Texas Instruments SN74ABT245BDBR
- Part No.:
- SN74ABT245BDBR
- Manufacturer:
- Texas Instruments
- Package:
- 20-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
SN74ABT245BDBR.pdf
- Description:
- IC TXRX NON-INVERT 5.5V 20SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,600
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Product details
Overview
SN74ABT245BDBR from Texas Instruments is an octal bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between A and B buses in industrial control and embedded communication systems. It supports hot insertion via Ioff and power-up 3-state, delivers ±32-mA high-drive outputs, and operates across −40°C to 85°C with 4.5–5.5-V supply.
For engineers reviewing the SN74ABT245BDBR datasheet, SN74ABT245BDBR pinout, SN74ABT245BDBR application, or SN74ABT245BDBR equivalent, key selection criteria include its 20-pin SSOP (DB) package, DIR/OE control logic, ground-bounce performance (<1 V), and compatibility with 5-V TTL-level systems requiring bus isolation and direction control.
Technical Context
The SN74ABT245BDBR implements dual 8-bit bidirectional data paths controlled by a single DIR input and enabled/disabled via OE. Its output drivers use ABT-series bipolar transistor technology to achieve −32-mA IOH and 64-mA IOL drive strength while maintaining fast propagation delays (tPLH/tPHL ≤ 3.8 ns at 5 V).
It integrates Ioff circuitry to disable outputs during power-down and prevent backflow current, and power-up 3-state logic ensures high-impedance outputs during VCC ramp-up/down-critical for hot-plug operation in backplane and modular systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - Ensures robust operation in noisy 5-V rail environments with ±10% tolerance. |
| IOH / IOL | −32 mA / 64 mA - Enables direct driving of multiple TTL loads without external buffers. |
| tPLH / tPHL | ≤ 3.8 ns - Supports high-speed bus transfers up to ~260 MHz clock-equivalent rates. |
| VOL / VOH | ≤ 0.55 V / ≥ 2.0 V at full load - Guarantees TTL-compatible logic thresholds under worst-case drive conditions. |
| Ioff | ±100 µA at VCC = 0 - Blocks damaging current flow during hot insertion or partial power-down. |
| θJA (SSOP) | 70 °C/W - Defines thermal derating for continuous operation at ambient up to 85°C with standard PCB copper. |
| ESD Rating | 2000-V HBM - Meets industrial-grade ESD immunity requirements per JESD22-A114. |
Pinout & Package
SN74ABT245BDBR uses a 20-pin Small-Outline Shrink Package (SSOP-DB), 7.4 mm × 5.3 mm body, 0.65-mm lead pitch, 2.0-mm max height, RoHS-compliant NiPdAu finish, and MSL Level-1 rating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | A-side data inputs/outputs | Bidirectional I/O ports connected to A bus; direction determined by DIR state. |
| 9 | DIR | Direction control: low = B→A, high = A→B; TTL-compatible input threshold (VIL ≤ 0.8 V, VIH ≥ 2 V). |
| 10, 11, 12, 13, 14, 15, 16, 17 | B-side data inputs/outputs | Bidirectional I/O ports connected to B bus; electrically identical to A-side pins. |
| 18 | OE | Output enable: low = active transceiver, high = 3-state isolation; supports pull-up for power-up safety. |
| 19 | GND | Ground reference for all I/O and internal logic; requires low-impedance PCB plane connection. |
| 20 | VCC | 5-V supply input; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin. |
Key Features
| Feature | Design Value |
|---|---|
| Hot-insertion support | Enabled by Ioff and power-up 3-state logic-prevents backfeed and bus contention during live board replacement. |
| High-drive 3-state outputs | −32-mA sourcing / 64-mA sinking capability allows direct interface with 10+ TTL loads without fanout buffers. |
| Low ground bounce | VOLP < 1 V at 5 V/25°C-reduces noise coupling into adjacent signals and improves signal integrity on dense PCBs. |
| Latch-up immunity | Exceeds 500 mA per JEDEC JESD17-ensures reliability in transient-overstress industrial environments. |
| Wide operating temperature | −40°C to +85°C range supports deployment in uncontrolled enclosures, factory automation, and outdoor edge nodes. |
Applications
| Industrial PLC Backplane Interface | Embedded Microcontroller Bus Extension |
|---|---|
Use Scenario: Isolating and extending parallel address/data buses between CPU module and I/O expansion cards in programmable logic controllers. IC Role / Device Role / Timing Role: Bidirectional bus transceiver enabling synchronous read/write cycles between master and slave modules via DIR-controlled data flow. Use Value: Eliminates need for discrete level shifters or direction logic; 3.8-ns propagation delay preserves timing margins in 20-MHz bus systems. | Use Scenario: Connecting an MCU's GPIO port to external peripherals (ADC, DAC, memory) sharing a common 8-bit data bus. IC Role / Device Role / Timing Role: Direction-controlled buffer that isolates MCU pins during peripheral access and prevents bus contention. Use Value: High-drive outputs drive long traces and multiple loads; Ioff protection prevents damage when peripherals are powered off independently. |
| Test Equipment Signal Routing | Legacy System Bus Bridge |
