Texas Instruments SN74ABT125PWRG4
- Part No.:
- SN74ABT125PWRG4
- Manufacturer:
- Texas Instruments
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74ABT125PWRG4.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 14TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74ABT125PWRG4 from Texas Instruments is a quadruple bus buffer gate with independent 3-state outputs, designed for high-speed TTL-compatible data routing in industrial and embedded systems. It delivers −32-mA high-level and 64-mA low-level output drive, supports hot insertion via Ioff and power-up 3-state, and operates across −40°C to 85°C with 4.5–5.5-V supply.
For engineers reviewing the SN74ABT125PWRG4 datasheet, SN74ABT125PWRG4 pinout, SN74ABT125PWRG4 application, or SN74ABT125PWRG4 equivalent, key selection criteria include its TSSOP-14 package thermal performance (θJA = 113°C/W), ground-bounce immunity (<1 V VOLP), and latch-up robustness (>500 mA per JESD17).
Technical Context
The SN74ABT125PWRG4 implements four independent noninverting buffers, each controlled by a dedicated output-enable (OE) input that places the Y output in high-impedance when high. Its Ioff circuitry actively disables outputs during power-down to prevent backflow current, while power-up 3-state ensures outputs remain tri-stated during VCC ramp-up and ramp-down.
Each buffer exhibits typical propagation delays of 1–4.9 ns (tPLH/tPHL) and enable/disable times of 1–6.8 ns (tPZH/tPZL/tPHZ/tPLZ) at VCC = 5 V and TA = 25°C. Input transition rate is specified at 10 ns/V, and power-up ramp rate tolerance is 200 μs/V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage | 4.5–5.5 V - Ensures compatibility with 5-V TTL and mixed-voltage logic systems without level-shifting. |
| Output drive | −32 mA IOH / 64 mA IOL - Supports heavy capacitive loads and fan-out to multiple inputs without signal degradation. |
| Propagation delay | 1–4.9 ns - Enables reliable operation in sub-5-ns timing-critical data paths such as address/data buses. |
| Ground bounce (VOLP) | <1 V at VCC = 5 V - Reduces noise coupling into shared ground planes during simultaneous switching. |
| Latch-up immunity | >500 mA per JESD17 - Guarantees robustness against transient overcurrent events in industrial environments. |
| Ioff current | ±100 μA at VCC = 0 - Prevents damaging backfeed current when powered down in live backplane or hot-swap applications. |
| Input capacitance | 3 pF - Minimizes loading on upstream drivers, preserving edge integrity in high-frequency bus interfaces. |
Pinout & Package
TSSOP-14 (PW) package: 4.4 mm × 5.0 mm body, 0.65 mm lead pitch, 1.2 mm max height, exposed pad not present, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | OE (Output Enable) | Active-low control per buffer; high = high-Z output, enabling independent bus isolation. |
| 2, 5, 11, 14 | A (Input) | Noninverting data input for corresponding buffer channel. |
| 3, 6, 12, 9 | Y (Output) | 3-state buffered output; driven high/low when OE low, high-impedance when OE high. |
| 7 | GND | Power return reference for all logic and output stages. |
| 14 | VCC | Positive supply rail (4.5–5.5 V); powers internal logic and output drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Hot-insertion support | Enabled by Ioff and power-up 3-state - allows safe insertion/removal in live backplanes without disrupting system operation. |
| High-drive outputs | −32 mA / 64 mA - drives 50-pF loads with <5 ns delay, eliminating need for external buffer staging. |
| Low ground bounce | <1 V VOLP - maintains signal integrity in dense PCB layouts with shared ground returns. |
| ESD protection | 2000-V HBM / 200-V MM - exceeds JEDEC standards for handling and board-level reliability. |
| Wide operating temperature | −40°C to +85°C - qualified for industrial automation, test equipment, and telecom infrastructure. |
Applications
| Industrial Backplane Interface | Embedded Data Bus Isolation |
|---|---|
|
Use Scenario: Isolating CPU address/data lines from peripheral expansion slots in programmable logic controllers. IC Role / Device Role / Timing Role: Quad noninverting buffer with per-channel 3-state control enables dynamic bus segmenting during hot-plug module insertion. Use Value: Ioff prevents backfeed into powered-down modules; tPZH/tPZL < 7 ns ensures minimal bus arbitration latency. |
Use Scenario: Buffering parallel sensor interface signals between microcontroller GPIO and legacy 5-V peripherals. IC Role / Device Role / Timing Role: Voltage-level compatible driver providing fan-out gain and noise margin enhancement for TTL-signaled sensors. Use Value: 64-mA IOL drives long traces and multiple inputs; VOLP <1 V avoids false triggering in noisy factory-floor environments. |
| Test Equipment Signal Routing | Communications Board Bus Extension |
|
Use Scenario: Multiplexing DUT I/O signals onto shared test instrumentation channels in automated test systems. IC Role / Device Role / Timing Role: Independent OE control allows precise time-gated signal injection or capture without cross-talk. Use Value: Propagation delay variation ≤1.4 ns (tPLH–tPHL) ensures deterministic timing alignment across four channels. |
