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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments SN74ABT16244ADLRG4

Name: SN74ABT16244ADLRG4
Brand: Texas Instruments
SKU: SN74ABT16244ADLRG4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74ABT16244ADLRG4

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 48-BSSOP (0.295", 7.50mm Width)

Datasheet:: SN74ABT16244ADLRG4.pdf

Description:: IC BUFF NON-INVERT 5.5V 48SSOP

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Product details

Overview

SN74ABT16244ADLRG4 from Texas Instruments is a 16-bit noninverting buffer/driver with 3-state outputs in a 48-pin SSOP (DL) package, rated for –40°C to 85°C operation. It delivers ±32-mA high-drive outputs, supports true logic buffering with active-low OE control per quadrant, and is optimized for memory address, clock, and bus-oriented applications requiring low ground bounce (<1 V) and distributed V_CC/GND pinning.

For engineers reviewing the SN74ABT16244ADLRG4 datasheet, SN74ABT16244ADLRG4 pinout, SN74ABT16244ADLRG4 application, or SN74ABT16244ADLRG4 equivalent, key selection considerations include its 4-quadrant 4-bit enable architecture, flow-through pinout for PCB layout optimization, symmetrical output drive capability, and compatibility with 5-V TTL/CMOS systems requiring high-density bus interfacing.

Technical Context

This device implements four independent 4-bit noninverting buffers, each with dedicated active-low output-enable (OE) inputs (1OE–4OE), enabling flexible segmentation as one 16-bit, two 8-bit, or four 4-bit drivers. Its EPIC-IIB™ BiCMOS process ensures low power dissipation while maintaining TTL-compatible input thresholds (V_IL = 0.8 V, V_IH = 2 V) and rail-to-rail output swing under load.

The DL-package variant features distributed V_CC and GND pins across all four sides to suppress high-speed switching noise, and its flow-through architecture places inputs on one side and outputs on the opposite side-reducing trace crossovers and signal integrity degradation in dense bus routing.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5 V to 5.5 V - Ensures robust operation across standard 5-V TTL/CMOS rails with margin against supply droop.
Output Drive	–32 mA I_OH, +64 mA I_OL - Supports direct interface to heavy capacitive loads (e.g., >50 pF buses) without external buffering.
Propagation Delay	t_PLH/t_PHL ≤ 3.5 ns @ V_CC = 5 V, T_A = 25°C - Enables reliable timing in high-speed address/data paths up to ~100 MHz.
3-State Enable Time	t_PZH/t_PZL ≤ 4.8 ns - Minimizes bus contention windows during dynamic bus sharing between multiple drivers.
Input Clamp Current	–18 mA - Protects against transient overvoltage events at inputs without external diodes.
Thermal Impedance	θ_JA = 94 °C/W (DL package) - Allows sustained operation at full drive under natural convection in compact industrial PCB layouts.

Pinout & Package

SN74ABT16244ADLRG4 uses a 48-pin Shrink Small-Outline Package (SSOP, DL) with 0.5-mm pitch, 12.6 mm × 7.9 mm body, and 1.2-mm max height. Pin 1 is located at top-left corner (Q1 quadrant), with gull-wing leads and JEDEC MO-153 compliance.

Pin/Terminal	Circuit Role	Design Meaning
1OE, 2OE, 3OE, 4OE	Active-low output-enable inputs	Independent control of four 4-bit output groups; tied high via pullup for safe power-up high-Z state.
1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4	Buffer inputs	True-logic inputs accepting TTL/CMOS levels; all unused inputs must be tied to V_CC or GND.
1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4	Noninverting 3-state outputs	High-drive outputs capable of sinking 64 mA or sourcing 32 mA; enter high-impedance when corresponding OE is high.
V_CC (Pins 7, 24, 31, 48)	Power supply	Distributed V_CC pins minimize IR drop and supply noise coupling across 16-bit bus sections.
GND (Pins 4, 10, 15, 21, 27, 32, 38, 43)	Ground reference	Eight GND pins provide low-inductance return paths, critical for suppressing ground bounce (V_OLP < 1 V).

