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Texas Instruments SN74ABT125PWRE4

Part No.:
SN74ABT125PWRE4
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
14-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74ABT125PWRE4.pdf
Description:
IC BUFF NON-INVERT 5.5V 14TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,314

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Product details

Overview

SN74ABT125PWRE4 from Texas Instruments is a quadruple bus buffer gate with independent 3-state outputs, designed for high-speed TTL-compatible data routing in industrial and embedded systems. It delivers −32-mA high-drive IOH and 64-mA IOL, supports hot insertion via Ioff and power-up 3-state logic, and operates across −40°C to 85°C at 4.5–5.5 V supply. Its TSSOP-14 package enables dense PCB layouts in memory address/data bus isolation applications.

For engineers reviewing the SN74ABT125PWRE4 datasheet, SN74ABT125PWRE4 pinout, SN74ABT125PWRE4 application, or SN74ABT125PWRE4 equivalent, key selection criteria include output drive strength (−32/64 mA), ground bounce performance (<1 V VOLP), hot-swap capability, thermal resistance (113°C/W), and compatibility with 5-V TTL and CMOS logic families.

Technical Context

The SN74ABT125PWRE4 implements four independent noninverting buffers, each controlled by a dedicated output-enable (OE) input that places the Y output in high-impedance state when driven high. Its ABT logic family uses advanced bipolar transistor design to achieve fast propagation delays (1–6.5 ns) while maintaining robust noise immunity and latch-up resistance (>500 mA per JESD-17).

Power management features include Ioff circuitry that disables outputs during power-down to prevent backflow current, and power-up 3-state logic that holds outputs high-Z during VCC ramp-up. OE must be tied to VCC via a pullup resistor to ensure safe startup behavior in hot-insertion systems.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL/CMOS rails and tolerates ±10% regulation variation.
Output Drive −32 mA IOH / 64 mA IOL - enables direct driving of heavy capacitive loads or multiple downstream inputs without external buffers.
Propagation Delay 1 ns min / 4.9 ns max (A→Y at VCC = 5 V) - supports >100 MHz bus operation with tight timing margins.
Ground Bounce (VOLP) <1 V at VCC = 5 V, TA = 25°C - minimizes signal integrity disruption during simultaneous output switching.
Hot-Insertion Support Ioff and power-up 3-state enabled - prevents damage and bus contention when inserting live cards into backplanes or modular systems.
ESD Protection 2000-V HBM, 200-V MM - exceeds JEDEC JESD22-A114/A and A115-A, enabling robust handling in manufacturing and field service.
Latch-Up Immunity >500 mA per JESD-17 - guarantees survivability under transient overcurrent events in noisy industrial environments.

Pinout & Package

TSSOP-14 (PW) package: 4.4 mm × 5.0 mm body, 0.65 mm lead pitch, 1.2 mm max height, exposed pad optional for thermal enhancement. RoHS-compliant NiPdAu lead finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
1, 4, 10, 13 OE (Output Enable) Active-low control per channel; high = high-Z output, low = enabled buffer path.
2, 5, 11, 14 A (Input) Noninverting data input for corresponding buffer channel (1A–4A).
3, 6, 12, 9 Y (Output) Noninverting buffered output (1Y–4Y); 3-state capable with fast enable/disable transitions.
7 GND Ground reference for all logic and output stages; requires low-inductance connection to minimize noise coupling.
8 VCC Primary 5-V supply rail; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin for stable operation.

Key Features

Feature Design Value
High-Drive Outputs −32 mA IOH / 64 mA IOL enables fanout to ≥10 standard TTL loads or direct interface to unterminated transmission lines.
Hot-Insertion Ready Ioff + power-up 3-state eliminates backfeed current and bus conflicts during live card replacement in telecom and server backplanes.
Low Ground Bounce <1 V VOLP at 5 V ensures minimal crosstalk between channels during parallel data transfers.
Robust ESD/Latch-Up 2000-V HBM ESD rating and >500 mA latch-up immunity meet industrial reliability requirements per IEC 61000-4-2 and JESD-17.
Wide Temp Range −40°C to +85°C operating range supports deployment in uncontrolled industrial enclosures and automotive under-hood auxiliary modules.

Applications

Memory Bus Isolation Backplane Data Routing

Use Scenario: Isolating address/data lines between CPU and SRAM/Flash on shared bus architectures.

IC Role / Device Role / Timing Role: Bidirectional buffer with per-line OE control enables selective memory bank access without bus contention.

Use Value: −32/64 mA drive strength maintains signal integrity across 10+ cm traces; 1–4.9 ns delay preserves setup/hold timing margins.

Use Scenario: Routing parallel data between plug-in modules in modular test equipment or industrial PLC racks.

IC Role / Device Role / Timing Role: Hot-swap-capable bus transceiver ensuring zero bus glitches during module insertion/removal.

Use Value: Ioff and power-up 3-state prevent backfeed and contention; TSSOP-14 footprint saves board space in high-density backplane slots.

Industrial Control I/O Expansion TTL-Level Signal Translation

Use Scenario: Interfacing microcontroller GPIOs to higher-current industrial sensors or actuators requiring 5-V logic levels.

IC Role / Device Role / Timing Role: Level-shifting buffer with strong drive capability, isolating MCU from noisy field-side signals.

Use Value: 64-mA sink current drives LED indicators or optocoupler inputs directly; ground bounce <1 V avoids false triggering.

Use Scenario: Converting between legacy 5-V TTL and modern 5-V CMOS logic families in mixed-voltage subsystems.

