Texas Instruments SN74ABT162244DL
- Part No.:
- SN74ABT162244DL
- Manufacturer:
- Texas Instruments
- Package:
- 48-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74ABT162244DL.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 48SSOP
- Quantity:
- Payment:

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Product details
Overview
SN74ABT162244DL from Texas Instruments is a 16-bit noninverting buffer/line driver with four independent 4-bit sections, active-low 3-state outputs, integrated 25-Ω series output resistors, and hot-insertion support via Ioff and power-up 3-state logic. It operates at 4.5–5.5 V, delivers ±12 mA drive strength, and targets high-density memory address, clock, and bus interface applications in industrial control and telecom backplanes.
For engineers reviewing the SN74ABT162244DL datasheet, SN74ABT162244DL pinout, SN74ABT162244DL application, or SN74ABT162244DL equivalent, key selection considerations include its SSOP-48 package, guaranteed 3.9 ns max tPLH/tPHL propagation delay at 5 V, 25-Ω on-die series termination, and Ioff-enabled hot-swap capability - all critical for noise-sensitive, high-speed parallel bus designs.
Technical Context
This device implements a flow-through pin architecture across four identical 4-bit buffer sections, each with symmetrical active-low OE control and noninverting logic. Each output stage integrates a matched 25-Ω series resistor to suppress transmission-line reflections without external components.
Its Ioff circuitry disables outputs when VCC = 0 V (±100 µA leakage), while power-up 3-state ensures high-impedance during supply ramp-up/down. Distributed VCC/GND pins and ground-bounce-limited VOLP (<1 V at 5 V) support stable operation in dense PCB layouts with fast switching transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - compatible with standard 5-V TTL and CMOS systems; no level-shifting required. |
| Output Drive | ±12 mA - sufficient to drive 50-pF loads at ≤4 ns propagation delay; supports terminated and unterminated buses. |
| tPLH / tPHL | 1 ns (min) to 3.9 ns (max) at 5 V - enables >200 MHz bus operation with tight timing margins. |
| Integrated Series Resistor | 25 Ω - eliminates need for external source-series termination resistors, reducing BOM count and layout area. |
| Ioff Leakage | ±100 µA at VCC = 0 V - prevents backflow current during hot insertion, protecting upstream drivers and system integrity. |
| Power-Up 3-State | Active during VCC ramp (0–2.1 V) - avoids bus contention at power-on/off, eliminating external pull-up requirements on OE. |
| VOH / VOL | 3.1 V min VOH at −3 mA; 0.65 V max VOL at 8 mA - meets TTL-compatible voltage thresholds for robust noise margin. |
Pinout & Package
SN74ABT162244DL uses a 48-pin Shrink Small-Outline Package (SSOP-DL), 12.6 mm × 6.1 mm body, 0.5 mm pitch, 1.2 mm max height, JEDEC MO-153 compliant. Pin 1 marked with corner chamfer; gage plane defined per TI drawing DGG0048A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low output-enable control inputs | Each enables/disables one 4-bit buffer section; tied high via pull-up for default high-Z during power sequencing. |
| 1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4 | Noninverting data inputs | Four groups of four inputs feeding respective buffer sections; flow-through layout minimizes trace crossovers. |
| 1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4 | Noninverting buffered outputs | Each output includes internal 25-Ω series resistor; capable of sourcing/sinking ±12 mA into 50-pF load. |
| VCC (Pins 7, 20, 33, 46) | Supply voltage connections | Distributed VCC pins reduce simultaneous switching noise and improve PSRR across 16-bit bus. |
| GND (Pins 4, 11, 23, 30, 37, 44) | Ground return connections | Six GND pins provide low-inductance return paths; minimize ground bounce (VOLP <1 V) under full switching. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 25-Ω series output resistors | Eliminates six to eight external resistors per device, reducing PCB area and assembly cost in multi-bit bus interfaces. |
| Flow-through pin architecture | Input-to-output signal path runs linearly left-to-right per section, enabling straight trace routing and minimizing layer transitions. |
| Ioff and power-up 3-state | Enables true hot-plug capability in modular backplane systems without risk of bus contention or latch-up (exceeds JESD-17: >500 mA). |
| Distributed VCC and GND pins | Reduces peak ground bounce by >30% vs. single-supply-pin alternatives, verified by typical VOLP <1 V at 5 V, 25°C. |
| Widebus™ family compatibility | Pin- and function-compatible with other TI Widebus devices (e.g., SN74ABT162245), simplifying design reuse across buffer/transceiver variants. |
Applications
| Memory Address Buffering | Clock Distribution |
|---|---|
|
Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus. IC Role / Device Role / Timing Role: Noninverting 16-bit buffer with 3-state control, isolating address bus segments during chip-select arbitration. Use Value: Integrated 25-Ω resistors suppress ringing on long traces; flow-through pinout allows direct fanout without vias or stubs. |
Use Scenario: Distributing a single system clock to multiple synchronous peripherals (e.g., ADCs, DACs, FPGAs) with matched skew. IC Role / Device Role / Timing Role: Low-skew, high-drive clock buffer with symmetrical enable control per 4-bit group. Use Value: 3.9 ns max propagation delay and <1 V ground bounce ensure setup/hold compliance across 16 destinations at 100+ MHz. |
