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Texas Instruments SN74ABT126RGYR
- Part No.:
- SN74ABT126RGYR
- Manufacturer:
- Texas Instruments
- Package:
- 14-VFQFN Exposed Pad
- Datasheet:
-
SN74ABT126RGYR.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 14VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,393
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Product details
Overview
SN74ABT126RGYR from Texas Instruments is a quadruple bus buffer gate with 3-state outputs in a 14-pin VQFN (RGY) package, operating at 4.5–5.5 V, delivering ±32 mA high-drive capability, <7.3 ns propagation delay, and Ioff support for hot insertion. It serves as a level-shifting, bus-isolation, and load-driving component in industrial control backplanes and FPGA I/O expansion interfaces.
For engineers reviewing the SN74ABT126RGYR datasheet, SN74ABT126RGYR pinout, SN74ABT126RGYR application, or SN74ABT126RGYR equivalent, key selection criteria include 3-state output timing (tPZL/tPHZ), thermal performance (θJA = 47°C/W), VQFN-14 land pattern compliance, and compatibility with 5-V TTL logic families in space-constrained PCB layouts.
Technical Context
The SN74ABT126RGYR implements four independent noninverting buffers, each with dedicated output-enable (OE) control. Each channel transitions to high-impedance when its OE input is low, and remains in high-Z during power-up/down when VCC is between 0–2.1 V.
It features active clamp diodes for ESD protection (2000-V HBM), latch-up immunity (>500 mA per JESD 17), and ground-bounce suppression (VOLP < 1 V). The device supports hot-swap operation via Ioff and power-up 3-state behavior, eliminating bus contention during insertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL and CMOS systems without level translation. |
| Output Drive | −32 mA IOH / +64 mA IOL - drives heavy capacitive loads (e.g., >50 pF buses) while maintaining clean signal edges. |
| Propagation Delay | tPLH/tPHL ≤ 7.3 ns @ VCC = 5 V - enables reliable operation in high-speed digital control paths up to ~100 MHz toggle rate. |
| Thermal Resistance | θJA = 47°C/W (RGY package) - allows sustained operation at full drive current in compact industrial enclosures without forced airflow. |
| Ioff Support | ±100 μA max @ VCC = 0 V - prevents backfeeding and enables safe live insertion into powered backplanes. |
| ESD Rating | 2000-V HBM - meets industrial handling requirements without external protection circuitry. |
| Operating Temperature | −40°C to +85°C - qualified for extended temperature deployment in factory automation and outdoor edge nodes. |
Pinout & Package
VQFN-14 (RGY) package: 3.5 mm × 3.5 mm body, 0.5 mm pitch, exposed thermal pad, 1 mm max height. Requires soldering of thermal pad to PCB ground plane for thermal and mechanical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | Output Enable (1OE, 2OE, 3OE, 4OE) | Active-high control inputs - each independently disables its associated buffer output to high-impedance state. |
| 2, 5, 11, 14 | Input (1A, 2A, 3A, 4A) | TTL-compatible inputs - accept 0.8 V/2.0 V thresholds; all unused inputs must be tied to VCC or GND. |
| 3, 6, 12, 9 | Output (1Y, 2Y, 3Y, 4Y) | 3-state buffered outputs - provide noninverted logic with high-current sinking/sourcing capability. |
| 7 | GND | Power ground reference - connects to PCB ground plane; thermal pad must be soldered to same net. |
| 8 | VCC | Positive supply - decoupling capacitor (0.1 μF ceramic) required within 5 mm of pin for noise suppression. |
Key Features
| Feature | Design Value |
|---|---|
| High-Drive Outputs | −32 mA source / +64 mA sink capability enables direct driving of multiple TTL loads or long traces without buffering. |
| Power-Up 3-State | Guaranteed high-impedance state when VCC ∈ [0, 2.1] V - prevents bus contention during system power sequencing. |
| Hot-Insertion Support | Ioff specification (±100 μA) ensures no current flows through inputs/outputs when VCC = 0 - critical for modular backplane designs. |
| Low Ground Bounce | VOLP < 1 V @ 5 V - minimizes simultaneous switching noise on shared ground planes in dense logic arrays. |
| Latch-Up Immunity | Exceeds 500 mA per JESD 17 - eliminates risk of destructive latch-up under transient overvoltage or ESD events. |
Applications
| Industrial Backplane Bus Isolation | FPGA I/O Expansion Interface |
|---|---|
Use Scenario: Isolating legacy 5-V parallel data buses between PLC modules and main controller chassis during hot-swap maintenance. IC Role / Device Role / Timing Role: Quad 3-state buffer providing directional, enable-controlled isolation between upstream and downstream bus segments. Use Value: Prevents bus contention during module insertion/removal and reduces ground bounce-induced timing jitter across 16-bit address/data lines. | Use Scenario: Extending limited FPGA I/O pins to drive off-board peripherals (ADCs, DACs, displays) requiring 5-V logic levels. IC Role / Device Role / Timing Role: Level-translating buffer with precise tPZL/tPHZ timing (<6.5 ns) ensuring setup/hold compliance for synchronous peripheral interfaces. Use Value: Enables reliable 5-V peripheral interfacing without external level shifters while maintaining sub-10 ns signal integrity. |
| Automated Test Equipment (ATE) Signal Routing | Embedded Controller Address/Data Multiplexing |
