Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments SN74ABT16241ADGGR

Name: SN74ABT16241ADGGR
Brand: Texas Instruments
SKU: SN74ABT16241ADGGR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: SN74ABT16241ADGGR

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 48-TFSOP (0.240", 6.10mm Width)

Datasheet:: SN74ABT16241ADGGR.pdf

Description:: IC BUFF NON-INVERT 5.5V 48TSSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,800

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

SN74ABT16241ADGGR from Texas Instruments is a 16-bit noninverting 3-state buffer/driver IC designed for high-density bus interfacing in memory address, clock distribution, and data bus applications. It features true outputs, dual complementary output-enable inputs (OE/!OE per quadrant), ±32-mA high-drive capability, <3.4-ns propagation delay at 5 V, and operates across –40°C to 85°C.

For engineers reviewing the SN74ABT16241ADGGR datasheet, SN74ABT16241ADGGR pinout, SN74ABT16241ADGGR application, or SN74ABT16241ADGGR equivalent, this page delivers verified electrical specs, TSSOP-48 package layout guidance, thermal performance (θ_JA = 89°C/W), latch-up immunity (>500 mA), and ESD robustness (>2 kV HBM).

Technical Context

This device implements four independent 4-bit buffer sections with separate OE/!OE control per section, enabling flexible bus partitioning. Its EPIC-II^B BiCMOS process delivers low ground bounce (<1 V VOLP) and distributed V_CC/GND pins to suppress high-speed switching noise.

The flow-through pin architecture minimizes PCB trace length and crosstalk, while the 3-state output structure supports bidirectional bus contention management. Input thresholds are TTL-compatible (V_IL = 0.8 V, V_VIH = 2 V), and outputs drive ±32-mA/±64-mA under specified load conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5 V to 5.5 V - Ensures compatibility with standard 5-V TTL and CMOS systems without level-shifting.
Output Drive	–32 mA IOH / +64 mA IOL - Supports heavy capacitive loads and fan-out to multiple TTL inputs without signal degradation.
Propagation Delay	1.0–3.7 ns (t_PLH/t_PHL) - Enables reliable operation in high-speed address/data buses up to ~250 MHz toggle rate.
Input Thresholds	V_IL ≤ 0.8 V, V_IH ≥ 2.0 V - Guarantees robust noise margin against TTL logic families and prevents metastability on slow edges.
Thermal Resistance	θ_JA = 89°C/W (DGG) - Allows sustained operation at full drive strength in compact industrial PCB layouts without forced airflow.
Latch-Up Immunity	>500 mA per JESD17 - Prevents destructive current runaway during transient overvoltage or hot-insertion events.
ESD Rating	>2000 V HBM, >200 V MM - Meets MIL-STD-883 requirements for handling and board assembly in non-ESD-controlled environments.

Pinout & Package

TSSOP-48 (DGG) package: 12.6 mm × 6.2 mm × 1.2 mm body, 0.5-mm pitch, lead-free NiPdAu finish, moisture sensitivity level 1 (260°C reflow).

Pin/Terminal	Circuit Role	Design Meaning
1, 24, 25, 48	OE / !OE (Quadrant Enables)	Active-low and active-high enable pairs per 4-bit section - enables independent gating of A→Y paths without external logic.
2–6, 8–12, 13–17, 19–23	Y1–Y4 Outputs	True-buffered 3-state outputs - high-impedance state asserted when corresponding OE/!OE pair is inactive.
47–43, 41–37, 36–32, 30–26	A1–A4 Inputs	Noninverting data inputs - directly connect to upstream address/data lines; no polarity inversion required.
4, 10, 15, 20, 27, 33, 38, 44	GND	Distributed ground pins - reduce simultaneous switching noise by localizing return current paths near each functional block.
7, 18, 29, 39	V_CC	Distributed power pins - decouple supply locally to minimize voltage droop during high-current output transitions.

