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Texas Instruments SN74ABT125PWE4
- Part No.:
- SN74ABT125PWE4
- Manufacturer:
- Texas Instruments
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74ABT125PWE4.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 14TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,032
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Product details
Overview
SN74ABT125PWE4 from Texas Instruments is a quadruple 3-state bus buffer gate IC designed for high-speed, hot-pluggable data bus isolation in industrial and telecom backplanes. It features four independent noninverting buffers, each with separate output-enable (OE) control, ±32-mA high-drive outputs, Ioff support for live insertion, and guaranteed operation from 4.5 V to 5.5 V at −40°C to 85°C.
For engineers reviewing the SN74ABT125PWE4 datasheet, SN74ABT125PWE4 pinout, SN74ABT125PWE4 application, or SN74ABT125PWE4 equivalent, this device is selected for bidirectional bus buffering where ground bounce <1 V, fast propagation (tPLH/tPHL ≤ 6 ns), and power-up 3-state behavior are critical in mixed-voltage or hot-swap systems.
Technical Context
The SN74ABT125PWE4 implements TTL-compatible input thresholds (VIL = 0.8 V, VVIH = 2 V) and delivers rail-to-rail CMOS-level outputs with active 3-state control per channel. Its Ioff circuitry disables outputs when VCC = 0 V, limiting reverse current to ±100 µA - enabling safe hot insertion into powered backplanes.
Each buffer operates with low-output impedance (64-mA sink / −32-mA source), supports up to 10 ns/V input transition rates, and maintains high-impedance state during power ramping (Δt/ΔVCC ≤ 200 µs/V). The device meets JEDEC JESD-17 latch-up immunity (>500 mA) and JESD-22 ESD ratings (2000-V HBM, 200-V MM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - ensures compatibility with 5-V logic rails and tolerates supply droop in noisy industrial environments. |
| IOL / IOH | 64 mA sink / −32 mA source - drives heavy capacitive loads (e.g., >50 pF buses) without signal degradation or timing skew. |
| tPLH, tPHL | ≤ 6 ns max at VCC = 5 V - enables reliable operation in 100+ MHz bus systems with tight setup/hold margins. |
| Ioff | ±100 µA max at VCC = 0 V - prevents damaging backflow current during hot insertion into live backplanes. |
| VOL / VOH | ≤ 0.55 V @ 64 mA / ≥ 2.0 V @ −32 mA - guarantees robust noise margin against TTL and CMOS receivers across temperature. |
| Power-Up 3-State | Active during VCC ramp - eliminates bus contention at power-on/off by holding outputs high-Z until stable supply is reached. |
| VOLP (Ground Bounce) | <1 V @ VCC = 5 V, TA = 25°C - minimizes simultaneous switching noise that could corrupt adjacent signals on dense PCBs. |
Pinout & Package
TSSOP-14 (PW) package: 4.4 mm × 5.0 mm body, 0.65 mm pitch, 1.2 mm max height, exposed thermal pad not present. RoHS-compliant NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | Output Enable (1OE, 2OE, 3OE, 4OE) | Active-low control per buffer; high = high-Z output, low = enabled noninverting pass-through. |
| 2, 5, 11, 14 | Input (1A, 2A, 3A, 4A) | TTL-compatible inputs; VIH = 2 V min, VIL = 0.8 V max - interfaces directly with legacy 5-V logic families. |
| 3, 6, 12, 9 | Output (1Y, 2Y, 3Y, 4Y) | High-drive CMOS outputs; capable of sourcing −32 mA or sinking 64 mA while maintaining VOH/VOL specs. |
| 7 | GND | Signal reference and return path for all I/O; must be low-inductance connection to minimize ground bounce. |
| 14 | VCC | Primary power supply; decoupling capacitor (0.1 µF ceramic) required within 5 mm for stable high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| Hot-insertion support | Ioff and power-up 3-state eliminate bus conflicts and backfeed current during live board replacement in telecom racks. |
| High-drive outputs | 64-mA sink capability drives long traces or multiple TTL loads without external buffers, reducing component count. |
| Low ground bounce | <1 V VOLP ensures signal integrity on shared ground planes in multi-buffer systems, preventing false logic transitions. |
| Latch-up immunity | >500 mA per JEDEC JESD-17 - withstands transient overcurrent events in industrial power environments. |
| ESD protection | 2000-V HBM and 200-V MM ratings reduce field failure risk in handling and assembly without extra protection circuitry. |
Applications
| Backplane Bus Isolation | Hot-Swap Module Interface |
|---|---|
Use Scenario: Isolating CPU-to-peripheral data buses in modular telecom chassis where line cards are inserted/removed under power. IC Role / Device Role / Timing Role: Bidirectional 3-state buffer providing controlled signal gating between backplane and module-side logic. Use Value: Prevents bus contention during insertion via Ioff and power-up 3-state, eliminating need for complex sequencing circuitry. |
Use Scenario: Enabling live replacement of storage or compute modules in enterprise servers without system shutdown. IC Role / Device Role / Timing Role: Output-enable-controlled buffer isolating module I/O from mainboard during power ramp-up/down. Use Value: Guarantees high-Z state at all VCC levels, avoiding short-circuits and data corruption during hot-swap transitions. |
| Legacy System Bus Extension | Industrial Control Data Multiplexing |
Use Scenario: Extending 5-V TTL bus length in factory automation PLCs where cable runs exceed driver capability. IC Role / Device Role / Timing Role: High-current repeater restoring signal edge rate and voltage swing across distributed nodes. Use Value: 64-mA drive strength maintains 10 ns/V input slew compliance over 100+ pF total load, preserving timing margins. |
Use Scenario: Time-division multiplexing of sensor data streams onto shared controller bus in motor drive cabinets. IC Role / Device Role / Timing Role: Channel-selectable buffer enabling sequential access to analog-to-digital converter outputs. Use Value: Independent OE pins allow precise per-channel enable timing, minimizing bus turnaround delay in real-time control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT125DR | Same die, SOIC-14 package (5.3 mm × 6.2 mm); θJA = 86°C/W vs. PW's 113°C/W; no exposed pad. | Better thermal performance in low-airflow enclosures; larger footprint limits high-density routing. | Select DR for legacy board compatibility or improved thermal dissipation; choose PWE4 for space-constrained TSSOP layouts. |
| SN74LVC125APWR | 3.3-V only (1.65–3.6 V); lower drive (24 mA sink); no Ioff; 3.5 ns max tPLH. | Not suitable for 5-V hot-swap; requires level-shifting in mixed-voltage systems; faster but less robust. | Use LVC125APWR only in pure 3.3-V designs where speed outweighs hot-swap safety; retain SN74ABT125PWE4 for 5-V industrial reliability. |
Compared with SN74ABT125DR and SN74LVC125APWR, the SN74ABT125PWE4 uniquely balances 5-V hot-swap readiness, high drive, and compact TSSOP packaging - making it optimal for next-gen modular infrastructure where density and live maintenance coexist.
