My Inquiry
My Account
Texas Instruments SN74ABT245BMDBREP
- Part No.:
- SN74ABT245BMDBREP
- Manufacturer:
- Texas Instruments
- Package:
- 20-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
SN74ABT245BMDBREP.pdf
- Description:
- IC TXRX NON-INVERT 5.5V 20SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,250
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74ABT245BMDBREP from Texas Instruments is a radiation-hardened, high-drive octal bus transceiver with direction control and 3-state outputs, operating across −55°C to 125°C. It supports bidirectional asynchronous data transfer between A and B buses (8-bit), delivers −24 mA IOH / 32 mA IOL drive strength, features Ioff and power-up 3-state for hot insertion, and is qualified per JEDEC JESD17 latch-up and JESD22 ESD standards (2000-V HBM). It is used in space-grade avionics data bus isolation and reconfigurable payload interfaces.
For engineers reviewing the SN74ABT245BMDBREP datasheet, SN74ABT245BMDBREP pinout, SN74ABT245BMDBREP application, or SN74ABT245BMDBREP equivalent, key selection considerations include extended temperature operation, hot-insertion support via Ioff, high-impedance behavior during power sequencing, output ground bounce (<1 V), and SSOP-20 package compatibility with legacy ABT-family board layouts.
Technical Context
This device implements dual 8-bit noninverting bus transceivers with independent DIR (direction) and OE (output enable) control inputs. Its logic diagram confirms true bidirectional flow: when OE is low, data propagates from A→B if DIR = high, or B→A if DIR = low; when OE is high, all outputs enter high-impedance state regardless of DIR.
The IC integrates Ioff circuitry that disables outputs when VCC = 0 V, preventing backflow current up to ±100 µA, and power-up 3-state logic ensuring outputs remain high-Z during VCC ramp-up/down. Absolute maximum ratings include 7 V supply tolerance and 96 mA absolute output sink capability - exceeding standard ABT performance for robust system-level fault containment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - ensures compatibility with 5-V TTL/CMOS systems while rejecting noise-induced false triggering below 4.5 V. |
| IOH / IOL | −24 mA / 32 mA - enables direct driving of heavy capacitive loads (e.g., >50 pF traces) without external buffers in spacecraft backplanes. |
| Propagation Delay | tPLH/tPHL ≤ 4.2 ns @ 5 V - supports >100 MHz bus toggle rates in synchronous data capture applications. |
| Operating Temp | −55°C to 125°C - validated for use in satellite payload bays and engine-mounted control units without derating. |
| Ioff Current | ±100 µA @ VCC = 0 - guarantees no damaging backfeed into powered subsystems during live card replacement in redundant avionics racks. |
| ESD Rating | 2000-V HBM - meets MIL-STD-1540B requirements for handling survivability in cleanroom integration environments. |
| Output Ground Bounce | <1 V @ VCC = 5 V - minimizes simultaneous switching noise that could corrupt adjacent analog or RF signal paths on mixed-signal PCBs. |
Pinout & Package
SN74ABT245BMDBREP is housed in a 20-pin Small Outline Package (SSOP-DB), 7.4 mm × 5.3 mm body size, 0.65 mm lead pitch, 2.0 mm max height, RoHS-compliant NiPdAu finish, MSL Level-1 (unlimited floor life).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 DIR | Direction Control Input | Determines data flow direction: high = A→B, low = B→A; must be stable before OE activation to avoid bus contention. |
| 2–9 A1–A8 | Input/Output Port A | Bidirectional data terminals for first 8-bit bus; internally isolated when OE = high or VCC = 0 (Ioff active). |
| 10 GND | Ground Reference | Primary return path for all I/O and internal logic; requires low-inductance connection to minimize ground bounce. |
| 11 VCC | Power Supply | 5-V nominal supply; decoupling capacitor (0.1 µF ceramic + 4.7 µF tantalum) required within 5 mm of pin. |
| 12 OE | Output Enable Input | Active-low; ties to VCC via pullup resistor (≥10 kΩ) to ensure high-Z during power-up; controls all 16 I/Os simultaneously. |