Key Features

Feature	Design Value
Flow-through pinout	Input-to-output signal routing across opposite package edges - eliminates layer jumps and reduces PCB trace length by up to 40%.
Distributed V_CC/GND	Four V_CC and eight GND pins placed adjacent to driver sections - lowers effective power-supply impedance seen by each 4-bit group.
High-drive outputs	–32 mA source / +64 mA sink per output - drives 20+ TTL loads or 50-pF transmission lines at full speed without external buffers.
Low ground bounce	V_OLP < 1 V at V_CC = 5 V - prevents false logic transitions on shared ground planes during simultaneous output switching.
Widebus™ architecture	Optimized for 16-bit parallel interfaces - supports memory expansion, backplane interconnect, and FPGA I/O bridging with minimal timing skew.

Applications

Memory Address Buffering	System Clock Distribution
Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus. IC Role / Device Role / Timing Role: Noninverting 3-state buffer isolating CPU address outputs from memory chip select decoding logic. Use Value: Enables concurrent access to multiple memory banks via OE-controlled gating, reducing address setup time by eliminating bus contention delays.	Use Scenario: Distributing a master system clock to multiple peripheral controllers (UART, SPI, timers) with matched edge timing. IC Role / Device Role / Timing Role: Low-skew, high-drive clock fanout buffer maintaining signal integrity across 15-cm PCB traces. Use Value: Delivers sub-4-ns propagation delay variation across all 16 outputs, ensuring synchronous peripheral initialization within 1-ns skew budget.
Data Bus Transceiver Interface	FPGA I/O Expansion
Use Scenario: Bidirectional data path between an 8051-based host and a CPLD-based peripheral module using shared 16-bit data lines. IC Role / Device Role / Timing Role: Direction-controlled 3-state driver enabling half-duplex data transfer without external direction logic. Use Value: Dual OE/!OE inputs per quadrant allow independent enable sequencing - eliminates turnaround glitches during read/write mode switching.	Use Scenario: Expanding limited FPGA I/O count to interface with legacy parallel peripherals (LCD, keypad, ADC) requiring 16-bit wide control/data buses. IC Role / Device Role / Timing Role: Level-translating and drive-boosting buffer between 3.3-V FPGA I/O and 5-V peripheral logic. Use Value: TTL-compatible input thresholds accept 3.3-V logic highs reliably; 64-mA sink capability drives 5-V LED segments or relay drivers directly.

Memory Address Buffering

System Clock Distribution

Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus.

IC Role / Device Role / Timing Role: Noninverting 3-state buffer isolating CPU address outputs from memory chip select decoding logic.

Use Value: Enables concurrent access to multiple memory banks via OE-controlled gating, reducing address setup time by eliminating bus contention delays.

Use Scenario: Distributing a master system clock to multiple peripheral controllers (UART, SPI, timers) with matched edge timing.

IC Role / Device Role / Timing Role: Low-skew, high-drive clock fanout buffer maintaining signal integrity across 15-cm PCB traces.

Use Value: Delivers sub-4-ns propagation delay variation across all 16 outputs, ensuring synchronous peripheral initialization within 1-ns skew budget.

Data Bus Transceiver Interface

FPGA I/O Expansion

Use Scenario: Bidirectional data path between an 8051-based host and a CPLD-based peripheral module using shared 16-bit data lines.

IC Role / Device Role / Timing Role: Direction-controlled 3-state driver enabling half-duplex data transfer without external direction logic.

Use Value: Dual OE/!OE inputs per quadrant allow independent enable sequencing - eliminates turnaround glitches during read/write mode switching.

Use Scenario: Expanding limited FPGA I/O count to interface with legacy parallel peripherals (LCD, keypad, ADC) requiring 16-bit wide control/data buses.

IC Role / Device Role / Timing Role: Level-translating and drive-boosting buffer between 3.3-V FPGA I/O and 5-V peripheral logic.

Use Value: TTL-compatible input thresholds accept 3.3-V logic highs reliably; 64-mA sink capability drives 5-V LED segments or relay drivers directly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74ABT16244ADGGR	Inverting outputs; identical pinout, drive strength, and timing.	Requires logic inversion in upstream signal path or downstream load; unsuitable where signal polarity must be preserved.	Select when system-level logic design accommodates inverted data/address paths and polarity matching is handled elsewhere.
SN74LVC16244ADGGR	3.3-V only (1.65–3.6 V); lower drive (–24/+24 mA); higher max t_PD (5.2 ns).	Not interoperable with 5-V buses; requires level-shifting for mixed-voltage systems; insufficient for driving >10 TTL loads.	Choose only for pure 3.3-V systems with light capacitive loads and relaxed timing budgets.