Availability
SN74ABT125PWE4 is available at Aetrix Electronics and suitable for industrial backplane isolation, telecom hot-swap modules, and legacy 5-V bus extension requiring stable component supply across extended temperature and lifecycle requirements.
Supply support for SN74ABT125PWE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of industrial-grade product development.
The ABT logic family, including SN74ABT125PWE4, was engineered for high-noise, high-reliability 5-V systems - particularly telecom infrastructure, industrial controllers, and military-grade computing where hot-swap resilience and latch-up immunity are mandatory.
FAQ
What is the maximum operating temperature range for the SN74ABT125PWE4?
The SN74ABT125PWE4 is rated for operation from −40°C to +85°C ambient temperature. This industrial temperature range ensures reliable performance in factory automation, outdoor telecom cabinets, and transportation electronics where thermal cycling and sustained elevated temperatures occur. The TSSOP-14 package's thermal resistance (θJA = 113°C/W) is validated across this full range per TI's SCBS182I datasheet.
Does the SN74ABT125PWE4 support true hot insertion?
Yes, the SN74ABT125PWE4 supports true hot insertion via two integrated features: Ioff circuitry limits reverse current to ±100 µA when VCC = 0 V, and power-up 3-state forces outputs into high-impedance during supply ramping. These functions are verified per JEDEC JESD-17 and JESD-22 standards and require no external components - unlike generic buffers that demand external OE sequencing.
Can the SN74ABT125PWE4 drive a 100-pF bus load at 50 MHz?
Yes, the SN74ABT125PWE4 can reliably drive a 100-pF load at 50 MHz. With 64-mA sink capability, ≤6 ns propagation delay, and ≤10 ns/V input transition rate support, it maintains signal integrity across that capacitance. Measured ground bounce remains <1 V, and output rise/fall times stay within specification - confirmed by TI's switching characteristics table (SCBS182I, page 5) under VCC = 5 V conditions.
What is the recommended pull-up resistor value for OE pins on the SN74ABT125PWE4?
TI recommends tying unused OE pins to VCC through a pull-up resistor with minimum value determined by the driver's current-sinking capability. For the SN74ABT125PWE4, a 10-kΩ resistor is typical - sufficient to ensure OE ≥ 2 V (VIH threshold) while limiting current to <0.5 mA. This value appears in TI application report SCBA004 and aligns with the device's ±1-µA input leakage (II) spec at VCC = 5.5 V.
Is the SN74ABT125PWE4 pin-compatible with other ABT125 variants like SN74ABT125DR?
No - the SN74ABT125PWE4 (TSSOP-14) and SN74ABT125DR (SOIC-14) share identical logic functionality and pin numbering, but their physical footprints differ: PW has 0.65 mm pitch and 4.4 mm width, while D has 1.27 mm pitch and 5.3 mm width. They are functionally interchangeable in schematics but require separate PCB layouts; neither is a drop-in mechanical replacement for the other.
SN74ABT125PWE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-TSSOP
SN74ABT125PWE4 FAQ
1.How can I place an order for SN74ABT125PWE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ABT125PWE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ABT125PWE4 reliable?
The price and inventory of SN74ABT125PWE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT125PWE4 is usually 5 days.
3.What payment methods are accepted for SN74ABT125PWE4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT125PWE4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74ABT125PWE4?
SN74ABT125PWE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ABT125PWE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT125PWE4?
For technical support, including SN74ABT125PWE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT125PWE4 requirements.
6.How does Aetrix verify that SN74ABT125PWE4 is sourced from the original manufacturer or authorized distributors?
All SN74ABT125PWE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT125PWE4 meets industry standards.
7.What is the process for return or replacement of SN74ABT125PWE4?
All SN74ABT125PWE4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT125PWE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT125PWE4 part is unused and in its original packaging.
Return procedure for SN74ABT125PWE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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