| 13–20 B1–B8 | Input/Output Port B | Bidirectional data terminals for second 8-bit bus; electrically identical to A-port with matched timing and drive strength. |
Key Features
| Feature | Design Value |
|---|---|
| Hot-Insertion Support | Enabled by Ioff (prevents backdrive at VCC = 0) and power-up 3-state (forces high-Z during VCC ramp), eliminating need for sequenced power supplies in modular avionics. |
| High-Drive Outputs | −24 mA source / 32 mA sink capability allows direct interface to unterminated 50-Ω transmission lines or legacy TTL loads without level-shifting buffers. |
| Latch-Up Immunity | Exceeds 500 mA per JEDEC JESD17 - critical for operation in high-radiation environments where single-event latch-up could cause system reset. |
| Extended Temperature Operation | Qualified from −55°C to 125°C with full parametric testing - eliminates thermal derating calculations for launch vehicle and Mars rover applications. |
| Low Output Ground Bounce | <1 V peak at 25°C - maintains signal integrity on shared ground planes with sensitive ADCs or RF receivers in compact payload modules. |
Applications
| Avionics Data Bus Isolation | Satellite Payload Reconfiguration |
|---|---|
|
Use Scenario: Isolating command/data buses between flight computer and inertial measurement unit (IMU) in radiation-hardened spacecraft. IC Role / Device Role / Timing Role: Bidirectional level-translating buffer with direction-controlled data routing and fail-safe high-Z during power faults. Use Value: Prevents bus contention during IMU hot-swap; Ioff blocks backfeed into powered flight computer during module replacement. |
Use Scenario: Enabling dynamic reassignment of FPGA configuration bitstreams between redundant payload processors in LEO satellites. IC Role / Device Role / Timing Role: High-speed 8-bit data shuttle synchronizing configuration memory writes across dual processor domains. Use Value: 4.2 ns max propagation delay supports 100+ MHz configuration clocking; SSOP-20 footprint matches heritage designs for drop-in upgrade. |
| Launch Vehicle Telemetry Interface | Radiation-Tolerant Test Equipment |
|
Use Scenario: Interfacing telemetry acquisition ASICs with multiplexed analog-to-digital converters in solid rocket booster control systems. IC Role / Device Role / Timing Role: Direction-controlled bus transceiver isolating ADC digital outputs from telemetry packetization logic under extreme vibration. Use Value: −55°C to 125°C rating survives cryogenic fuel loading and post-launch thermal soak; 32 mA IOL drives long PCB traces to remote ADCs. |
Use Scenario: Building radiation-tolerant boundary-scan test adapters for validating ASICs in proton-beam irradiation chambers. IC Role / Device Role / Timing Role: Hot-pluggable bus extender enabling real-time JTAG signal injection without powering down test chamber electronics. Use Value: Ioff and power-up 3-state eliminate risk of damaging test fixture backfeed during probe insertion; SSOP-20 simplifies adapter PCB layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT245BDBR | Commercial-grade (−40°C to 85°C), same pinout and AC/DC specs, no enhanced DMS or radiation hardening. | Not qualified for spaceflight or military platforms requiring extended temp or reliability pedigree. | Select only for ground-test fixtures or non-critical industrial controllers where cost sensitivity outweighs environmental qualification. |
| SN74LVC245AQPWRQ1 | Automotive AEC-Q100 Grade 1 (−40°C to 125°C), 3.3-V only, lower drive (−24/24 mA), no Ioff or hot-insertion support. | Designed for automotive infotainment buses, not suitable for 5-V systems or live insertion scenarios. | Use only in new 3.3-V automotive designs requiring automotive qualification; incompatible with 5-V SN74ABT245BMDBREP infrastructure. |
Compared with SN74ABT245BDBR and SN74LVC245AQPWRQ1, the SN74ABT245BMDBREP uniquely combines 5-V operation, extended temperature range, Ioff-enabled hot insertion, and space-grade reliability documentation - making it irreplaceable in mission-critical aerospace deployments where failure modes cannot be mitigated by software.
