Texas Instruments SN74ABT16240ADGVR
- Part No.:
- SN74ABT16240ADGVR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74ABT16240ADGVR.pdf
- Description:
- IC BUFFER INVERT 5.5V 48TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74ABT16240ADGVR from Texas Instruments is a 16-bit inverting buffer/driver with 3-state outputs, designed for high-density memory address, clock, and bus driver applications. It features symmetrical active-low output-enable (OE) inputs, high-drive capability (–32 mA IOH / 64 mA IOL), distributed VCC/GND pinning to suppress switching noise, and operates over –40°C to 85°C.
For engineers reviewing the SN74ABT16240ADGVR datasheet, SN74ABT16240ADGVR pinout, SN74ABT16240ADGVR application, or SN74ABT16240ADGVR equivalent, this device is selected for high-speed 5-V TTL-compatible bus interfacing where ground bounce control (<1 V VOLP), flow-through PCB layout optimization, and latch-up immunity (>500 mA per JESD17) are critical.
Technical Context
This device implements four independent 4-bit inverting buffers, each with dedicated active-low OE control (1OE–4OE). Its EPIC-IIB BiCMOS architecture enables low power dissipation while maintaining TTL-level input thresholds (VIH = 2 V, VIL = 0.8 V) and robust output drive under 5-V supply.
Signal integrity is enhanced via distributed power/ground pins and flow-through pinout-inputs on one side (e.g., 1A1–1A4), outputs on the opposite (e.g., 1Y1–1Y4), minimizing trace crossovers. The 3-state outputs support bidirectional bus contention management with fast enable/disable times (tPZH/tPLZ ≤ 4.3 ns typical at 5 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL systems and margin against rail droop. |
| Output Drive | –32 mA IOH / +64 mA IOL - supports heavy capacitive loads and fan-out to multiple TTL inputs without external buffering. |
| Propagation Delay | tPLH/tPHL ≤ 4.8 ns (max) - enables reliable operation in >100-MHz bus cycles with CL = 50 pF. |
| Ground Bounce | VOLP < 1 V at VCC = 5 V, TA = 25°C - reduces signal corruption during simultaneous output switching. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded and computing applications. |
| Latch-Up Immunity | >500 mA per JESD17 - prevents destructive latch-up under transient overcurrent conditions. |
| ESD Protection | >2000 V HBM, >200 V MM - enhances handling robustness and board-level reliability. |
Pinout & Package
SN74ABT16240ADGVR uses a 48-pin TVSOP (DGV) package: 6.2 mm × 12.4 mm body, 0.4 mm pitch, 1.2 mm max height, lead-free NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4 | Input terminals (4 groups × 4 bits) | Accept TTL-level logic signals; each group drives corresponding Y outputs with inversion. |
| 1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4 | Inverting buffered outputs (4 groups × 4 bits) | Provide high-current, 3-state outputs; driven only when respective OE is low. |
| 1OE–4OE | Active-low output-enable controls | Independently disable each 4-bit section; tie to VCC via pull-up for power-up high-Z safety. |
| VCC (pins 7, 18, 28, 39) | Distributed power supply connections | Minimizes IR drop and high-frequency noise by placing VCC near output clusters. |
| GND (pins 4, 10, 15, 21, 27, 32, 42, 45) | Distributed ground connections | Reduces ground bounce and improves return path integrity for fast-switching outputs. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Input and output pins arranged on opposite sides of package to eliminate layer jumps and reduce PCB routing complexity. |
| Distributed VCC/GND pinning | Eight dedicated power/ground pins placed adjacent to output banks to suppress simultaneous switching noise (SSN). |
| High-drive 3-state outputs | –32 mA high-level / +64 mA low-level drive sustains signal integrity across long traces or multi-load buses. |
| EPIC-IIB BiCMOS process | Combines bipolar speed and CMOS density to achieve sub-5-ns propagation delay with low static current (ICC ≤ 3 mA disabled). |
| Power-up 3-state default | OE pins internally weak-pull-down; tying OE to VCC via external resistor ensures high-Z state during power ramp. |
Applications
| Memory Address Buffering | System Clock Distribution |
|---|---|
|
Use Scenario: Driving 16-bit address lines from a microcontroller to SRAM or Flash memory in space-constrained industrial controllers. IC Role / Device Role / Timing Role: Inverting buffer with 3-state control isolates address bus during memory access arbitration. Use Value: High drive strength ensures full-rail logic levels across 10-cm PCB traces; flow-through pinout simplifies layer stackup. |
Use Scenario: Distributing a 25-MHz system clock to multiple peripherals (UART, SPI, ADC) in an FPGA-based data acquisition module. IC Role / Device Role / Timing Role: Low-skew, high-fanout clock driver with controlled edge rates (10 ns/V input transition limit). Use Value: Distributed VCC/GND pins reduce jitter induced by simultaneous clock-edge switching across all 16 outputs. |
| Backplane Bus Transceiver Interface | Legacy ISA Bus Expansion |
|
Use Scenario: Interfacing a modern ARM SoC to a legacy parallel backplane carrying control/status signals across 30 cm. IC Role / Device Role / Timing Role: Bidirectional bus buffer enabling SoC to drive or sample backplane lines using OE-controlled 3-state isolation. Use Value: –32/+64 mA drive compensates for backplane capacitance up to 150 pF; latch-up immunity prevents failure during hot-plug events. |
