, E2 | Chip Enable Inputs | Active-low E1Z and active-high E2 jointly define device selection, standby, and scrub activation modes |
| WZ | Write Enable | Active-low control for all write cycles; determines write pulse width and data hold timing |
| GZ | Output Enable | Active-low control for DQ[31:0] output drivers; enables read-through and write-through data visibility |
| MSS | Master/Slave Select | Connect to VSS2 for master (autonomous scrub); connect to VDD2 for slave (scrub-on-demand) |
| MBE | Error Flag I/O | Indicates single/multiple-bit error per EDAC configuration; requires 1-kΩ pull-down for reset integrity |
| BUSYZ | Scrub Busy Indicator | Master-only output signaling imminent scrub start; used to insert memory controller wait states |
| SCRUBZ | Scrub Trigger Signal | Master output / slave input controlling scrub initiation timing; enables daisy-chained multi-device scrub |
| VDD1, VSS1 | Core Power/Ground | 1.8 V ±0.15 V supply and return for memory array and EDAC logic; separate from I/O domain |
| VDD2, VSS2 | I/O Power/Ground | 3.3 V ±0.3 V supply and return for address/data/control pins; CMOS-level compatible with FPGAs |
Key Features
| Feature | Design Value |
|---|---|
| HardSIL™ Radiation Hardening | Combines substrate engineering and HBD design to meet MIL-PRF-38535 Class V requirements for TID and LET |
| Programmable EDAC Scrub Rate | User-configurable scrub interval and BUSYZ-to-SCRUBZ delay via control register - balances error correction latency vs. memory bandwidth |
| Master/Slave Pin-Selectable Topology | Single MSS pin configures device as autonomous scrub master or synchronized slave - simplifies multi-SRAM system architecture |
| Three Read & Four Write Cycle Modes | Supports address-, chip-enable-, or output-enable–controlled reads and WZ-/GZ-/E-controlled writes - maximizes interface flexibility with diverse host controllers |
| Real-Time Error Detection During Reads | MBE flag asserts during normal read operations when errors occur - enables immediate software recovery without dedicated scrub cycles |
Applications
| Onboard Telemetry Buffer | FPGA Co-Processing Memory |
|---|---|
Use Scenario: Stores housekeeping sensor data (temperature, voltage, attitude) between downlink windows in LEO satellites. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer with EDAC-corrected storage; provides deterministic 20-ns read latency for telemetry packet assembly. Use Value: Eliminates ground retransmission due to cosmic-ray-induced bit flips; extends mission life by preventing silent data corruption in non-volatile logging paths. |
Use Scenario: Serves as local frame buffer and instruction cache for radiation-tolerant FPGAs executing guidance algorithms. IC Role / Device Role / Timing Role: High-bandwidth 32-bit data path memory with write-through capability; interfaces directly to FPGA I/O banks at 3.3 V. Use Value: Enables real-time correction of SEUs in compute pipelines without stalling FPGA execution - critical for closed-loop spacecraft control. |
| Avionics Fault-Tolerant Controller | Deep-Space Probe Command History Log |
Use Scenario: Holds flight software state variables and watchdog timers in triple-modular-redundant (TMR) avionics controllers. IC Role / Device Role / Timing Role: Radiation-hardened SRAM with autonomous scrub engine; operates across −55°C to +125°C without derating. Use Value: Guarantees data integrity under proton irradiation events; satisfies DO-254 Level A hardware assurance for certified flight systems. |
Use Scenario: Maintains immutable command execution history for autonomous navigation in Mars-orbiting probes. IC Role / Device Role / Timing Role: Long-life EDAC-protected memory with <5e−17 upsets/bit-day SER - ensures log fidelity over 10+ year missions. Use Value: Prevents loss of mission-critical sequence verification; removes need for periodic scrub-triggered memory refresh overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-hardened SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISM512K32RHFG | Same 512K×32 organization and CQFP-76 package; lower TID rating (200 krad), no programmable scrub rate | Limited to shorter-duration LEO missions; lacks master/slave topology for multi-SRAM systems | Select when cost sensitivity outweighs scrub flexibility and extended radiation margin |
| UT512K32RH | 16-Mb RH-SRAM in 84-lead CQFP; 25-ns read, no integrated EDAC - requires external ECC ASIC | Higher pin count, larger footprint; adds board area, power, and failure points from external correction logic | Choose only if legacy system design mandates pinout compatibility with UT-series and external ECC is already implemented |
Compared with ISM512K32RHFG and UT512K32RH, the SMV512K32HFG uniquely integrates programmable scrub, master/slave topology, and HardSIL™-enhanced TID/LET immunity - making it the sole option for high-autonomy deep-space memory subsystems requiring zero external ECC logic and guaranteed 300+ krad(Si) operation.
