Texas Instruments SN74ABT125DR
- Part No.:
- SN74ABT125DR
- Manufacturer:
- Texas Instruments
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74ABT125DR.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 14SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74ABT125DR from Texas Instruments is a quadruple 3-state bus buffer gate IC used for bidirectional data isolation and signal fan-out in 5-V TTL-compatible digital systems. It features four independent noninverting buffers, each with separate output-enable (OE) control, −32-mA high-drive IOH and 64-mA IOL output capability, and supports hot-insertion via Ioff and power-up 3-state functionality. It is commonly deployed in backplane interface logic, memory address/data bus drivers, and FPGA/ASIC I/O expansion circuits.
For engineers reviewing the SN74ABT125DR datasheet, SN74ABT125DR pinout, SN74ABT125DR application, or SN74ABT125DR equivalent, key selection considerations include its 14-pin SOIC-D package, guaranteed 5-V operation (4.5 V to 5.5 V), 3-state output timing (tPZH ≤ 6 ns at VCC = 5 V), latch-up immunity (>500 mA per JESD-17), and ESD robustness (2000-V HBM).
Technical Context
The SN74ABT125DR implements four independent noninverting buffer stages, each with dedicated active-low output-enable (OE) control. Its outputs enter high-impedance state when OE is high, enabling bus sharing without contention. The device uses ABT (Advanced BiCMOS Technology) logic, combining bipolar input stages for speed and CMOS output stages for drive strength and low static current.
It integrates Ioff circuitry that disables outputs during power-down to prevent backflow current, and power-up 3-state logic that holds outputs in high-Z during VCC ramp-up/down. These features enable safe hot-plug operation in modular systems. Input thresholds are TTL-compatible (VIH = 2 V min, VIL = 0.8 V max), ensuring interoperability with legacy 5-V logic families.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - Ensures compatibility with standard 5-V TTL and CMOS systems; operation outside this range risks damage or undefined behavior. |
| Output Drive | −32 mA IOH / 64 mA IOL - Supports driving heavy capacitive loads (e.g., >50 pF buses) and multiple TTL inputs without signal degradation. |
| Propagation Delay | tPLH/tPHL ≤ 6 ns at VCC = 5 V - Enables reliable operation in high-speed digital interfaces up to ~100 MHz clock domains. |
| Hot-Insertion Support | Ioff ≤ ±100 µA at VCC = 0 - Prevents damaging back-current flow when inserted into live backplanes or powered systems. |
| ESD Protection | 2000-V HBM, 200-V MM - Meets industrial-grade ESD requirements for board-level handling and system integration. |
| Latch-Up Immunity | >500 mA per JESD-17 - Guarantees robustness against transient overcurrent events in noisy or fault-prone environments. |
| Input Capacitance | Ci = 3 pF - Minimizes loading on upstream drivers, preserving signal edge rates in multi-buffer cascades. |
Pinout & Package
SN74ABT125DR is housed in a 14-pin SOIC (Small Outline Integrated Circuit) package, 3.9 mm wide, 1.75 mm max height, with 1.27 mm pitch. Pin 1 is marked by a beveled corner or notch; the package is RoHS-compliant with NiPdAu lead finish and MSL Level-1 rating.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | OE (Output Enable) | Active-low control for corresponding buffer (1Y, 2Y, 3Y, 4Y); high = high-Z output, low = enabled buffer. |
| 2, 5, 11, 14 | A (Input) | Noninverting data input for respective buffer stage; TTL-compatible voltage thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V). |
| 3, 6, 12, 9 | Y (Output) | 3-state noninverting output; drives high/low when OE low, presents >10⁶ Ω impedance when OE high. |
| 7 | GND | Ground reference for all internal logic and output stages; must be low-impedance connection to minimize ground bounce (VOLP < 1 V). |
| 14 | VCC | Positive supply (4.5–5.5 V); powers all four buffers and OE logic; decoupling capacitor (0.1 µF) required near pin. |
Key Features
| Feature | Design Value |
|---|---|
| High-Drive Outputs | −32-mA sourcing / 64-mA sinking capability enables direct interfacing with 10+ TTL loads or long PCB traces without external buffering. |
| Hot-Insertion Ready | Ioff and power-up 3-state ensure zero current backflow and no bus contention during live insertion-critical for modular telecom and server backplanes. |
| Low Ground Bounce | Typical VOLP < 1 V at VCC = 5 V ensures clean low-level signaling even under fast switching of multiple outputs simultaneously. |
| TTL-Compatible Inputs | VIH = 2 V min / VIL = 0.8 V max allows seamless integration with legacy 5-V microcontrollers, FPGAs, and ASICs without level-shifting. |
| Robust ESD & Latch-Up | 2000-V HBM ESD rating and >500 mA latch-up immunity meet MIL-STD-883 Class 3B requirements for industrial and aerospace applications. |
Applications
| Backplane Bus Isolation | FPGA I/O Expansion |
|---|---|
|
Use Scenario: Isolating address/data lines between hot-swappable line cards and a central backplane in telecom chassis. IC Role / Device Role / Timing Role: Bidirectional 3-state buffer providing controlled signal routing and preventing bus contention during card insertion/removal. Use Value: Ioff protection eliminates risk of back-current damage; tPZL ≤ 6.8 ns ensures rapid bus release for deterministic arbitration. |
Use Scenario: Extending limited FPGA I/O pins to drive multiple peripheral modules (e.g., ADCs, DACs, sensors) on a single PCB. IC Role / Device Role / Timing Role: Fan-out buffer with independent OE controls allowing time-multiplexed access to shared peripherals. Use Value: −32-mA/64-mA drive strength supports full-swing signals across 10-cm traces; 3-pF Ci minimizes loading on FPGA outputs. |
| Memory Address Buffering | Legacy System Interface |
|