| Hot-Swappable Backplane Interface | Legacy Bus Transceiver Support |
|
Use Scenario: Enabling live insertion/removal of line cards in telecom or industrial chassis with shared parallel control/data buses. IC Role / Device Role / Timing Role: Hot-insertion–qualified buffer using Ioff and power-up 3-state to prevent backfeed and contention. Use Value: ±100 µA Ioff leakage at VCC = 0 V and automatic high-Z during power ramp eliminate need for complex sequencing circuits. |
Use Scenario: Interfacing modern microcontrollers to legacy ISA, PC/104, or proprietary 16-bit parallel peripheral buses. IC Role / Device Role / Timing Role: Level-translating, high-current buffer supporting TTL-compatible input thresholds and 12-mA drive into capacitive loads. Use Value: VOH ≥3.1 V at −3 mA and VOL ≤0.65 V at 8 mA guarantee reliable logic-level recognition across aging or marginal receivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit noninverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT162244DGGR | TSSOP-48 package (5.1 mm × 6.2 mm); 1.2 mm max height; same electrical specs and pinout as SN74ABT162244DL. | Better suited for space-constrained boards requiring lower profile and higher density; thermal resistance θJA = 70°C/W vs. DL's 63°C/W. | Select DGGR for compact, high-layer-count PCBs where SSOP height clearance is limited; verify reflow profile for TSSOP. |
| SN74ABT162245DL | Bus transceiver (direction-controlled) vs. buffer; includes DIR input; otherwise identical pinout, timing, and drive strength. | Required when bidirectional data flow (e.g., memory data bus) is needed instead of unidirectional buffering. | Choose SN74ABT162245DL only if direction control is essential; not a drop-in replacement due to functional difference in DIR vs. OE logic. |
Compared with SN74ABT162244DGGR, the SN74ABT162244DL offers superior thermal performance (63°C/W vs. 70°C/W) in board-edge or airflow-limited environments, while SN74ABT162245DL adds bidirectional capability at the cost of losing dedicated OE-per-section control - making it unsuitable for independent 4-bit gating.
Availability
SN74ABT162244DL is available at Aetrix Electronics and suitable for industrial control panels, telecom backplane interfaces, and legacy bus expansion systems requiring stable component supply, long-term obsolescence management, and RoHS-compliant production support.
Supply support for SN74ABT162244DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader founded in 1930, specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.
The SN74ABT162244DL belongs to TI's Widebus™ family of high-speed, low-noise bus interface ICs, engineered specifically for dense, high-reliability parallel bus systems in mission-critical infrastructure equipment.
FAQ
What is the maximum operating temperature range for the SN74ABT162244DL?
The SN74ABT162244DL is rated for operation from −40°C to +85°C ambient temperature. This industrial-grade range is validated per TI's recommended operating conditions and supported by thermal data showing θJA = 63°C/W for the SSOP-DL package, ensuring reliable performance in enclosed control cabinets and base station environments.
Does the SN74ABT162244DL require external series resistors on its outputs?
No, the SN74ABT162244DL does not require external series resistors. Each output integrates an equivalent 25-Ω series resistor to dampen overshoot and undershoot on transmission lines - a key feature confirmed in the datasheet's "Members of the Texas Instruments Widebus Family" header and electrical characteristics table.
How does the SN74ABT162244DL support hot insertion?
The SN74ABT162244DL supports hot insertion through two complementary features: Ioff circuitry limits current backflow to ±100 µA when VCC = 0 V, and power-up 3-state forces outputs into high-impedance during supply ramp-up/down. Both mechanisms are explicitly documented in the "description/ordering information" and "FUNCTION TABLE" sections of the SCBS238E datasheet.
What is the pin count and package type of the SN74ABT162244DL?
The SN74ABT162244DL uses a 48-pin Shrink Small-Outline Package (SSOP-DL) with 0.5 mm pitch, 12.6 mm × 6.1 mm body size, and 1.2 mm maximum height. This mechanical outline is defined in TI's DGG0048A drawing and confirmed in the "PACKAGE OPTION ADDENDUM" as "SSOP (DL) | 48".
Can the SN74ABT162244DL be used as a single 16-bit buffer or split into smaller groups?
Yes, the SN74ABT162244DL can be configured flexibly: as one 16-bit buffer (all OEs tied), two 8-bit buffers (1OE+2OE and 3OE+4OE grouped), or four independent 4-bit buffers (each OE controlling its own section). This configurability is stated verbatim in the "description/ordering information" section: "These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer."
SN74ABT162244DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 48-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-SSOP
SN74ABT162244DL FAQ
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6.How does Aetrix verify that SN74ABT162244DL is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74ABT162244DL?
All SN74ABT162244DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT162244DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT162244DL part is unused and in its original packaging.
Return procedure for SN74ABT162244DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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