Texas Instruments SN74ABT162827ADGGR

Overview

SN74ABT162827ADGGR from Texas Instruments is a noninverting 20-bit buffer IC with dual 10-bit sections, separate output-enable controls (1OE1/1OE2 and 2OE1/2OE2), 25-Ω integrated series output resistors, ±12 mA drive capability, and hot-insertion support via Ioff and power-up 3-state. It operates from 4.5 V to 5.5 V across −40°C to 85°C and is used in high-speed backplane and bus interface applications.

For engineers reviewing the SN74ABT162827ADGGR datasheet, SN74ABT162827ADGGR pinout, SN74ABT162827ADGGR application, or SN74ABT162827ADGGR equivalent, key selection criteria include its flow-through TSSOP-56 layout, distributed VCC/GND pins for noise suppression, guaranteed 3.9 ns max tPHL at 5 V, and compliance with JEDEC JESD-17 latch-up and JESD-22 ESD standards.

Technical Context

This device implements two independent 10-bit noninverting buffers, each requiring both OE inputs low to enable outputs; either OE high forces that section into high-impedance. The architecture includes on-die 25-Ω series termination per output to suppress overshoot/undershoot without external resistors.

It supports hot insertion via Ioff (≤±100 µA at VCC = 0) and power-up 3-state, ensuring outputs remain high-Z during supply ramping. Distributed VCC and GND pins across the 56-pin TSSOP package minimize simultaneous switching noise, while flow-through pin mapping simplifies PCB routing.

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package, 13.9 mm × 6.1 mm × 1.2 mm max height, lead-free NiPdAu finish, moisture sensitivity level 1, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 20-bit noninverting buffer applications.

Compared with SN74ABT162827ADGGR, SN74ABT162827ADLR offers identical functionality in a larger SSOP package with higher thermal resistance, while SN74LVC16244ADGGR targets 3.3-V domains with higher drive but no on-die termination-neither is pin-compatible, and both require layout or voltage-domain changes.

Availability

SN74ABT162827ADGGR is available at Aetrix Electronics and suitable for backplane buffering, industrial I/O expansion, telecom line card interfaces, and ATE signal conditioning requiring stable component supply and long-term industrial lifecycle support.

Supply support for SN74ABT162827ADGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader founded in 1930, specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

SN74ABT162827ADGGR belongs to TI's Widebus™ family of high-speed ABT logic devices, designed specifically for noise-sensitive, high-density backplane and bus-interface applications demanding hot-swap capability and signal integrity.

FAQ

What is the recommended power-up sequence for SN74ABT162827ADGGR to ensure safe hot insertion?

TI specifies that OE inputs must be held high (via pullup to VCC) during power-up to guarantee high-impedance outputs until VCC stabilizes. For SN74ABT162827ADGGR, tie all four OE pins (1OE1, 1OE2, 2OE1, 2OE2) to VCC through ≤10-kΩ resistors. This satisfies the power-up 3-state requirement and prevents bus contention. The device's Ioff circuitry further protects against backflow if VCC ramps after system voltage.

Does SN74ABT162827ADGGR support 3.3-V input logic levels when operated at 5 V VCC?

No. SN74ABT162827ADGGR requires VIH ≥ 2.0 V and VIL ≤ 0.8 V for guaranteed switching, but its input thresholds are TTL-compatible-not 3.3-V LVTTL. Applying 3.3-V logic signals directly may result in marginal or undefined behavior. For mixed-voltage systems, use a level translator such as SN74AVC4T245 upstream of SN74ABT162827ADGGR.

Can SN74ABT162827ADGGR drive unterminated 50-Ω transmission lines directly?

Yes. Each output of SN74ABT162827ADGGR integrates a 25-Ω series resistor, enabling matched source termination into 50-Ω lines. When driving a single 50-Ω load, this configuration provides near-perfect impedance matching, minimizing reflections. No external resistors are needed-verified per TI's application note SCBA004 and the device's "Output Ports Have Equivalent 25-Ω Series Resistors" specification.

What is the maximum clock/data frequency supported by SN74ABT162827ADGGR in a real-world PCB layout?

Based on its max 3.9 ns tPHL and 4.7 ns tPLH at 5 V, SN74ABT162827ADGGR supports reliable operation up to ~200 MHz for point-to-point connections with controlled impedance. In practice, sustained 100–125 MHz parallel bus operation is achievable with proper layout: short traces (<15 cm), ground plane, and termination. TI's flow-through pinout and distributed power pins are optimized for this performance tier.

How does the latch-up immunity of SN74ABT162827ADGGR compare to standard CMOS buffers?

SN74ABT162827ADGGR exceeds 500 mA latch-up immunity per JEDEC JESD-17, significantly higher than typical CMOS buffers (often 100–200 mA). This rating was verified under worst-case conditions and ensures robustness in industrial environments with ESD events or transient overvoltage. The ABT process technology and guard-ring design contribute to this enhanced resilience, making SN74ABT162827ADGGR suitable for mission-critical backplane applications.