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Texas Instruments SN74ABT162244DGGR
- Part No.:
- SN74ABT162244DGGR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74ABT162244DGGR.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 48TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,056
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Product details
Overview
SN74ABT162244DGGR from Texas Instruments is a 16-bit noninverting 3-state buffer/line driver in TSSOP-48 package, designed for high-density memory address, clock, and bus-oriented applications. It features symmetrical active-low OE inputs, 25-Ω integrated series output resistors, ±12 mA drive capability, and hot-insertion support via Ioff and power-up 3-state logic. Used in industrial control backplanes and DDR memory subsystems.
For engineers reviewing the SN74ABT162244DGGR datasheet, SN74ABT162244DGGR pinout, SN74ABT162244DGGR application, or SN74ABT162244DGGR equivalent, this page delivers verified electrical specs, thermal data (θJA = 70°C/W), switching timing (tPLH ≤ 3.9 ns), hot-swap compatibility, and real-world layout guidance for TSSOP-48 footprint implementation.
Technical Context
This device implements four independent 4-bit noninverting buffers with dedicated active-low output-enable (OE) controls per group. Each buffer supports bidirectional signal flow only when enabled, with outputs entering high-impedance state when OE is high. The integrated 25-Ω series resistor per output eliminates external termination components and reduces overshoot/undershoot on transmission lines.
Power sequencing is hardened via Ioff protection (±100 µA at VCC = 0) and power-up 3-state circuitry that forces outputs into high-Z during VCC ramp-up/down. Distributed VCC/GND pins and flow-through pin architecture minimize simultaneous switching noise and optimize PCB routing density in multi-layer bus designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - Ensures stable operation across industrial 5-V supply tolerances without regulation overhead. |
| IOL / IOH | 12 mA sink / −12 mA source - Supports direct driving of TTL/CMOS loads without external buffers in memory address paths. |
| tPLH / tPHL | ≤3.9 ns / ≤4.8 ns at VCC = 5 V - Enables reliable 100+ MHz bus operation with margin for trace skew and loading. |
| IOZPU / IOZPD | ±50 µA - Guarantees low leakage during power transitions, preventing false enable/disable glitches in hot-swap systems. |
| θJA | 70°C/W - Matches TSSOP-48 thermal performance for continuous 16-bit bus buffering in enclosed industrial enclosures. |
| VIK | −1.2 V - Provides robust negative input clamp protection against ESD or crosstalk-induced undershoot on address/control lines. |
| Co / Ci | 8 pF / 3 pF - Low capacitive loading preserves signal integrity on high-speed parallel buses with minimal timing degradation. |
Pinout & Package
TSSOP-48 package (DGG), 12.6 mm × 6.1 mm × 1.2 mm max height, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE–4OE | Active-low output enable | Independent control per 4-bit group; high = high-Z, low = enabled noninverting pass-through. |
| 1A1–4A4 | Input terminals | 16 total data inputs; each tied to corresponding Y output when OE active; CMOS-compatible VIH/VIL thresholds. |
| 1Y1–4Y4 | Output terminals | 16 buffered noninverting outputs; include internal 25-Ω series resistance to damp reflections on PCB traces. |
| VCC (Pins 7, 20, 33, 46) | Supply rail | Distributed power pins reduce IR drop and SSN; must be decoupled locally with 0.1 µF ceramic per VCC pin. |
| GND (Pins 4, 11, 18, 27, 36, 43) | Reference plane | Six ground pins provide low-inductance return path; critical for maintaining <1 V ground bounce (VOLP) at 12 mA switching. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 25-Ω series output resistors | Eliminates need for 16 discrete 25-Ω SMT resistors, reducing BOM count and PCB area in dense memory interface layouts. |
| Ioff protection | Blocks reverse current flow (<±100 µA) when powered down, enabling safe insertion/removal in live backplane systems. |
| Power-up 3-state | Forces all outputs to high-Z during VCC ramp-up, preventing bus contention and latch-up risk before system initialization. |
| Flow-through pin architecture | Input and output pins aligned on opposite sides (e.g., A1–A4 left, Y1–Y4 right), enabling straight PCB trace routing without vias. |
| Distributed VCC/GND | Four VCC and six GND pins placed across package length minimize simultaneous switching noise and improve signal integrity. |
Applications
| Memory Address Buffering | High-Speed Clock Distribution |
|---|---|
|
Use Scenario: Driving 16-bit address bus between microcontroller and SRAM/Flash in industrial PLC modules. IC Role / Device Role / Timing Role: Noninverting buffer with 25-Ω series termination, isolating MCU GPIOs from capacitive bus load while preserving edge rate. Use Value: Eliminates external series resistors and reduces layout complexity; tPLH ≤ 3.9 ns ensures setup/hold compliance at 100 MHz address strobe rates. |
Use Scenario: Fan-out of system clock to multiple peripheral ICs (ADC, DAC, FPGA config) in test equipment. IC Role / Device Role / Timing Role: Low-skew, matched-delay 16-bit clock driver with symmetrical rise/fall characteristics and controlled impedance. Use Value: Integrated 25-Ω resistors suppress ringing on 50-mm clock traces; distributed VCC/GND maintains <100 ps inter-channel skew. |
| Hot-Swappable Backplane Interface | Legacy Bus Signal Conditioning |
|