Availability
SMV512K32HFG is available at Aetrix Electronics and suitable for onboard telemetry buffers, FPGA co-processing memory, avionics fault-tolerant controllers, and deep-space probe command history logs requiring stable component supply across extended production lifecycles.
Supply support for SMV512K32HFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and space-grade ICs, with decades of heritage in radiation-hardened product development for NASA, ESA, and defense programs.
The SMV512K32HFG belongs to TI's space-qualified SRAM product line, engineered specifically for high-reliability memory applications in orbital, planetary, and nuclear environments where single-event effects and total ionizing dose must be mitigated without external circuitry.
FAQ
What is the radiation tolerance specification of the SMV512K32HFG?
The SMV512K32HFG is rated for total ionizing dose (TID) immunity exceeding 300 krad(Si) and single-event upset (SEU) rate below 5e−17 upsets/bit-day in geosynchronous orbit under solar minimum conditions. Latch-up immunity exceeds LET = 110 MeV·cm²/mg at 398 K. These values are based on initial device qualification and lot acceptance testing per MIL-PRF-38535 Class V requirements.
How does the master/slave configuration work on the SMV512K32HFG?
The SMV512K32HFG uses the MSS pin to select mode: tie MSS to VSS2 for master operation (autonomous scrub with BUSYZ/SCRUBZ outputs), or to VDD2 for slave operation (scrub-on-demand via SCRUBZ input). In master mode, BUSYZ signals impending scrub to pause the controller; in slave mode, SCRUBZ is an input that triggers local scrub upon assertion from a master device.
Does the SMV512K32HFG require external EDAC logic?
No. The SMV512K32HFG integrates full error detection and correction (EDAC) logic capable of correcting single-bit errors and detecting multiple-bit errors per 32-bit word. Its built-in scrub engine operates autonomously or on-demand, eliminating the need for external ECC ASICs, FPGA-based correction logic, or software-managed parity schemes.
What are the power supply requirements for the SMV512K32HFG?
The SMV512K32HFG requires two independent supplies: VDD1 = 1.7–1.9 V (±0.15 V) for the 1.8-V core logic and memory array, and VDD2 = 3.0–3.6 V (±0.3 V) for the 3.3-V I/O interface. VSS1 and VSS2 must be separately grounded. Power sequencing is not strictly enforced, but stable VDD1 should be established before VDD2 to ensure proper EDAC initialization.
Can the SMV512K32HFG operate across the full military temperature range?
Yes. The SMV512K32HFG is fully specified and tested from −55°C to +125°C case temperature. Its electrical characteristics - including 20-ns read access time, 13.8-ns write cycle, and EDAC functionality - are guaranteed across this range. Thermal derating curves confirm 15+ years of operational life at junction temperatures ≤95°C.
SMV512K32HFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 76-CBQFP Bumpered
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 76-CFP (45.72x51.31)
SMV512K32HFG FAQ
1.How can I place an order for SMV512K32HFG through Aetrix?
Please submit a Request for Quotation (RFQ) for SMV512K32HFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMV512K32HFG reliable?
The price and inventory of SMV512K32HFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMV512K32HFG is usually 5 days.
3.What payment methods are accepted for SMV512K32HFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMV512K32HFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMV512K32HFG?
SMV512K32HFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMV512K32HFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMV512K32HFG?
For technical support, including SMV512K32HFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMV512K32HFG requirements.
6.How does Aetrix verify that SMV512K32HFG is sourced from the original manufacturer or authorized distributors?
All SMV512K32HFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMV512K32HFG meets industry standards.
7.What is the process for return or replacement of SMV512K32HFG?
All SMV512K32HFG units undergo pre-shipment inspection (PSI). If there is an issue with SMV512K32HFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMV512K32HFG part is unused and in its original packaging.
Return procedure for SMV512K32HFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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