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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments SN74ABT162827DL

Name: SN74ABT162827DL
Brand: Texas Instruments
SKU: SN74ABT162827DL
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74ABT162827DL

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: -

Datasheet:: SN74ABT162827DL.pdf

Description:: BUS DRIVER, ABT SERIES, 10-BIT6

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Product details

Overview

SN74ABT162827DL from Texas Instruments is a noninverting 20-bit buffer IC composed of two independent 10-bit buffers, each with dual output-enable inputs (1OE1/1OE2 and 2OE1/2OE2), operating at 4.5–5.5 V, delivering ±12 mA drive strength per output, and featuring integrated 25-Ω series termination resistors for reduced signal overshoot-used in high-speed bus interface applications in industrial control backplanes.

For engineers reviewing the SN74ABT162827DL datasheet, SN74ABT162827DL pinout, SN74ABT162827DL application, or SN74ABT162827DL equivalent, key selection considerations include dual OE logic dependency per 10-bit bank, flow-through pin architecture for PCB routing optimization, guaranteed -40°C to +85°C operation, and DL-package thermal dissipation rating of 1.4 W.

Technical Context

This device implements EPIC-II^B BiCMOS technology to achieve low power consumption while maintaining TTL-compatible input thresholds (V_IL = 0.8 V, V_VIH = 2.0 V) and fast switching (t_PLH/t_PHL ≤ 4.1 ns at V_CC = 5 V). Each 10-bit section requires both OE inputs low to enable outputs; either high forces high-impedance state.

The DL-package variant uses a 56-pin shrink small-outline (SSOP) footprint with distributed V_CC/GND pins to suppress simultaneous switching noise, and all outputs integrate on-die 25-Ω series resistors-eliminating external termination components and reducing layout complexity in dense bus systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5 V to 5.5 V - supports standard 5-V TTL bus systems with margin for ripple and droop.
Output Drive	±12 mA per Y output - sufficient to drive multiple TTL loads or terminated transmission lines without buffering.
Propagation Delay	t_PLH/t_PHL ≤ 4.1 ns (max) at 5 V - enables reliable operation in >100 MHz bus clock domains.
Input Thresholds	V_IL ≤ 0.8 V, V_IH ≥ 2.0 V - ensures robust noise immunity and compatibility with standard TTL and CMOS logic families.
Termination	Integrated 25-Ω series resistor per output - eliminates need for external series resistors, simplifying layout and reducing BOM count.
Operating Temperature	-40°C to +85°C - qualified for industrial-grade embedded systems and communications equipment.
Package Thermal Rating	1.4 W max power dissipation (DL package at T_A = 55°C) - supports sustained high-speed switching in compact enclosures.

Pinout & Package

The SN74ABT162827DL is housed in a 56-pin plastic shrink small-outline package (DL), JEDEC MO-118 compliant, with 0.025-inch lead pitch, 0.720–0.730 inch body width, and 0.291–0.299 inch body length.

Pin/Terminal	Circuit Role	Design Meaning
1OE1, 1OE2, 2OE1, 2OE2	Active-low output-enable controls	Both OE inputs per 10-bit bank must be low to enable corresponding Y outputs; any high forces high-Z - enables fine-grained bus partitioning.
1A1–1A10, 2A1–2A10	Data inputs	Noninverting inputs for respective 10-bit banks; accept standard TTL/CMOS logic levels.
1Y1–1Y10, 2Y1–2Y10	Buffered outputs	Drive-strength-controlled outputs with integrated 25-Ω series resistance - reduce EMI and improve signal integrity on PCB traces.
V_CC (Pins 7, 22, 36, 47)	Power supply	Distributed V_CC pins minimize IR drop and ground bounce across high-speed switching events.
GND (Pins 4, 11, 18, 25, 33, 40, 50)	Ground reference	Seven GND pins provide low-inductance return paths and reduce simultaneous switching noise in multi-bit operation.

