Texas Instruments SN74ABT244ANSRG4

Overview

SN74ABT244ANSRG4 from Texas Instruments is an octal noninverting 3-state buffer/line driver in a 20-pin SO (NS) package, operating at 4.5–5.5 V with ±32-mA high-drive outputs, 4.6 ns max propagation delay (tPLH/tPHL), and −40°C to 85°C temperature range. It enables bidirectional bus interfacing in memory address and clock distribution systems.

For engineers reviewing the SN74ABT244ANSRG4 datasheet, SN74ABT244ANSRG4 pinout, SN74ABT244ANSRG4 application, or SN74ABT244ANSRG4 equivalent, this page delivers verified electrical specs, package dimensions, functional truth table, real-world use cases, and validated alternative parts for industrial bus interface design.

Technical Context

This device implements two independent 4-bit noninverting buffers, each controlled by a dedicated active-low output-enable (OE) input. When OE is low, data passes from A inputs to Y outputs with symmetrical drive strength; when OE is high, outputs enter high-impedance state to prevent bus contention.

Designed using EPIC-II^B BiCMOS process, it achieves low ground bounce (<1 V VOLP), latch-up immunity (>500 mA per JESD-17), and ESD protection exceeding 2000 V (MIL-STD-883 Method 3015). Input transition rate tolerance is 5 ns/V under enabled conditions.

Key Specifications

Pinout & Package

SN74ABT244ANSRG4 uses a 20-pin Small Outline (SO, NS) package with 0.300-inch body width, 1.2 mm max height, and JEDEC MO-150-compliant footprint. Pin pitch is 0.050 inch (1.27 mm).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal noninverting buffer applications.

Compared with SN74ABT244ANSRG4, the ADWRG4 offers greater board-level mechanical stability and thermal mass, while the APWRG4 delivers 45% smaller footprint and improved high-frequency signal integrity-choice depends on layout priority: reliability versus density.

Availability

SN74ABT244ANSRG4 is available at Aetrix Electronics and suitable for industrial bus interface, memory subsystem buffering, and legacy peripheral expansion requiring stable component supply and RoHS-compliant packaging.

Supply support for SN74ABT244ANSRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74ABT244A family was engineered for high-speed, high-drive 3-state bus interfacing in memory, clock, and peripheral subsystems-delivering robust performance in harsh electrical environments.

FAQ

What is the maximum operating voltage for SN74ABT244ANSRG4?

The absolute maximum supply voltage for SN74ABT244ANSRG4 is 7 V, but the recommended operating range is strictly 4.5 V to 5.5 V per TI's datasheet SCBS099J. Operating outside this window risks parametric shift or reliability degradation. SN74ABT244ANSRG4 must be powered within 4.5–5.5 V to guarantee specified timing, drive strength, and logic thresholds.

Does SN74ABT244ANSRG4 support hot-swap bus insertion?

Yes, SN74ABT244ANSRG4 supports hot-swap insertion due to its high-impedance 3-state outputs, robust ESD protection (2000 V HBM), and latch-up immunity exceeding 500 mA. Its output structure prevents bus contention during live insertion, and the SO (NS) package's lead finish (NiPdAu) enhances solder joint reliability during repeated thermal cycling. Always assert OE high before insertion to ensure outputs remain in high-Z state.

How does the dual OE architecture of SN74ABT244ANSRG4 improve system design?

The dual OE inputs (1OE and 2OE) in SN74ABT244ANSRG4 allow independent control of two 4-bit channels, enabling selective bus segmentation without additional logic. This simplifies address/data multiplexing, reduces gate count in bus arbitration logic, and supports byte-lane masking in memory interfaces. Each OE has identical timing specs, ensuring synchronized enable/disable across both channels when tied together-or staggered control for phased bus access.

What is the thermal resistance (θJA) of SN74ABT244ANSRG4 in its SO (NS) package?

While θJA is not explicitly published for the SO (NS) variant in SCBS099J, TI's packaging data confirms SN74ABT244ANSRG4 uses the same die and process as the DW and DB variants. Based on JEDEC MO-150 compliance and comparative thermal modeling, its θJA is approximately 105°C/W under standard 2-layer board conditions (1-inch² copper pad, 1 oz Cu). For thermal design, assume worst-case power dissipation of 150 mW and limit ambient temperature to ≤70°C to maintain junction below 125°C.

Can SN74ABT244ANSRG4 interface directly with 3.3-V logic inputs?

SN74ABT244ANSRG4 accepts 3.3-V logic-high signals reliably: its VIH threshold is 2.0 V min, and input leakage is ±1 µA at VCC = 5.5 V. However, its outputs swing rail-to-rail (0 V to 5 V), so direct connection to 3.3-V-only inputs requires level translation or series termination to avoid overvoltage damage. SN74ABT244ANSRG4 is designed as a 5-V bus driver-not a level shifter-and must be used with appropriate interface circuitry when bridging voltage domains.