Use Scenario: Driving address lines from a microcontroller to multiple SRAM or EPROM devices on a shared memory bus. IC Role / Device Role / Timing Role: Noninverting buffer with 3-state outputs enabling dynamic bus ownership handoff between CPU and DMA controllers. Use Value: Propagation delay ≤ 4.9 ns maintains setup/hold timing margins; VOL ≤ 0.55 V guarantees valid low-level recognition across temperature. |
Use Scenario: Interfacing modern microcontrollers with legacy 5-V TTL peripherals (e.g., UART transceivers, display drivers) in industrial control panels. IC Role / Device Role / Timing Role: Level-consistent buffer translating between mixed-voltage subsystems while preserving signal integrity and timing. Use Value: TTL-compatible VIH/VIL eliminates need for external resistive dividers; 86°C/W θJA enables stable operation in enclosed enclosures up to 85°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC125DR | Lower drive (−24 mA / 24 mA), 1.65–3.6 V supply, CMOS input thresholds (VIH = 70% VCC), 3.3-V native operation. | Suitable for mixed-voltage 3.3-V systems but not drop-in for 5-V TTL buses; lacks Ioff and hot-insertion support. | Select when migrating to 3.3-V logic; avoid for legacy 5-V backplane or hot-swap use cases. |
| SN74ACT125DR | Same 5-V supply and pinout, but lower drive (−24 mA / 24 mA), higher ICC (30 mA vs. 250 µA disabled), no Ioff circuitry. | Compatible for static 5-V bus buffering but unsafe for hot-plug; higher static power in disabled state limits battery-powered use. | Choose only for cost-sensitive, non-hot-swap applications where ABT-level drive and robustness are unnecessary. |
Compared with SN74LVC125DR and SN74ACT125DR, the SN74ABT125DR uniquely delivers 5-V TTL compatibility, industry-leading drive strength, and certified hot-insertion capability-making it irreplaceable in mission-critical backplane and modular system designs requiring zero-risk live upgrades.
Availability
SN74ABT125DR is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA I/O expansion, memory address buffering, and legacy 5-V system integration requiring stable component supply and long-term lifecycle continuity.
Supply support for SN74ABT125DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability interface and buffer ICs.
The ABT logic family-including SN74ABT125DR-is engineered for high-speed, high-drive 5-V digital systems demanding robust hot-swap capability, low ground bounce, and industrial-grade reliability in telecom, computing, and industrial automation.
FAQ
What is the recommended pull-up resistor value for OE pins on SN74ABT125DR?
The OE pins should be tied to VCC through a pull-up resistor to ensure high-impedance state during power-up. TI specifies the minimum resistor value based on the driver's current-sinking capability; for typical 5-V operation with ≤10 µA leakage, a 10-kΩ resistor is sufficient and widely used in reference designs for SN74ABT125DR.
Does SN74ABT125DR support mixed-voltage operation (e.g., 3.3-V inputs with 5-V VCC)?
No. SN74ABT125DR is specified for 5-V operation only (VCC = 4.5 V to 5.5 V). Inputs must remain within 0 V to VCC; applying 3.3-V logic levels is acceptable since VIH = 2 V min and VIL = 0.8 V max, but the device itself cannot operate at 3.3 V. For true mixed-voltage translation, consider the SN74AVC series instead of SN74ABT125DR.
Can SN74ABT125DR be used in place of SN74LS125 in existing designs?
Yes, SN74ABT125DR is a functional and pin-compatible upgrade to SN74LS125, offering significantly higher drive (−32 mA / 64 mA vs. −0.4 mA / 8 mA), faster propagation (≤6 ns vs. ~15 ns), and added hot-insertion support. No PCB changes are required, and it improves noise margin and fan-out capability in SN74LS125-based systems.
What thermal derating applies to SN74ABT125DR in SOIC-D package at 85°C ambient?
In its SOIC-D package, SN74ABT125DR has θJA = 86°C/W. At TA = 85°C and maximum power dissipation (ICC = 30 mA at VCC = 5.5 V → ~165 mW), junction temperature rise is ~14.2°C, resulting in TJ ≈ 99°C - well below the 150°C absolute max. Derating is not required for continuous operation within rated conditions, confirming SN74ABT125DR suitability for industrial ambient environments.
Is SN74ABT125DR compliant with JEDEC JESD-17 latch-up testing?
Yes. The datasheet explicitly states "Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17", confirming that SN74ABT125DR has been tested and certified to withstand ≥500 mA of injected current without destructive latch-up - a critical requirement for ruggedized industrial and automotive-adjacent applications using SN74ABT125DR.
SN74ABT125DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SOIC
SN74ABT125DR FAQ
1.How can I place an order for SN74ABT125DR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ABT125DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ABT125DR reliable?
The price and inventory of SN74ABT125DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT125DR is usually 5 days.
3.What payment methods are accepted for SN74ABT125DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT125DR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74ABT125DR?
SN74ABT125DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ABT125DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT125DR?
For technical support, including SN74ABT125DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT125DR requirements.
6.How does Aetrix verify that SN74ABT125DR is sourced from the original manufacturer or authorized distributors?
All SN74ABT125DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT125DR meets industry standards.
7.What is the process for return or replacement of SN74ABT125DR?
All SN74ABT125DR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT125DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT125DR part is unused and in its original packaging.
Return procedure for SN74ABT125DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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