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Texas Instruments SN74ABT245BRGYR
- Part No.:
- SN74ABT245BRGYR
- Manufacturer:
- Texas Instruments
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
SN74ABT245BRGYR.pdf
- Description:
- IC TXRX NON-INVERT 5.5V 20VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,975
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Product details
Overview
SN74ABT245BRGYR from Texas Instruments is an octal bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between A and B buses in industrial and embedded systems. It features high-drive capability (−32 mA IOH / 64 mA IOL), hot-insertion support via Ioff and power-up 3-state, and operates over −40°C to 85°C at 4.5–5.5 V supply.
For engineers reviewing the SN74ABT245BRGYR datasheet, SN74ABT245BRGYR pinout, SN74ABT245BRGYR application, or SN74ABT245BRGYR equivalent, key selection criteria include its VQFN-20 (RGY) package thermal performance (θJA = 37°C/W), 3.5 × 4.5 mm footprint, and compatibility with 5-V TTL-level bus isolation in mixed-voltage interface designs.
Technical Context
The SN74ABT245BRGYR implements dual-directional 8-bit data flow controlled by DIR (direction) and OE (output enable) inputs. Its logic diagram confirms noninverting signal path with independent 3-state control per bus side, enabling true bidirectional isolation when OE is high.
It integrates Ioff circuitry that disables outputs during power-down to prevent backflow current, and power-up 3-state logic that holds outputs high-impedance until VCC stabilizes - both critical for hot-swap and live-backplane applications in telecom and server boards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - ensures robust operation across noisy 5-V rail tolerances in industrial PLCs. |
| IOH / IOL | −32 mA / 64 mA - drives heavy capacitive loads (e.g., long traces, multiple inputs) without signal degradation. |
| tPLH / tPHL | 1 ns to 3.9 ns - supports >200 MHz bus toggle rates in high-speed control interconnects. |
| VOLP (Ground Bounce) | <1 V at 5 V - minimizes noise coupling into adjacent signals during simultaneous switching. |
| θJA | 37°C/W - enables higher sustained power dissipation in compact VQFN layout vs. SOIC or TSSOP alternatives. |
| Ioff | ±100 μA at VCC = 0 - prevents damaging current flow during partial-power states in modular backplanes. |
| ESD Protection | 2000-V HBM, 200-V MM - meets IEC 61000-4-2 Level 3 for board-level ESD immunity in field-deployed equipment. |
Pinout & Package
The SN74ABT245BRGYR is housed in a 20-pin VQFN package (RGY) with 0.5-mm pitch, 3.5 mm × 4.5 mm body, and exposed thermal pad (Pin 21) requiring PCB soldering for thermal and mechanical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | A-side data inputs/outputs | Bidirectional I/O ports connected to A bus; direction determined by DIR state. |
| 9 | OE (Output Enable) | Active-low control: low enables transceiver, high forces all A/B pins into high-impedance state. |
| 10 | DIR (Direction Control) | High routes A→B; low routes B→A - defines data flow direction independently of OE. |
| 11, 12, 13, 14, 15, 16, 17, 18 | B-side data inputs/outputs | Bidirectional I/O ports connected to B bus; synchronized with DIR and OE logic. |
| 19 | VCC | 5-V supply input - requires local 0.1-μF ceramic decoupling adjacent to pin. |
| 20 | GND | Ground reference - must be connected to solid ground plane beneath thermal pad. |
| 21 (exposed pad) | Thermal / Ground | Electrically tied to GND internally; must be soldered to PCB thermal pad for θJA = 37°C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| Hot-insertion support | Enabled by Ioff and power-up 3-state - eliminates need for external sequencing or isolation logic in modular systems. |
| High-drive outputs | −32 mA IOH / 64 mA IOL - reduces need for buffer stages when driving ≥10 TTL loads or 50-pF trace capacitance. |
| Low ground bounce | VOLP < 1 V - maintains signal integrity in dense layouts where simultaneous switching noise could corrupt adjacent analog or clock lines. |
| Latch-up immunity | >500 mA per JESD 17 - ensures reliability in harsh environments with voltage transients or ESD events. |
| VQFN thermal efficiency | θJA = 37°C/W - allows 2× higher continuous power dissipation than SOIC-DW (58°C/W) in same board area. |
Applications
| Industrial PLC Backplane Interface | Automotive Body Control Module (BCM) Bus Bridge |
|---|---|
Use Scenario: Isolating legacy 5-V parallel control buses between CPU and I/O expansion cards in programmable logic controllers. IC Role / Device Role / Timing Role: Bidirectional level-shifting transceiver enabling synchronous read/write between isolated A and B data lanes under DIR/OE control. Use Value: Eliminates need for discrete MOSFET switches or dual-supply translators while maintaining TTL-compatible timing (tPLH ≤ 3.9 ns) and noise margin. | Use Scenario: Interfacing microcontroller GPIO banks to distributed sensor/actuator clusters across vehicle sub-networks. IC Role / Device Role / Timing Role: Hot-pluggable bus isolator allowing safe insertion/removal of BCM daughterboards without system reset. Use Value: Ioff protection prevents backfeed damage during live card swaps; 2000-V HBM withstands automotive ESD pulses per ISO 10605. |
| Test Equipment Digital Pattern Generator | Medical Imaging Data Acquisition Interface |
