Texas Instruments SN74ABT16241ADLR

Overview

SN74ABT16241ADLR from Texas Instruments is a 16-bit noninverting buffer/driver with 3-state outputs, designed for high-density bus interfacing in memory address, clock distribution, and data bus applications. It operates from 4.5 V to 5.5 V, delivers ±32 mA/±64 mA output drive, features flow-through pinout, distributed power/ground pins, and supports –40°C to 85°C industrial temperature range.

For engineers reviewing the SN74ABT16241ADLR datasheet, SN74ABT16241ADLR pinout, SN74ABT16241ADLR application, or SN74ABT16241ADLR equivalent, key selection considerations include its 48-pin SSOP (DL) package, true-output architecture with dual OE inputs per quadrant, low ground bounce (<1 V), and compatibility with 5-V TTL/CMOS systems requiring high-drive 3-state buffering.

Technical Context

This device implements four independent 4-bit buffer sections (1A–1Y, 2A–2Y, 3A–3Y, 4A–4Y), each with complementary enable inputs (e.g., 1OE and 1OE). Its EPIC-II^B BiCMOS process enables high-speed switching while minimizing power dissipation and noise.

The flow-through architecture aligns inputs and outputs on opposite sides of the 48-pin SSOP package, simplifying PCB routing. Distributed V_CC/GND pins reduce simultaneous switching noise, and latch-up performance exceeds 500 mA per JESD17.

Key Specifications

Pinout & Package

SN74ABT16241ADLR uses a 48-pin Shrink Small-Outline Package (SSOP, DL), 300-mil body width, 0.5-mm pitch, with 1.2-mm max height and JEDEC MO-153 compliance. Pin 1 identifier located at top-left corner (Q1 quadrant in tape).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.

Compared with SN74ABT16244ADLR, SN74ABT16241ADLR preserves signal polarity essential for address/data integrity; versus SN74LVC16244ADGGR, it maintains native 5-V compatibility and higher drive for legacy industrial interfaces - making it optimal for retrofitting or mixed-voltage backplanes.

Availability

SN74ABT16241ADLR is available at Aetrix Electronics and suitable for memory subsystem design, clock tree implementation, and industrial backplane interfacing requiring stable component supply, long-term lifecycle support, and consistent SSOP (DL) packaging.

Supply support for SN74ABT16241ADLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability logic families.

SN74ABT16241ADLR belongs to the Widebus™ ABT logic family, engineered for high-speed, low-noise 3-state buffering in demanding memory, bus, and clock distribution systems.

FAQ

What is the recommended power-up sequence for SN74ABT16241ADLR to avoid bus contention?

To prevent undefined output states during power-up, tie all OE inputs to V_CC via pull-up resistors (value determined by driver's current-sinking capability) and all OE inputs to GND via pull-down resistors. This ensures outputs remain in high-impedance until system control logic asserts valid enable signals. The SN74ABT16241ADLR datasheet specifies this sequence to eliminate glitches on shared buses.

Does SN74ABT16241ADLR support hot insertion or live insertion into a powered backplane?

SN74ABT16241ADLR is not rated for hot insertion. Its absolute maximum ratings do not cover partial power application, and I_off (±100 µA) is specified only at V_CC = 0 V. Applying signals to inputs or outputs while V_CC is unpowered may exceed clamp current limits. For hot-swap applications, use dedicated hot-swap controllers or buffers with explicit live-insertion qualification.

Can SN74ABT16241ADLR be used with 3.3-V logic inputs?

Yes - SN74ABT16241ADLR accepts 3.3-V TTL-compatible inputs: V_IL ≤ 0.8 V and V_IH ≥ 2.0 V at V_CC = 4.5–5.5 V. A 3.3-V CMOS high (≥3.3 V) exceeds the 2.0-V V_IH threshold, ensuring reliable recognition. However, outputs swing to 5-V levels, so downstream 3.3-V receivers require level translation or tolerance to 5-V inputs.

What is the thermal resistance (θ_JA) of SN74ABT16241ADLR in its SSOP (DL) package?

The junction-to-ambient thermal resistance θ_JA for SN74ABT16241ADLR in the DL package is 94°C/W, measured under standard JEDEC JESD51-2 conditions (single-layer board, 1-in² copper pad). This value assumes no added heatsinking; actual board layout, copper area, and airflow significantly affect real-world thermal performance.

How does the distributed V_CC/GND pin configuration in SN74ABT16241ADLR reduce switching noise?

SN74ABT16241ADLR places four V_CC and eight GND pins strategically across the 48-pin DL package to minimize current loop area and inductance. This reduces simultaneous switching output (SSO) noise, lowers ground bounce (V_OLP < 1 V), and stabilizes local supply voltage during high-speed transitions - directly improving signal integrity in dense, high-frequency bus designs.