Use Scenario: Routing test signals between DUT interface cards and pattern generator resources in modular ATE racks. IC Role / Device Role / Timing Role: Bidirectional bus driver controlled by FPGA-configured OE lines to dynamically assign signal paths. Use Value: Supports reconfigurable signal routing architecture with deterministic enable/disable timing and minimal crosstalk. | Use Scenario: Separating multiplexed address/data bus lines (e.g., from microcontroller) to discrete address latches and data buffers. IC Role / Device Role / Timing Role: Noninverting buffer with tight tPLH/tPHL matching (≤0.4 ns skew) preserving timing margins in memory-mapped I/O subsystems. Use Value: Eliminates timing violations caused by trace-length mismatches in high-density embedded PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC126APWR | 3.3-V only supply (1.65–3.6 V); lower drive (−24/+24 mA); 14-pin TSSOP. | Not suitable for 5-V systems; requires level translation if interfacing with legacy 5-V logic. | Select when system operates exclusively at 3.3 V and lower power consumption is prioritized over drive strength. |
| SN74ABT244NSR | Octal configuration (8 channels); same 5-V supply and drive specs; SOP-20 package. | Higher channel count increases PCB footprint and routing complexity for quad-only needs. | Choose when additional buffer channels are required in the same design, avoiding multiple quad devices. |
Compared with SN74LVC126APWR and SN74ABT244NSR, the SN74ABT126RGYR uniquely balances 5-V compatibility, quad-channel density, VQFN thermal efficiency, and hot-swap readiness-making it optimal for space-limited industrial backplanes where 5-V interoperability is mandatory.
Availability
SN74ABT126RGYR is available at Aetrix Electronics and suitable for industrial automation, test equipment, and embedded controller applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74ABT126RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.
The ABT logic family-including SN74ABT126RGYR-is engineered for high-speed, high-drive 5-V TTL-compatible bus interfacing in demanding environments where reliability, noise immunity, and hot-swap capability are essential.
FAQ
What is the recommended PCB layout practice for the thermal pad of SN74ABT126RGYR?
The exposed thermal pad of SN74ABT126RGYR must be soldered to a solid PCB ground plane using an 80% solder paste coverage stencil aperture (3.75 mm × 3.75 mm). Thermal vias (≥4× 0.3 mm diameter, filled or capped) should connect the pad directly to inner-layer ground planes to achieve the specified θJA = 47°C/W and prevent solder voiding during reflow.
Does SN74ABT126RGYR support mixed-voltage operation between input and output sides?
No, SN74ABT126RGYR does not support mixed-voltage operation. It is a single-supply 5-V device: all inputs and outputs operate referenced to the same VCC (4.5–5.5 V) and GND. Input thresholds (VIH = 2.0 V, VIL = 0.8 V) and output levels (VOH ≥ 2.0 V, VOL ≤ 0.55 V) are defined strictly for 5-V TTL compatibility. Level shifting requires external circuitry.
Can unused OE inputs on SN74ABT126RGYR be left floating?
No, unused OE inputs on SN74ABT126RGYR must not be left floating. Per TI's SCBA004 guidance, all unused inputs-including OE pins-must be tied to either VCC or GND to prevent metastability, increased ICC, or unintended output enabling. Pull-down resistors (≤10 kΩ) are recommended for OE pins to ensure default disable state.
What is the maximum capacitive load SN74ABT126RGYR can reliably drive at 50 MHz?
Based on typical tPLH/tPHL = 6.3 ns and output drive (64 mA IOL), SN74ABT126RGYR can reliably drive ≤50 pF total load (including trace + receiver input capacitance) at 50 MHz. For heavier loads, derate frequency or add series termination; measured VOL remains ≤0.55 V up to 64 mA, confirming signal integrity under worst-case loading.
Is SN74ABT126RGYR pin-compatible with other ABT126 variants in different packages?
Yes, SN74ABT126RGYR shares identical pinout (14-pin functional mapping) with SN74ABT126D (SOIC), SN74ABT126DBR (SSOP), and SN74ABT126PWR (TSSOP). Pin numbers 1–14 correspond to 1OE, 1A, 1Y, 2OE, 2A, 2Y, GND, VCC, 4OE, 4A, 4Y, 3OE, 3A, 3Y across all packages-enabling direct footprint interchangeability where board space and thermal constraints allow.
SN74ABT126RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 14-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-VQFN (3.5x3.5)
SN74ABT126RGYR FAQ
1.How can I place an order for SN74ABT126RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ABT126RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ABT126RGYR reliable?
The price and inventory of SN74ABT126RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT126RGYR is usually 5 days.
3.What payment methods are accepted for SN74ABT126RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT126RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74ABT126RGYR?
SN74ABT126RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ABT126RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT126RGYR?
For technical support, including SN74ABT126RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT126RGYR requirements.
6.How does Aetrix verify that SN74ABT126RGYR is sourced from the original manufacturer or authorized distributors?
All SN74ABT126RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT126RGYR meets industry standards.
7.What is the process for return or replacement of SN74ABT126RGYR?
All SN74ABT126RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT126RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT126RGYR part is unused and in its original packaging.
Return procedure for SN74ABT126RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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