Use Scenario: Insertion of modular I/O cards into powered industrial backplane with shared 16-bit data/address bus. IC Role / Device Role / Timing Role: Hot-insertion–qualified buffer using Ioff and power-up 3-state to prevent backdrive and bus conflict during card mating. Use Value: ±100 µA Ioff prevents damage to upstream drivers; high-Z default state avoids arbitration failures during card power sequencing. |
Use Scenario: Interfacing modern 3.3-V microcontrollers to legacy 5-V TTL peripherals (e.g., 74LS logic, EPROMs) in retro-computing systems. IC Role / Device Role / Timing Role: Level-shifting buffer with 5-V tolerant inputs and 5-V compliant outputs, supporting mixed-voltage bus domains. Use Value: VIH = 2 V / VIL = 0.8 V ensures reliable recognition of 3.3-V logic levels; 12-mA drive sustains fan-out of 10+ LS loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit noninverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC162244ADGGR | 3.3-V only supply (1.65–3.6 V); lower drive (24 mA), no integrated 25-Ω resistors; higher speed (tPD ≤ 4.2 ns). | Requires external termination; unsuitable for 5-V bus environments; better for low-power portable systems. | Select when operating exclusively at 3.3 V and board space allows discrete termination; avoid for 5-V legacy interfaces. |
| SN74ABT162245DGGR | Bidirectional 16-bit transceiver with direction control (DIR); identical 5-V operation, 25-Ω resistors, and timing. | Used where data flow reverses (e.g., memory read/write multiplexing); adds DIR pin complexity vs. unidirectional OE. | Choose only if bidirectional bus operation is required; otherwise SN74ABT162244DGGR offers simpler control and lower gate count. |
Compared with SN74LVC162244ADGGR and SN74ABT162245DGGR, the SN74ABT162244DGGR uniquely combines 5-V compatibility, integrated termination, and unidirectional simplicity-making it optimal for fixed-direction, noise-sensitive 5-V memory and clock distribution where layout efficiency and hot-swap safety are mandatory.
Availability
SN74ABT162244DGGR is available at Aetrix Electronics and suitable for industrial automation backplanes, DDR memory subsystems, and test equipment clock trees requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74ABT162244DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability interface and bus technologies.
The SN74ABT162244DGGR belongs to TI's Widebus™ family-designed specifically for high-density, high-speed memory addressing, clock distribution, and bus interfacing in industrial, telecom, and computing infrastructure.
FAQ
What is the maximum operating temperature range for the SN74ABT162244DGGR?
The SN74ABT162244DGGR is rated for operation from −40°C to +85°C ambient temperature. This industrial-grade range is validated per TI's recommended operating conditions and supported by thermal characterization (θJA = 70°C/W) in the TSSOP-48 package. Derating is not required within this range when PCB layout follows TI's guidelines for copper pour and decoupling.
Does the SN74ABT162244DGGR require external pull-up resistors on its OE pins?
Yes-the SN74ABT162244DGGR requires external pull-up resistors on all OE pins (1OE–4OE) to ensure high-impedance state during power-up. TI specifies tying OE to VCC through a resistor whose minimum value depends on the driver's current-sinking capability; typical values range from 4.7 kΩ to 10 kΩ for standard 5-V CMOS drivers.
Can the SN74ABT162244DGGR be used in hot-swap applications?
Yes-the SN74ABT162244DGGR is explicitly qualified for hot-insertion use via two mechanisms: Ioff circuitry limits reverse current to ±100 µA when VCC = 0, and power-up 3-state logic forces outputs into high-Z during VCC ramp-up/down. These features are tested and documented in the SCBS238E datasheet under "Hot-Insertion Applications."
What is the purpose of the integrated 25-Ω series resistors in the SN74ABT162244DGGR?
The integrated 25-Ω series resistors in the SN74ABT162244DGGR damp signal reflections on PCB traces, reducing overshoot and undershoot without requiring external components. They are factory-trimmed and matched across all 16 outputs, enabling clean 100+ MHz signal edges on unterminated 50-Ω traces-critical for memory address and clock distribution integrity.
How many independent 4-bit buffer sections does the SN74ABT162244DGGR contain?
The SN74ABT162244DGGR contains four independent 4-bit noninverting buffer sections, each with its own active-low output-enable input (1OE–4OE) and dedicated input/output groups (e.g., 1A1–1A4 → 1Y1–1Y4). This architecture allows flexible partitioning as one 16-bit, two 8-bit, or four 4-bit buffers within a single TSSOP-48 package.
SN74ABT162244DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
SN74ABT162244DGGR FAQ
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT162244DGGR?
For technical support, including SN74ABT162244DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT162244DGGR requirements.
6.How does Aetrix verify that SN74ABT162244DGGR is sourced from the original manufacturer or authorized distributors?
All SN74ABT162244DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT162244DGGR meets industry standards.
7.What is the process for return or replacement of SN74ABT162244DGGR?
All SN74ABT162244DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT162244DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT162244DGGR part is unused and in its original packaging.
Return procedure for SN74ABT162244DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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