Texas Instruments SN74ABT827DBR

Overview

SN74ABT827DBR from Texas Instruments is a 10-bit noninverting 3-state bus buffer with dual active-low output-enable inputs (OE1, OE2), designed for high-speed wide-bus interface applications in industrial and embedded systems. It delivers −32-mA high-level and 64-mA low-level output drive, operates from 4.5 V to 5.5 V, features flow-through pinout for optimized PCB layout, and maintains high-impedance state during power-up/down below 2.1 V.

For engineers reviewing the SN74ABT827DBR datasheet, SN74ABT827DBR pinout, SN74ABT827DBR application, or SN74ABT827DBR equivalent, key selection considerations include its BiCMOS EPIC-II^B architecture for low power dissipation, latch-up immunity >500 mA per JESD-17, output ground bounce <1 V at 5 V/25°C, and compatibility with 5-V TTL/CMOS logic families in data-path buffering and bus isolation roles.

Technical Context

This device implements a dual-gated 2-input AND logic control for its 3-state outputs: either OE1 or OE2 asserted high forces all ten Y outputs into high-impedance. Its flow-through architecture places inputs (A1–A10) on one side and outputs (Y1–Y10) on the opposite side of the SSOP-24 package, minimizing trace crossovers. The BiCMOS EPIC-II^B process enables fast switching (t_PLH/t_PHL ≤ 4.9 ns at 5 V, CL = 50 pF) while maintaining TTL-compatible input thresholds (V_IL = 0.8 V, V_VIH = 2.0 V).

It supports hot-insertion-safe operation via power-up/power-down high-impedance behavior when V_CC is between 0 and 2.1 V. For guaranteed high-Z above 2.1 V, OE pins require pullup resistors to V_CC, sized per driver sink capability. Absolute maximum ratings include 7-V supply tolerance and ±50-mA output clamp current, ensuring robustness in noisy industrial environments.

Key Specifications

Pinout & Package

SN74ABT827DBR uses a 24-pin Shrink Small-Outline Package (SSOP-DB) with 0.65-mm lead pitch, 7.5-mm body width, and 1.2-mm max height. Pin 1 index is located at top-left corner (Q1 quadrant in tape); leads are gull-wing, surface-mount compatible.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 10-bit bus buffer applications.

Compared with SN74ABT244DW and SN74LVC8T245PW, the SN74ABT827DBR uniquely provides 10-bit width with industrial-grade 5-V drive and BiCMOS speed-making it optimal for wide-data-path isolation where pin count and 5-V compatibility are mandatory.

Availability

SN74ABT827DBR is available at Aetrix Electronics and suitable for industrial backplanes, memory expansion subsystems, and automated test equipment requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for SN74ABT827DBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability logic families.

The SN74ABT827DBR belongs to TI's ABT-series advanced bi-directional bus transceivers and buffers, engineered specifically for high-speed, low-noise 5-V system interconnect in industrial automation and test instrumentation.

FAQ

What is the recommended pullup resistor value for OE1/OE2 on SN74ABT827DBR?

The minimum pullup resistor value for OE1 or OE2 depends on the current-sinking capability of the driving source. Per the datasheet, OE must be tied to V_CC through a pullup to guarantee high-impedance above 2.1 V. For typical 5-V CMOS drivers with 20-µA sink capability, a 10-kΩ resistor is sufficient. Always verify with actual driver specs and include margin for temperature drift. SN74ABT827DBR requires this for reliable hot-swap operation.

Does SN74ABT827DBR support hot-plug insertion into a live 5-V bus?

Yes, SN74ABT827DBR supports hot-plug insertion due to its guaranteed high-impedance state when V_CC is between 0 and 2.1 V during power ramp-up or down. This prevents bus contention or backfeeding. However, OE pins must be pulled up to V_CC (not left floating) to ensure outputs remain disabled until full supply is established. SN74ABT827DBR is widely used in modular backplane systems for this reason.

Can SN74ABT827DBR drive a 50-pF load at 50 MHz?

SN74ABT827DBR is characterized for CL = 50 pF and achieves t_PLH/t_PHL ≤ 4.9 ns at 5 V, supporting data rates up to ~100 Mbps in NRZ format. At 50 MHz (20-ns period), timing margins are adequate for most synchronous interfaces. Ensure proper PCB layout (short traces, ground plane, local decoupling) to maintain signal integrity. SN74ABT827DBR's low ground bounce (<1 V) further aids high-frequency stability.

What is the meaning of "NC" pins on the SN74ABT827DBR pinout?

"NC" stands for No Connection - these pins (e.g., pins 3, 4, 5, 6, 7, 8, 9, 10, 15, 16, 17, 18, 19, 20, 21, 22 on SN74ABT827DBR) have no internal bond wire or circuit connection. They must remain unconnected on the PCB. Soldering or routing to NC pins may cause mechanical stress or unintended parasitic coupling. Always follow TI's layout guidelines specifying keep-out zones around NC pads. SN74ABT827DBR's DB package has 16 NC pins to accommodate internal die routing constraints.

How does the dual OE architecture of SN74ABT827DBR improve system design?

The dual active-low OE inputs (OE1 and OE2) implement a 2-input AND function: both must be low to enable outputs. This allows hierarchical bus control - e.g., OE1 driven by system-level chip select and OE2 by board-level enable - reducing external logic. It also supports fail-safe behavior: if either control line floats high, outputs go high-Z. SN74ABT827DBR thus simplifies arbitration in multi-master or modular systems without adding discrete gates.