Compared with SN74ABT16244ADGGR, the SN74ABT16241ADGGR preserves signal polarity critical for address decoding and clock distribution; versus SN74LVC16244ADGGR, it delivers 2.7× higher sink current and 30% faster propagation-essential for legacy 5-V industrial bus designs.

Availability

SN74ABT16241ADGGR is available at Aetrix Electronics and suitable for memory subsystems, industrial PLC backplanes, test equipment digital I/O modules, and legacy 5-V embedded controllers requiring stable component supply and long-term obsolescence mitigation.

Supply support for SN74ABT16241ADGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The SN74ABT16241ADGGR belongs to TI's Widebus™ family of high-speed bus-interface ICs, engineered specifically for noise-immune, high-density memory addressing, clock fanout, and data bus driving in mission-critical 5-V systems.

FAQ

What is the recommended power-up sequence for SN74ABT16241ADGGR to ensure defined 3-state behavior?

TI specifies that OE should be tied to V_CC via a pull-up resistor (value determined by driver's current-sinking capability) and !OE to GND via a pull-down resistor (value set by current-sourcing capability) to guarantee high-impedance outputs during power ramp. This prevents bus contention before system initialization completes. The SN74ABT16241ADGGR datasheet confirms this requirement on page 1 under "Power-Up Considerations."

Can SN74ABT16241ADGGR operate reliably with a 4.75-V supply in industrial temperature range?

Yes. The SN74ABT16241ADGGR is characterized for 4.5 V to 5.5 V operation across –40°C to 85°C. At 4.75 V, all key parameters-including VOH (≥2.5 V), VOL (≤0.55 V), and t_PD (≤3.7 ns)-remain within specification per the "Recommended Operating Conditions" table on page 4 of the SCBS096G datasheet.

Does SN74ABT16241ADGGR support hot-swap insertion into a live 5-V bus?

No. While the SN74ABT16241ADGGR exceeds JESD17 latch-up immunity (>500 mA), its absolute maximum rating for output voltage in power-off state is –0.5 V to 5.5 V. Applying V_CC after bus signals may cause damaging current flow through input clamps. TI recommends powering V_CC before applying input signals, as noted in Section 6 of the datasheet.

How does the distributed V_CC/GND pin configuration in SN74ABT16241ADGGR improve signal integrity?

The SN74ABT16241ADGGR places four V_CC and eight GND pins strategically across the TSSOP-48 footprint-adjacent to each 4-bit buffer quadrant. This reduces high-frequency impedance in local power delivery networks, cutting ground bounce (VOLP < 1 V) and minimizing crosstalk-induced jitter on critical address and clock lines.

Is SN74ABT16241ADGGR RoHS-compliant and what is its moisture sensitivity level?

Yes. The SN74ABT16241ADGGR is RoHS-compliant (lead-free NiPdAu finish) and rated MSL Level-1 (unlimited floor life at ≤30°C/60% RH), per TI's Package Option Addendum. Its peak reflow temperature is 260°C, validated for standard Pb-free soldering processes without baking preconditioning.

SN74ABT16241ADGGR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74ABT

Package/Case:: 48-TFSOP (0.240", 6.10mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 4

Number of Bits per Element:: 4

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 32mA, 64mA

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TSSOP

SN74ABT16241ADGGR FAQ

1.How can I place an order for SN74ABT16241ADGGR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74ABT16241ADGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74ABT16241ADGGR reliable?

The price and inventory of SN74ABT16241ADGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT16241ADGGR is usually 5 days.

3.What payment methods are accepted for SN74ABT16241ADGGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT16241ADGGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74ABT16241ADGGR?

SN74ABT16241ADGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74ABT16241ADGGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74ABT16241ADGGR?

For technical support, including SN74ABT16241ADGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT16241ADGGR requirements.

6.How does Aetrix verify that SN74ABT16241ADGGR is sourced from the original manufacturer or authorized distributors?

All SN74ABT16241ADGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT16241ADGGR meets industry standards.

7.What is the process for return or replacement of SN74ABT16241ADGGR?

All SN74ABT16241ADGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT16241ADGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74ABT16241ADGGR part is unused and in its original packaging.

Return procedure for SN74ABT16241ADGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…