Use Scenario: Extending ISA or LPC bus segments across multi-board telecom line cards with impedance-matched trace routing. IC Role / Device Role / Timing Role: High-speed bus repeater maintaining signal rise/fall times and DC logic levels across board connectors. Use Value: 113°C/W θJA and 3-pF Ci allow stable operation at 20-MHz sustained toggle rates without thermal throttling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT125DR | SOIC-14 package (θJA = 86°C/W); identical electrical specs and pinout. | Better thermal dissipation in convection-cooled PCBs; larger footprint limits high-density routing. | Select for prototyping or lower-volume production where thermal headroom >27°C/W is required. |
| SN74LVC125APWR | 3.3-V only (1.65–3.6 V); lower drive (−24/24 mA); CMOS input thresholds. | Not interoperable with 5-V TTL buses; requires level translation for mixed-voltage systems. | Choose only for new 3.3-V designs prioritizing lower power and smaller die size over legacy compatibility. |
Compared with SN74ABT125DR and SN74LVC125APWR, the SN74ABT125PWRG4 uniquely balances 5-V TTL compatibility, TSSOP space efficiency, and hot-swap safety-making it optimal for industrial backplane upgrades where footprint and legacy interface preservation are critical.
Availability
SN74ABT125PWRG4 is available at Aetrix Electronics and suitable for industrial backplane interfaces, embedded data bus isolation, and test equipment signal routing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74ABT125PWRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in industrial-grade interface ICs.
The SN74ABT125 product line delivers high-drive, hot-pluggable bus buffers for mission-critical industrial and telecom infrastructure where reliability under voltage transients and thermal stress is non-negotiable.
FAQ
What is the maximum allowable output current for SN74ABT125PWRG4 in the low state?
The SN74ABT125PWRG4 supports up to 64 mA IOL per output in the low state at VCC = 4.5 V, as specified in the recommended operating conditions table. This high sink capability enables direct driving of multiple TTL inputs or moderate capacitive loads without external buffering. Exceeding this limit risks exceeding absolute maximum ratings and may degrade timing or cause thermal stress.
Does SN74ABT125PWRG4 require external pull-up resistors on OE pins?
Yes - to ensure the high-impedance state during power-up and power-down, OE inputs should be tied to VCC through a pull-up resistor. The minimum resistance value depends on the current-sinking capability of the controlling driver; TI recommends calculating based on the OE input leakage (±1 μA) and desired voltage margin. Leaving OE floating violates the recommended operating condition requiring all unused inputs held at VCC or GND.
Is SN74ABT125PWRG4 compatible with 3.3-V logic systems?
No - the SN74ABT125PWRG4 is specified only for 4.5–5.5-V operation and features TTL-compatible input thresholds (VIL = 0.8 V, VIH = 2.0 V). Driving its inputs from 3.3-V CMOS logic may result in marginal or unreliable recognition of high-level signals. For 3.3-V systems, consider the SN74LVC125A family instead.
How does the Ioff feature protect SN74ABT125PWRG4 during hot insertion?
The Ioff circuitry in SN74ABT125PWRG4 actively disables all outputs when VCC = 0 V, limiting current flow to ±100 μA even if input or output pins are biased to 4.5 V. This prevents damaging backflow current from live backplane traces into the unpowered device, satisfying JEDEC hot-insertion requirements and protecting both the SN74ABT125PWRG4 and connected circuitry during live module replacement.
What is the thermal resistance (θJA) of SN74ABT125PWRG4 in its TSSOP-14 package?
The SN74ABT125PWRG4 in the TSSOP-14 (PW) package has a junction-to-ambient thermal resistance (θJA) of 113°C/W, as documented in the absolute maximum ratings table. This value assumes standard JEDEC high-K test board conditions; actual performance in end-equipment depends on PCB copper area, airflow, and nearby heat sources. For thermally constrained layouts, derating or supplemental heatsinking may be necessary above 50 mW total power dissipation.
SN74ABT125PWRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-TSSOP
SN74ABT125PWRG4 FAQ
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Please submit a Request for Quotation (RFQ) for SN74ABT125PWRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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For technical support, including SN74ABT125PWRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT125PWRG4 requirements.
6.How does Aetrix verify that SN74ABT125PWRG4 is sourced from the original manufacturer or authorized distributors?
All SN74ABT125PWRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT125PWRG4 meets industry standards.
7.What is the process for return or replacement of SN74ABT125PWRG4?
All SN74ABT125PWRG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT125PWRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT125PWRG4 part is unused and in its original packaging.
Return procedure for SN74ABT125PWRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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