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Texas Instruments SN74ABT827NTG4
- Part No.:
- SN74ABT827NTG4
- Manufacturer:
- Texas Instruments
- Package:
- 24-DIP (0.300", 7.62mm)
- Datasheet:
-
SN74ABT827NTG4.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 24DIP
- Quantity:
- Payment:
- Shipping:
Inventory:2,928
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Product details
Overview
SN74ABT827NTG4 from Texas Instruments is a 10-bit noninverting 3-state buffer/bus driver in a 24-pin plastic DIP (NT) package, delivering high-drive outputs (−32 mA IOH, 64 mA IOL), flow-through pinout for optimized PCB layout, and guaranteed high-impedance state during power-up/down (VCC = 0–2.1 V). It serves as a wide-bus interface for data paths carrying parity in industrial backplanes and memory subsystems.
For engineers reviewing the SN74ABT827NTG4 datasheet, SN74ABT827NTG4 pinout, SN74ABT827NTG4 application, or SN74ABT827NTG4 equivalent, key selection criteria include its BiCMOS EPIC-IIB architecture, 5-V operation with TTL-compatible inputs, 4.4 ns max tPLH propagation delay at 5 V, and dual active-low OE control enabling precise bus arbitration in multi-driver systems.
Technical Context
This device implements a flow-through architecture with A1–A10 inputs mapped directly to Y1–Y10 outputs, minimizing signal skew across the 10-bit bus. Its dual 2-input AND gate OE structure (OE1 and OE2 both active-low) ensures all outputs enter high-impedance state if either enable is high - critical for hot-swap and shared-bus isolation.
The SN74ABT827NTG4 uses Texas Instruments' EPIC-IIB BiCMOS process to achieve low ground bounce (<1 V VOLP), latch-up immunity >500 mA per JESD-17, and rail-to-rail output swing (VOH ≥ 2.5 V at −24 mA, VOL ≤ 0.55 V at 64 mA) under 4.5–5.5 V supply conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL and CMOS logic rails without level shifting. |
| Output Drive | −32 mA IOH / 64 mA IOL - supports heavy capacitive loads and fan-out to multiple TTL inputs on shared buses. |
| Propagation Delay | Max 4.8 ns (tPLH/tPHL at VCC = 5 V, TA = 25°C, CL = 50 pF) - enables reliable timing in high-speed 10-MHz+ bus interfaces. |
| Power-Up Behavior | Guaranteed high-Z state when VCC is 0–2.1 V - prevents bus contention during system power sequencing. |
| Input Compatibility | TTL-level VIH = 2 V, VIL = 0.8 V - interoperates directly with legacy 5-V TTL logic without external biasing. |
| Thermal Resistance | θJA = 67°C/W (NT package) - defines maximum junction temperature rise under continuous 1.5 mA ICC typical supply current. |
| Operating Temperature | −40°C to +85°C - qualified for commercial/industrial environments including embedded controllers and test equipment. |
Pinout & Package
SN74ABT827NTG4 is housed in a 24-pin plastic dual-in-line package (NT), 0.600-inch body width, with through-hole mounting and standard DIP lead spacing (0.100 inch). Pin 1 index located at top-left corner with notch marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 13 | OE1, OE2 | Active-low output-enable controls - both must be low for output drive; either high forces all Y outputs into high-Z. |
| 2–11 | A1–A10 | Data inputs - true (noninverting) logic path to corresponding Y outputs; TTL-compatible thresholds. |
| 14–23 | Y1–Y10 | Buffered outputs - high-drive, 3-state capable, with flow-through routing matching input order. |
| 12, 24 | GND, VCC | Power terminals - decoupling capacitor placement near Pin 12 (GND) and Pin 24 (VCC) minimizes noise coupling. |
| NC (Pins 5, 15, 16) | No internal connection | Unused pins - must remain unconnected; no routing or soldering required. |
Key Features
| Feature | Design Value |
|---|---|
| EPIC-IIB BiCMOS Process | Reduces dynamic power dissipation vs. pure bipolar while retaining high-speed drive capability and noise immunity. |
| Flow-Through Architecture | Input-to-output pin mapping (A1→Y1, ..., A10→Y10) simplifies trace routing and reduces layer count in dense PCB layouts. |
| Power-Up/Down High-Z | Automatic 3-state assertion below 2.1 V VCC eliminates need for external power-on reset circuitry in bus-hold designs. |
| Low Ground Bounce | VOLP < 1 V at VCC = 5 V - maintains signal integrity during simultaneous switching of multiple outputs. |
| Latch-Up Immunity | Exceeds 500 mA per JEDEC JESD-17 - ensures robustness against transient overcurrent events in noisy industrial environments. |
Applications
| Industrial Backplane Interface | Memory Subsystem Data Buffering |
|---|---|