Key Features

Feature	Design Value
Flow-through pinout	Inputs on top/bottom edges, outputs on left/right edges - eliminates layer jumps and reduces crosstalk in parallel bus routing.
Distributed V_CC/GND	Four V_CC and eight GND pins - lowers simultaneous switching noise (SSN) and improves signal integrity on wide buses.
EPIC-IIB™ BiCMOS process	Combines bipolar speed and CMOS density - achieves 3.5-ns propagation delay with <32 mA I_OH at sub-100 mW typical power.
High-drive 3-state outputs	–32 mA / +64 mA drive strength - drives long traces, multiple TTL loads, or unterminated stubs without signal degradation.
Output ground bounce suppression	V_OLP < 1 V @ V_CC = 5 V - prevents false logic transitions during fast output transitions in shared-ground systems.

Applications

Memory Address Buffering	Clock Distribution
Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus. IC Role / Device Role / Timing Role: Noninverting 3-state buffer isolating address generation logic from load capacitance of multiple memory chips. Use Value: Prevents address skew and timing violations by delivering matched, low-skew outputs with 3.5-ns max delay and high drive into >100 pF total bus load.	Use Scenario: Distributing a system clock to multiple synchronous peripherals (e.g., ADCs, DACs, FPGAs) with fanout >4. IC Role / Device Role / Timing Role: Low-jitter, high-drive clock driver with independent quadrant enables for dynamic clock gating. Use Value: Maintains signal integrity across 16 outputs with <1 V ground bounce, enabling clean edge transitions even under heavy capacitive loading.
Bus Transceiver Interface	Backplane Signal Conditioning
Use Scenario: Bidirectional data bus isolation between processor and peripheral modules using external direction control. IC Role / Device Role / Timing Role: Unidirectional buffer segment used in pairs to emulate transceiver behavior with precise OE-controlled turn-on/turn-off timing. Use Value: t_PZH/t_PZL ≤ 4.8 ns ensures minimal bus contention window, critical for reliable handshaking in ISA-like or custom parallel interfaces.	Use Scenario: Strengthening and retiming signals traversing a 100-mm backplane with >15 pF/inch trace capacitance. IC Role / Device Role / Timing Role: Active repeater stage restoring signal amplitude and slew rate for wide parallel backplane buses. Use Value: ±32-mA/±64-mA drive compensates for line loss, while flow-through layout minimizes inter-pair skew across all 16 bits.

Memory Address Buffering

Clock Distribution

Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus.

IC Role / Device Role / Timing Role: Noninverting 3-state buffer isolating address generation logic from load capacitance of multiple memory chips.

Use Value: Prevents address skew and timing violations by delivering matched, low-skew outputs with 3.5-ns max delay and high drive into >100 pF total bus load.

Use Scenario: Distributing a system clock to multiple synchronous peripherals (e.g., ADCs, DACs, FPGAs) with fanout >4.

IC Role / Device Role / Timing Role: Low-jitter, high-drive clock driver with independent quadrant enables for dynamic clock gating.

Use Value: Maintains signal integrity across 16 outputs with <1 V ground bounce, enabling clean edge transitions even under heavy capacitive loading.

Bus Transceiver Interface

Backplane Signal Conditioning

Use Scenario: Bidirectional data bus isolation between processor and peripheral modules using external direction control.

IC Role / Device Role / Timing Role: Unidirectional buffer segment used in pairs to emulate transceiver behavior with precise OE-controlled turn-on/turn-off timing.

Use Value: t_PZH/t_PZL ≤ 4.8 ns ensures minimal bus contention window, critical for reliable handshaking in ISA-like or custom parallel interfaces.

Use Scenario: Strengthening and retiming signals traversing a 100-mm backplane with >15 pF/inch trace capacitance.

IC Role / Device Role / Timing Role: Active repeater stage restoring signal amplitude and slew rate for wide parallel backplane buses.

Use Value: ±32-mA/±64-mA drive compensates for line loss, while flow-through layout minimizes inter-pair skew across all 16 bits.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74ABT16244ADGGR	TSSOP-48 (DGG) package; same electrical specs, 24.4-mm reel width, Level-1 MSL rating.	Better thermal performance (θ_JA = 89 °C/W) and smaller footprint than DL; preferred for space-constrained, high-reliability boards.	Select when board area is limited and reflow profile allows TSSOP handling; identical logic function and timing.
SN74ABT16244ADGVR	TVSOP-48 (DGV) package; same specs, 16.4-mm reel width, thinner profile (1.2 mm max), higher θ_JA = 93 °C/W.	Ultra-low profile ideal for stacked-module or ultra-thin embedded designs; slightly reduced thermal margin vs. DGG/DL.	Choose for ultra-low-height assemblies where 1.2-mm max height is mandatory; verify thermal derating at full drive.