Use Scenario: Dynamically routing test patterns between pattern generator and DUT in automated test equipment with mixed-voltage subsystems. IC Role / Device Role / Timing Role: Controlled bus switch enabling reconfigurable signal paths under microcontroller command via DIR/OE. Use Value: 2000-V HBM ESD rating withstands handling in lab environments; low VOLP minimizes false triggering on sensitive analog inputs. | Use Scenario: Interfacing modern 5-V microcontrollers to legacy 8-bit ISA-style peripheral cards requiring bidirectional data handshaking. IC Role / Device Role / Timing Role: Protocol-transparent bus transceiver translating between host and legacy device timing domains using OE-gated bursts. Use Value: Compatible with TTL voltage levels and timing; 64-mA sink current drives legacy open-collector handshake lines directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC245A | 3.3-V only operation (1.65–3.6 V); lower drive (−24/+24 mA); CMOS process. | Suitable for 3.3-V systems only; not 5-V tolerant without level shifting. | Select when system operates at 3.3 V and lower power consumption is prioritized over drive strength. |
| SN74ABT245BDWR | Same ABT core, SOIC-DW package (7.5-mm width vs. DB's 5.3 mm); identical electrical specs. | Requires PCB layout change due to larger footprint and different thermal pad absence. | Choose for easier hand-soldering or legacy SOIC-compatible designs where space permits. |
Compared with SN74LVC245A and SN74ABT245BDWR, the SN74ABT245BDBR uniquely combines 5-V TTL compatibility, high-current drive, and compact SSOP packaging-making it optimal for space-constrained industrial backplanes needing robust hot-swap capability.
Availability
SN74ABT245BDBR is available at Aetrix Electronics and suitable for industrial PLC backplanes, embedded microcontroller bus extensions, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for SN74ABT245BDBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of experience in industrial-grade logic and interface ICs.
The SN74ABT245B series belongs to TI's advanced bus transceiver product line, engineered specifically for high-reliability, high-drive bidirectional data transfer in harsh industrial and instrumentation environments.
FAQ
What is the recommended power-up sequence for SN74ABT245BDBR to ensure safe 3-state behavior?
TI specifies tying OE to VCC through a pull-up resistor (value determined by driver sink capability) to guarantee high-impedance outputs during power-up. For SN74ABT245BDBR, this prevents bus conflicts before the controlling MCU initializes DIR/OE. The device's built-in power-up 3-state circuitry activates automatically once VCC crosses ~1.5 V, making external reset sequencing unnecessary.
Does SN74ABT245BDBR support mixed-voltage operation between A and B buses?
No. SN74ABT245BDBR is a 5-V-only device with TTL-compatible input thresholds and output swing referenced to a single VCC rail. Both A and B buses must operate at the same 4.5–5.5-V supply level. It does not provide level translation; for mixed-voltage interfaces, dedicated level-shifting transceivers like SN74AVCH series are required.
How does the Ioff feature of SN74ABT245BDBR protect the system during hot insertion?
The Ioff circuitry in SN74ABT245BDBR disables all outputs when VCC = 0 V, limiting leakage current to ±100 µA even if A or B bus signals remain active at up to 5.5 V. This prevents damaging backflow current into the unpowered device, protecting both the SN74ABT245BDBR and upstream drivers during live card insertion-meeting industrial hot-swap safety requirements.
What is the maximum capacitive load SN74ABT245BDBR can drive while maintaining specified timing?
SN74ABT245BDBR switching characteristics (e.g., tPLH ≤ 3.8 ns) are characterized at CL = 50 pF. Driving loads >50 pF increases propagation delay nonlinearly and may degrade edge rate. For reliable 20-MHz bus operation, total trace + load capacitance should be kept ≤40 pF; above that, series termination or reduced slew-rate variants should be considered.
Can SN74ABT245BDBR be used in place of SN74ABT245BDWR in an existing design?
Yes-SN74ABT245BDBR and SN74ABT245BDWR share identical electrical specifications, pinout, and logic behavior. However, the SSOP-DB package (5.3 mm wide) is narrower than SOIC-DW (7.5 mm), requiring PCB footprint revision. Thermal performance differs (θJA = 70°C/W vs. 58°C/W), so power dissipation must be re-evaluated for high-duty-cycle applications.
SN74ABT245BDBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 20-SSOP (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SSOP
SN74ABT245BDBR FAQ
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5.How can I obtain technical support or documentation for SN74ABT245BDBR?
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6.How does Aetrix verify that SN74ABT245BDBR is sourced from the original manufacturer or authorized distributors?
All SN74ABT245BDBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT245BDBR meets industry standards.
7.What is the process for return or replacement of SN74ABT245BDBR?
All SN74ABT245BDBR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT245BDBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT245BDBR part is unused and in its original packaging.
Return procedure for SN74ABT245BDBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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