IC Role / Device Role / Timing Role: Noninverting voltage-level translator with compatible VIH/VIL thresholds (2.0 V/0.8 V).

Use Value: Guaranteed 2.5 V VOH at −24 mA and 0.55 V VOL at 48 mA ensures reliable logic recognition across both families.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC125APWR Lower drive (−24/24 mA), 1.65–3.6 V supply, CMOS-based, no Ioff or hot-swap support. Suitable only for low-power, single-supply 3.3-V systems; not rated for hot insertion or industrial temperature range. Select when cost, power, or 3.3-V compatibility outweighs drive strength and ruggedness requirements.
SN74AHCT125PWRE4 Same 4.5–5.5 V range and TSSOP-14 package; lower drive (−8/8 mA), no Ioff, higher propagation delay (4–10 ns). Compatible for basic 5-V TTL buffering where hot-swap and high drive are unnecessary. Choose for legacy designs requiring pin-for-pin fit with reduced performance; verify timing margins with slower edges.

Compared with SN74LVC125APWR and SN74AHCT125PWRE4, the SN74ABT125PWRE4 uniquely combines 5-V TTL compatibility, −32/64 mA drive, and certified hot-insertion capability-making it the only option among the three qualified for industrial backplane and memory expansion use cases demanding robustness and speed.

Availability

SN74ABT125PWRE4 is available at Aetrix Electronics and suitable for industrial control I/O expansion, memory bus isolation, and backplane data routing requiring stable component supply, long-term lifecycle support, and guaranteed RoHS compliance.

Supply support for SN74ABT125PWRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of experience delivering high-reliability components for industrial, automotive, and communications markets.

The SN74ABT125PWRE4 belongs to TI's ABT logic family, engineered specifically for high-speed, high-drive 5-V bus interfacing in mission-critical industrial and telecom infrastructure where signal integrity and hot-swap resilience are mandatory.

FAQ

What is the maximum output current rating for SN74ABT125PWRE4?

The SN74ABT125PWRE4 supports −32 mA high-level output current (IOH) and 64 mA low-level output current (IOL) under recommended operating conditions (VCC = 4.5–5.5 V, TA = −40°C to 85°C). These values are specified per output and validated per JEDEC test methods; simultaneous full-load operation across all four channels requires careful thermal design due to θJA = 113°C/W in the TSSOP-14 package.

Does SN74ABT125PWRE4 support hot insertion, and how is it implemented?

Yes, SN74ABT125PWRE4 supports hot insertion via two integrated features: Ioff circuitry disables outputs when VCC = 0 V to prevent damaging current backflow, and power-up 3-state logic forces outputs into high-impedance during VCC ramp-up/down. To ensure reliable operation, OE pins must be pulled up to VCC with a resistor sized per the driver's sink capability-typically 1–10 kΩ depending on system noise and rise time requirements.

What are the absolute maximum ratings for SN74ABT125PWRE4 supply and input voltages?

The absolute maximum ratings for SN74ABT125PWRE4 are: supply voltage VCC = −0.5 V to 7 V; input voltage VI = −0.5 V to 7 V; and output voltage VO = −0.5 V to 5.5 V in high or power-off states. Exceeding these limits-even momentarily-may cause permanent damage. These stress ratings do not imply functional operation; the device is only guaranteed to operate correctly within the recommended ranges (VCC = 4.5–5.5 V, VI = 0–VCC).

How does SN74ABT125PWRE4 handle ground bounce, and what is its typical value?

SN74ABT125PWRE4 is characterized for low ground bounce (VOLP) of <1 V at VCC = 5 V and TA = 25°C, measured under worst-case simultaneous switching conditions. This performance is achieved through optimized internal layout and output stage design, reducing common-ground noise coupling during high-speed parallel data transfers-critical for maintaining signal integrity in memory and bus applications.

What is the thermal resistance (θJA) of SN74ABT125PWRE4 in its TSSOP-14 package?

The junction-to-ambient thermal resistance (θJA) of SN74ABT125PWRE4 in the TSSOP-14 (PW) package is 113°C/W, measured per JESD 51-7 on a standard 4-layer JEDEC test board. This value assumes no thermal pad soldering; adding a copper thermal pad beneath the exposed die pad can reduce θJA significantly-TI recommends minimum 80% solder coverage for optimal thermal performance in high-duty-cycle applications.

SN74ABT125PWRE4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74ABT
Package/Case:
14-TSSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Logic Type:
Buffer, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
32mA, 64mA
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP

SN74ABT125PWRE4 FAQ

1.How can I place an order for SN74ABT125PWRE4 through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74ABT125PWRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74ABT125PWRE4 reliable?

The price and inventory of SN74ABT125PWRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT125PWRE4 is usually 5 days.

3.What payment methods are accepted for SN74ABT125PWRE4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT125PWRE4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74ABT125PWRE4?

SN74ABT125PWRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74ABT125PWRE4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74ABT125PWRE4?

For technical support, including SN74ABT125PWRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT125PWRE4 requirements.

6.How does Aetrix verify that SN74ABT125PWRE4 is sourced from the original manufacturer or authorized distributors?

All SN74ABT125PWRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT125PWRE4 meets industry standards.

7.What is the process for return or replacement of SN74ABT125PWRE4?

All SN74ABT125PWRE4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT125PWRE4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74ABT125PWRE4 part is unused and in its original packaging.

Return procedure for SN74ABT125PWRE4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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