Compared with SN74ABT16244ADGGR and SN74ABT16244ADGVR, the SN74ABT16244ADLRG4 offers the largest body size and highest thermal resistance but provides the most robust mechanical handling and lowest cost per unit in tube packaging-making it optimal for prototyping, low-volume production, and manual assembly environments.

Availability

SN74ABT16244ADLRG4 is available at Aetrix Electronics and suitable for memory subsystem design, industrial bus interfacing, and clock distribution systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant 5-V logic buffering.

Supply support for SN74ABT16244ADLRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of leadership in high-performance bus interface ICs.

The SN74ABT16244A product line was designed for high-density, high-speed digital systems requiring robust 5-V TTL-compatible buffering-targeting memory controllers, programmable logic interfaces, and industrial backplane applications.

FAQ

What is the operating temperature range for SN74ABT16244ADLRG4?

The SN74ABT16244ADLRG4 is characterized for operation from –40°C to +85°C ambient temperature. This commercial-grade rating aligns with standard industrial environments and excludes extended military or automotive temperature grades. The SN54ABT16244 variant covers –55°C to +125°C, but SN74ABT16244ADLRG4 strictly adheres to the –40°C to +85°C range per TI's SCBS073H datasheet revision.

Does SN74ABT16244ADLRG4 require external pull-up resistors on OE pins?

Yes - to ensure a defined high-impedance state during power-up or power-down, each OE pin (1OE–4OE) of the SN74ABT16244ADLRG4 must be tied to V_CC through an external pull-up resistor. The minimum resistor value depends on the current-sinking capability of the driving source; TI recommends verifying stability under worst-case V_CC ramp rates per application note SCBA004.

Can SN74ABT16244ADLRG4 drive a 50-pF load with guaranteed timing?

Yes - all switching characteristics for SN74ABT16244ADLRG4, including t_PLH, t_PHL, t_PZH, and t_PZL, are specified with C_L = 50 pF and V_CC = 5 V. At T_A = 25°C, t_PLH/t_PHL is guaranteed ≤ 3.5 ns and t_PZH/t_PZL ≤ 4.8 ns under these conditions, making it suitable for timing-critical 50-pF bus loads.

Is SN74ABT16244ADLRG4 pin-compatible with older SN74ABT16244 variants?

Yes - SN74ABT16244ADLRG4 shares identical pinout, functionality, and AC/DC specifications with other SN74ABT16244A variants in DL, DGG, and DGV packages. The "G4" suffix denotes RoHS-compliant NiPdAu lead finish and does not affect pin mapping or logic behavior; it is a direct replacement for legacy SN74ABT16244ADL and SN74ABT16244ADLG4 in the same package.

What is the maximum output current rating for SN74ABT16244ADLRG4?

The SN74ABT16244ADLRG4 supports a maximum low-level output current (I_OL) of 64 mA per output and a maximum high-level output current (I_OH) of –32 mA per output, tested under recommended operating conditions (V_CC = 4.5 V to 5.5 V). These values are absolute maximums - continuous operation should follow derating curves in the datasheet's thermal section.

SN74ABT16244ADLRG4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74ABT

Package/Case:: 48-BSSOP (0.295", 7.50mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 4

Number of Bits per Element:: 4

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 32mA, 64mA

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-SSOP

SN74ABT16244ADLRG4 FAQ

1.How can I place an order for SN74ABT16244ADLRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74ABT16244ADLRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74ABT16244ADLRG4 reliable?

The price and inventory of SN74ABT16244ADLRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT16244ADLRG4 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74ABT16244ADLRG4?

For technical support, including SN74ABT16244ADLRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT16244ADLRG4 requirements.

6.How does Aetrix verify that SN74ABT16244ADLRG4 is sourced from the original manufacturer or authorized distributors?

All SN74ABT16244ADLRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT16244ADLRG4 meets industry standards.

7.What is the process for return or replacement of SN74ABT16244ADLRG4?

All SN74ABT16244ADLRG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT16244ADLRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74ABT16244ADLRG4 part is unused and in its original packaging.

Return procedure for SN74ABT16244ADLRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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