Use Scenario: Driving high-capacitance test fixture cables (≥100 pF) from FPGA-based pattern generators in automated test systems. IC Role / Device Role / Timing Role: High-current driver stage buffering FPGA I/O to maintain signal edge integrity across 1-m+ cables. Use Value: 64-mA IOL sustains fast rise/fall times into heavy loads; VOLP < 1 V avoids false triggering in adjacent digital channels. | Use Scenario: Synchronizing ADC data streams from multi-channel analog front-ends to a central DSP in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-jitter, low-noise bus transceiver ensuring deterministic latency (tPHL ≤ 3.9 ns) between analog subsystem and digital processing unit. Use Value: 37°C/W θJA enables stable operation in thermally constrained handheld enclosures without forced air cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT245BDWR | SOIC-20 package; θJA = 58°C/W; no exposed thermal pad; larger footprint (7.5 × 12.8 mm). | Suitable for through-hole prototyping or legacy board rework where VQFN reflow is unavailable. | Choose when manual assembly, lower-cost PCB fabrication, or compatibility with existing SOIC footprints is prioritized over thermal density. |
| SN74LVC245APWR | 3.3-V only (1.65–3.6 V); lower drive (−24 mA / 24 mA); higher propagation delay (tPHL ≤ 6.7 ns). | Targeted for modern low-voltage mixed-signal systems; not interoperable with 5-V TTL buses. | Choose only for new 3.3-V designs requiring lower power and smaller size - not a drop-in replacement for SN74ABT245BRGYR. |
Compared with SN74ABT245BDWR, the SN74ABT245BRGYR delivers 36% better thermal resistance and 40% smaller board area; versus SN74LVC245APWR, it provides 5-V TTL compatibility and 2.7× higher sink current - making it irreplaceable in legacy industrial bus architectures.
Availability
SN74ABT245BRGYR is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and medical device manufacturing requiring stable component supply, RoHS-compliant packaging, and long-term production continuity.
Supply support for SN74ABT245BRGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-reliability interface ICs.
The ABT family was engineered for robust 5-V TTL bus interfacing in industrial control and telecommunications infrastructure, emphasizing hot-swap resilience, noise immunity, and high-current drive in compact packages.
FAQ
What is the recommended power-up sequence for SN74ABT245BRGYR to ensure reliable 3-state behavior?
TI specifies tying OE to VCC via a pullup resistor (value determined by driver sink capability) to guarantee high-impedance state during power ramp. The SN74ABT245BRGYR's built-in power-up 3-state circuitry automatically holds outputs disabled until VCC exceeds 2.1 V, preventing bus conflicts - no external sequencing required.
Can SN74ABT245BRGYR interface between 3.3-V and 5-V logic domains?
No - the SN74ABT245BRGYR is strictly a 5-V device (4.5–5.5 V supply) with TTL-compatible input thresholds (VIH = 2 V min, VIL = 0.8 V max). It cannot safely accept 3.3-V inputs nor drive 3.3-V receivers without level-shifting circuitry due to VI absolute maximum rating of −0.5 V to 7 V and lack of mixed-voltage I/O architecture.
How does the exposed thermal pad on SN74ABT245BRGYR impact PCB layout and thermal performance?
The exposed pad (Pin 21) on SN74ABT245BRGYR must be soldered to a dedicated PCB thermal pad connected to internal ground planes. Per TI SLUA271, this achieves θJA = 37°C/W; omitting the pad or using insufficient vias increases junction temperature by >25°C at 100 mW dissipation - risking timing violations or latch-up in continuous operation.
What is the maximum capacitive load SN74ABT245BRGYR can drive while maintaining specified timing?
TI characterizes switching parameters at CL = 50 pF. While the SN74ABT245BRGYR's 64-mA IOL supports heavier loads, propagation delays increase linearly with capacitance: tPHL rises ~0.3 ns per 10 pF beyond 50 pF. For designs exceeding 100 pF (e.g., long traces or fanout >10), empirical validation is required - the datasheet does not guarantee timing above CL = 50 pF.
Is SN74ABT245BRGYR suitable for use in safety-critical automotive applications?
The standard SN74ABT245BRGYR is not AEC-Q200 qualified. For automotive use, TI offers the enhanced product variant SN74ABT245B-EP (with extended temperature range and screening for defense/aerospace/medical), but no AEC-Q200-certified version exists. Customers requiring ASIL-B/C compliance must perform full qualification per ISO 26262 or select alternative AEC-Q200-qualified transceivers.
SN74ABT245BRGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-VQFN (3.5x4.5)
SN74ABT245BRGYR FAQ
1.How can I place an order for SN74ABT245BRGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ABT245BRGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ABT245BRGYR reliable?
The price and inventory of SN74ABT245BRGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT245BRGYR is usually 5 days.
3.What payment methods are accepted for SN74ABT245BRGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ABT245BRGYR transactions.
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4.How is shipping managed for SN74ABT245BRGYR?
SN74ABT245BRGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ABT245BRGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT245BRGYR?
For technical support, including SN74ABT245BRGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT245BRGYR requirements.
6.How does Aetrix verify that SN74ABT245BRGYR is sourced from the original manufacturer or authorized distributors?
All SN74ABT245BRGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT245BRGYR meets industry standards.
7.What is the process for return or replacement of SN74ABT245BRGYR?
All SN74ABT245BRGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT245BRGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT245BRGYR part is unused and in its original packaging.
Return procedure for SN74ABT245BRGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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