Availability
SN74ABT245BMDBREP is available at Aetrix Electronics and suitable for avionics data bus isolation, satellite payload reconfiguration, launch vehicle telemetry interfaces, radiation-tolerant test equipment, and other high-reliability applications requiring stable component supply across extended temperature and radiation-exposed environments.
Supply support for SN74ABT245BMDBREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and aerospace markets since 1930.
The SN74ABT245BMDBREP belongs to TI's Enhanced Product (EP) family - engineered specifically for high-reliability applications demanding extended temperature operation, controlled baseline manufacturing, and full DMS support for long-lifecycle programs.
FAQ
What is the operating temperature range of the SN74ABT245BMDBREP?
The SN74ABT245BMDBREP is fully specified for operation from −55°C to 125°C, with parametric testing performed across this entire range. This extended temperature capability is validated per JEDEC standards including temperature cycling and biased 85/85 testing, making the SN74ABT245BMDBREP suitable for deployment in spacecraft, missile guidance systems, and downhole oilfield electronics where ambient conditions exceed commercial limits.
Does the SN74ABT245BMDBREP support hot insertion, and how is it implemented?
Yes, the SN74ABT245BMDBREP supports hot insertion through two integrated features: Ioff circuitry disables outputs when VCC = 0 V (limiting backfeed current to ±100 µA), and power-up 3-state logic forces all outputs into high-impedance during power ramp-up/down. These functions are inherent to the SN74ABT245BMDBREP silicon design and require no external components - enabling safe live replacement in redundant avionics chassis without system shutdown.
What package type and dimensions does the SN74ABT245BMDBREP use?
The SN74ABT245BMDBREP uses a 20-pin Small Outline Package (SSOP-DB) with 0.65 mm lead pitch, 7.4 mm × 5.3 mm body size, and 2.0 mm maximum height. Its pin 1 index area and quadrant orientation (Q1) comply with JEDEC MO-150, and the package carries NiPdAu lead finish with MSL Level-1 rating - allowing unlimited floor life and compatibility with standard reflow profiles used for heritage ABT-family designs.
How does the SN74ABT245BMDBREP handle bus contention during direction switching?
The SN74ABT245BMDBREP avoids bus contention by requiring DIR to be stable before OE is asserted - as confirmed in its function table and logic diagram. When OE is high, all outputs are forced high-Z regardless of DIR state; when OE transitions low, data flow follows the established DIR level. This sequencing ensures no overlap between A→B and B→A drivers, and the SN74ABT245BMDBREP's 0.5 ns output skew (tsk(o)) further minimizes transient contention windows.
Is the SN74ABT245BMDBREP pin-compatible with standard SN74ABT245B variants?
Yes, the SN74ABT245BMDBREP shares identical pinout, electrical timing, and functional behavior with commercial SN74ABT245B devices in SSOP-20 (DB) package - including SN74ABT245BDBR. This allows direct PCB-level substitution in existing designs, provided the application requires extended temperature, radiation tolerance, and enhanced product change notification - all inherent to the SN74ABT245BMDBREP's EP qualification.
SN74ABT245BMDBREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 20-SSOP (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 32mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SSOP
SN74ABT245BMDBREP FAQ
1.How can I place an order for SN74ABT245BMDBREP through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ABT245BMDBREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ABT245BMDBREP reliable?
The price and inventory of SN74ABT245BMDBREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT245BMDBREP is usually 5 days.
3.What payment methods are accepted for SN74ABT245BMDBREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT245BMDBREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74ABT245BMDBREP?
SN74ABT245BMDBREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ABT245BMDBREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT245BMDBREP?
For technical support, including SN74ABT245BMDBREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT245BMDBREP requirements.
6.How does Aetrix verify that SN74ABT245BMDBREP is sourced from the original manufacturer or authorized distributors?
All SN74ABT245BMDBREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT245BMDBREP meets industry standards.
7.What is the process for return or replacement of SN74ABT245BMDBREP?
All SN74ABT245BMDBREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT245BMDBREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT245BMDBREP part is unused and in its original packaging.
Return procedure for SN74ABT245BMDBREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74ABT245BMDBREP Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments
-
SN74LVC2G17DBVR
Texas Instruments
-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments
-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