Key Features

Feature	Design Value
Flow-through pin architecture	Input and output pins arranged on opposite sides of the DL package - enables straight-layer PCB routing, reduces vias and crosstalk.
On-die 25-Ω series termination	Eliminates need for 20 external resistors in 20-bit bus designs - saves board space, lowers assembly cost, improves signal fidelity.
EPIC-II^B BiCMOS process	Reduces dynamic power vs. pure bipolar while retaining speed - typical I_CC = 32 mA (all outputs active) at 5.5 V.
Latch-up immunity	Exceeds 500 mA per JEDEC JESD-17 - ensures robustness in noisy industrial environments with transient coupling.
Low ground bounce	V_OLP < 1 V at V_CC = 5 V, T_A = 25°C - maintains logic-level integrity during heavy output switching.

Applications

Industrial Backplane Bus Interface	High-Density Memory Address Buffering
Use Scenario: Interfacing microcontroller address/data buses to modular I/O cards in programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: Noninverting 20-bit buffer isolating and strengthening address lines between CPU and peripheral slots. Use Value: Integrated 25-Ω termination and flow-through pinout reduce stub lengths and reflections on 100+ mm backplane traces, enabling stable 25-MHz bus operation.	Use Scenario: Driving parallel address lines from an FPGA to multiple SRAM or Flash devices on a dense PCB. IC Role / Device Role / Timing Role: Dual-bank 10-bit buffer providing independent enable control for memory bank selection and timing isolation. Use Value: Dual OE inputs per bank allow precise timing alignment of address strobes, minimizing skew between memory regions.
Telecom Line Card Signal Conditioning	Test Equipment Digital Pattern Generation
Use Scenario: Level-shifting and driving control signals across isolated sections of a carrier-grade line card. IC Role / Device Role / Timing Role: High-drive buffer ensuring clean TTL-level transitions across opto-isolators or transformer-coupled interfaces. Use Value: ±12 mA output current sustains signal integrity through long PCB runs and capacitive loads up to 50 pF per line.	Use Scenario: Generating synchronized 20-bit digital stimulus patterns for ASIC validation in ATE systems. IC Role / Device Role / Timing Role: Low-skew, high-fanout buffer replicating pattern generator outputs to multiple DUT pins. Use Value: Matched propagation delays (t_PLH/t_PHL variation ≤ 0.5 ns) ensure sub-nanosecond inter-channel timing alignment.

Industrial Backplane Bus Interface

High-Density Memory Address Buffering

Use Scenario: Interfacing microcontroller address/data buses to modular I/O cards in programmable logic controllers (PLCs).

IC Role / Device Role / Timing Role: Noninverting 20-bit buffer isolating and strengthening address lines between CPU and peripheral slots.

Use Value: Integrated 25-Ω termination and flow-through pinout reduce stub lengths and reflections on 100+ mm backplane traces, enabling stable 25-MHz bus operation.

Use Scenario: Driving parallel address lines from an FPGA to multiple SRAM or Flash devices on a dense PCB.

IC Role / Device Role / Timing Role: Dual-bank 10-bit buffer providing independent enable control for memory bank selection and timing isolation.

Use Value: Dual OE inputs per bank allow precise timing alignment of address strobes, minimizing skew between memory regions.

Telecom Line Card Signal Conditioning

Test Equipment Digital Pattern Generation

Use Scenario: Level-shifting and driving control signals across isolated sections of a carrier-grade line card.

IC Role / Device Role / Timing Role: High-drive buffer ensuring clean TTL-level transitions across opto-isolators or transformer-coupled interfaces.

Use Value: ±12 mA output current sustains signal integrity through long PCB runs and capacitive loads up to 50 pF per line.

Use Scenario: Generating synchronized 20-bit digital stimulus patterns for ASIC validation in ATE systems.

IC Role / Device Role / Timing Role: Low-skew, high-fanout buffer replicating pattern generator outputs to multiple DUT pins.

Use Value: Matched propagation delays (t_PLH/t_PHL variation ≤ 0.5 ns) ensure sub-nanosecond inter-channel timing alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 20-bit noninverting buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74ABT16244DL	Octal (8-bit) per bank, not 10-bit; four independent OE inputs; same DL package and EPIC-II^B process.	Requires two devices for 20-bit coverage; offers finer enable granularity but higher component count.	Select when per-octet enable control is required over dual-10-bit grouping.
SN74LVC16244ADLR	3.3-V only (1.65–3.6 V), lower drive (±24 mA), no integrated series resistors, different pinout.	Not voltage-compatible with 5-V systems; requires level translation and external termination for legacy bus use.	Select only for new 3.3-V designs where lower power and higher speed justify redesign effort.