Use Scenario: Replacing obsolete 74F240 in retro-computing hardware restoration projects requiring ISA slot expansion. IC Role / Device Role / Timing Role: Pin-compatible TTL-buffer upgrade delivering identical logic function with improved noise margin and thermal performance. Use Value: 0.4-mm pitch TVSOP fits existing footprint adapters; 85°C rating exceeds original F-series spec for stable long-term operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit inverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT16244ADGVR | Non-inverting output polarity; otherwise identical pinout, drive, and timing specs. | Suitable where bus directionality requires non-inverted signal pass-through (e.g., data latching without complementation). | Select SN74ABT16244ADGVR when logic inversion must be avoided; verify upstream/downstream polarity alignment. |
| SN74LVC16244ADGVR | 3.3-V only operation (1.65–3.6 V); lower drive (–24/+24 mA); higher speed (tPD ≤ 4.2 ns); no 5-V tolerance on inputs. | Used in mixed-voltage systems where 3.3-V core logic interfaces to 5-V peripherals via level-shifting. | Choose SN74LVC16244ADGVR for 3.3-V domains; avoid in pure 5-V systems due to input overvoltage risk. |
Compared with SN74ABT16240ADGVR, SN74ABT16244ADGVR preserves timing and drive but removes inversion-critical for data-path integrity-while SN74LVC16244ADGVR trades 5-V compatibility for lower voltage operation and reduced power, necessitating careful I/O voltage domain planning.
Availability
SN74ABT16240ADGVR is available at Aetrix Electronics and suitable for industrial control systems, test equipment, and legacy bus interface designs requiring stable component supply, long-lifecycle support, and guaranteed 5-V TTL interoperability.
Supply support for SN74ABT16240ADGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with decades of industrial-grade reliability validation.
SN74ABT16240ADGVR belongs to the Widebus™ family of high-speed, low-noise bus interface ICs engineered for dense memory addressing, clock distribution, and backplane driving in mission-critical industrial and computing platforms.
FAQ
What is the recommended power-up sequence for SN74ABT16240ADGVR to ensure 3-state safety?
TI specifies that OE pins should be tied to VCC through a pull-up resistor during power-up to guarantee high-impedance outputs before internal logic stabilizes. For SN74ABT16240ADGVR, a 10-kΩ resistor suffices given its OE input leakage (±1 µA), preventing bus contention during rail ramp. This applies regardless of VCC slew rate or sequencing order.
Can SN74ABT16240ADGVR drive a 100-pF load at 50 MHz without signal degradation?
Yes-SN74ABT16240ADGVR maintains <4.8 ns propagation delay with CL = 50 pF, and its +64 mA IOL ensures fast edge rates into 100-pF loads. Measured VOLP remains <1 V, confirming minimal ground bounce. For 50-MHz square waves, rise/fall times stay within 3 ns, preserving signal integrity on properly terminated traces.
Does SN74ABT16240ADGVR support hot-swap operation on a live 5-V bus?
SN74ABT16240ADGVR is not hot-swap rated. While it features >500 mA latch-up immunity and >2000 V HBM ESD protection, its absolute maximum ratings do not cover powered insertion. Voltage transients during mating can exceed –0.5 V to 5.5 V output limits. Use discrete hot-swap controllers or series current-limiting resistors if live insertion is required.
How does the distributed VCC/GND pinning in SN74ABT16240ADGVR reduce switching noise compared to conventional layouts?
SN74ABT16240ADGVR places VCC and GND pins adjacent to each 4-bit output cluster (e.g., pins 7/VCC near 1Y1–1Y4), shortening high-frequency return paths. This cuts loop inductance by ~40% versus single-end power routing, directly lowering di/dt-induced noise (V = L·di/dt) and measured VOLP to <1 V-critical for clean 16-bit parallel bus operation.
Is SN74ABT16240ADGVR pin-compatible with older 74ABT240 variants in TVSOP packages?
Yes-SN74ABT16240ADGVR shares identical 48-pin TVSOP (DGV) mechanical dimensions, pad layout, and pin mapping with SN74ABT240 variants. The '16' prefix denotes 16-bit (vs. octal '240'), but both use the same DGV package drawing, land pattern, and thermal profile-enabling drop-in replacement in upgraded density designs.
SN74ABT16240ADGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 48-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TVSOP
SN74ABT16240ADGVR FAQ
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6.How does Aetrix verify that SN74ABT16240ADGVR is sourced from the original manufacturer or authorized distributors?
All SN74ABT16240ADGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT16240ADGVR meets industry standards.
7.What is the process for return or replacement of SN74ABT16240ADGVR?
All SN74ABT16240ADGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT16240ADGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT16240ADGVR part is unused and in its original packaging.
Return procedure for SN74ABT16240ADGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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