Compared with SN74ABT162827DL, SN74ABT16244DL provides modular enable control at the cost of doubled footprint and interconnect complexity, while SN74LVC16244ADLR enables modern low-voltage operation but forfeits plug-in compatibility, integrated termination, and 5-V tolerance essential for industrial retrofits.

Availability

SN74ABT162827DL is available at Aetrix Electronics and suitable for industrial backplane interfaces, high-density memory subsystems, telecom line card signal conditioning, and automated test equipment requiring stable component supply across extended temperature ranges.

Supply support for SN74ABT162827DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface ICs and industrial-grade reliability.

The SN74ABT162827DL belongs to TI's Widebus™ family of advanced BiCMOS bus-interface devices, engineered specifically for high-speed, low-noise data transfer in industrial automation, communications infrastructure, and test instrumentation.

FAQ

What is the function of the dual output-enable inputs (1OE1/1OE2 and 2OE1/2OE2) on the SN74ABT162827DL?

The SN74ABT162827DL requires both OE inputs per 10-bit bank to be low for outputs to drive; if either is high, the corresponding Y outputs enter high-impedance state. This dual-OE architecture prevents partial enable glitches and supports fail-safe bus arbitration in systems where multiple drivers share a common line. The SN74ABT162827DL thus delivers deterministic, noise-immune bus control without external logic.

Does the SN74ABT162827DL require external series termination resistors?

No - the SN74ABT162827DL integrates 25-Ω series resistors on every output, eliminating the need for external termination components. This design reduces PCB area, assembly steps, and impedance mismatch risk, especially critical in high-speed parallel bus layouts. Verified via TI's SCBS248B datasheet, this feature applies directly to the SN74ABT162827DL in DL package.

What is the maximum operating temperature range for the SN74ABT162827DL?

The SN74ABT162827DL is characterized for operation from –40°C to +85°C, meeting industrial-grade environmental requirements. This specification is explicitly stated in the "recommended operating conditions" table of the official datasheet (SCBS248B, December 1994 revision) and confirmed across all DL-package variants including SN74ABT162827DL.

Can the SN74ABT162827DL be used in 3.3-V systems?

No - the SN74ABT162827DL is specified only for 4.5–5.5 V operation. Its input thresholds (V_IL ≤ 0.8 V, V_IH ≥ 2.0 V), output drive strength, and internal BiCMOS structure are optimized for 5-V TTL compatibility. Using it at 3.3 V risks undefined logic states and degraded noise margins; TI does not characterize or guarantee performance below 4.5 V for the SN74ABT162827DL.

How does the flow-through pin architecture of the SN74ABT162827DL benefit PCB layout?

The SN74ABT162827DL arranges inputs on one side and outputs on the opposite side of the DL package, enabling direct layer-to-layer signal routing without vias or layer jumps. This minimizes trace length, crosstalk, and impedance discontinuities - particularly valuable in high-density backplane and memory interface designs. The pinout diagram in SCBS248B confirms this physical arrangement for the SN74ABT162827DL.

SN74ABT162827DL Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Logic Type:: -

Number of Elements:: -

Number of Bits per Element:: -

Input Type:: -

Output Type:: -

Current - Output High, Low:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

SN74ABT162827DL FAQ

1.How can I place an order for SN74ABT162827DL through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74ABT162827DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74ABT162827DL reliable?

The price and inventory of SN74ABT162827DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT162827DL is usually 5 days.

3.What payment methods are accepted for SN74ABT162827DL?

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SN74ABT162827DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74ABT162827DL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74ABT162827DL?

For technical support, including SN74ABT162827DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT162827DL requirements.

6.How does Aetrix verify that SN74ABT162827DL is sourced from the original manufacturer or authorized distributors?

All SN74ABT162827DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT162827DL meets industry standards.

7.What is the process for return or replacement of SN74ABT162827DL?

All SN74ABT162827DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT162827DL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74ABT162827DL part is unused and in its original packaging.

Return procedure for SN74ABT162827DL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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