|
Use Scenario: Interfacing microprocessor address/data buses to extended backplane slots with multiple peripheral cards. IC Role / Device Role / Timing Role: 10-bit bidirectional bus driver providing isolation, drive strength, and controlled enable timing between CPU and slot peripherals. Use Value: Flow-through pinout reduces trace length mismatch; high-impedance power sequencing prevents bus contention during card insertion/removal. |
Use Scenario: Driving parity bits and data lines between DRAM modules and memory controller in industrial PLCs. IC Role / Device Role / Timing Role: Noninverting buffer ensuring clean, low-skew transmission of 10-bit parity and status signals across long traces. Use Value: 64-mA sink capability handles capacitive loading of multi-drop memory bus; 4.8-ns max delay meets tight setup/hold windows. |
| Test Equipment Signal Routing | Legacy System Bus Expansion |
|
Use Scenario: Multiplexing and conditioning digital stimulus/response signals in automated test equipment (ATE) channel cards. IC Role / Device Role / Timing Role: 3-state buffer enabling dynamic reconfiguration of signal paths under FPGA or microcontroller control. Use Value: Dual OE inputs allow independent gating of two logical bus segments; high-Z during power-down protects downstream DUTs. |
Use Scenario: Adding expansion capability to aging 5-V embedded systems using ISA-like or custom parallel buses. IC Role / Device Role / Timing Role: Drop-in replacement for obsolete 74F/74AS bus drivers, maintaining pin compatibility and timing margins. Use Value: TTL-compatible inputs and 5-V operation ensure seamless integration; NT DIP package supports through-hole prototyping and repair. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 10-bit noninverting bus driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT827DBR | SSOP-24 package (3.9-mm width), surface-mount only; identical electrical specs and pinout mapping. | Suitable for space-constrained PCBs requiring SMT assembly; not interchangeable with NT DIP in through-hole designs. | Select SN74ABT827DBR when board real estate or automated assembly mandates SSOP packaging. |
| SN74ABT827PWR | TSSOP-24 package (4.4-mm width, 1.2-mm height); same logic function and AC/DC parameters, but different thermal profile (θJA = 120°C/W). | Preferred for ultra-thin industrial modules where component height is restricted; requires adjusted thermal derating. | Choose SN74ABT827PWR only when mechanical envelope constraints prohibit DIP or SSOP packages. |
Compared with SN74ABT827NTG4, SN74ABT827DBR offers identical performance in a smaller footprint for SMT production, while SN74ABT827PWR provides lowest profile but demands tighter thermal management - neither is pin-compatible with the NT DIP due to differing land patterns and mounting methods.
Availability
SN74ABT827NTG4 is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory subsystem buffering, test equipment signal routing, and legacy system bus expansion requiring stable component supply and long-term obsolescence support.
Supply support for SN74ABT827NTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability logic families.
The SN74ABT827NTG4 belongs to TI's ABT logic series, engineered for high-speed, high-drive 5-V bus interfacing in industrial and instrumentation systems where signal integrity and power sequencing robustness are critical.
FAQ
What is the operating voltage range for SN74ABT827NTG4?
The SN74ABT827NTG4 operates over a supply voltage range of 4.5 V to 5.5 V. This range ensures full compliance with standard 5-V TTL logic levels and guarantees specified performance for VOH, VOL, propagation delay, and output drive. Operation outside this range may result in undefined behavior or damage, as absolute maximum ratings cap VCC at 7 V.
Does SN74ABT827NTG4 support hot-swap or live-insertion?
Yes, SN74ABT827NTG4 supports safe hot-swap via its inherent power-up/power-down high-impedance feature: when VCC is between 0 and 2.1 V, all outputs automatically enter high-Z state. This prevents bus contention during partial power application. For guaranteed high-Z above 2.1 V, tie OE1 and OE2 to VCC via pullup resistors per datasheet guidance.
What is the maximum capacitive load SN74ABT827NTG4 can drive reliably?
SN74ABT827NTG4 is characterized with CL = 50 pF for switching specifications, and its 64-mA IOL drive supports heavier loads. In practice, it reliably drives up to 100 pF with minimal delay degradation, provided proper PCB layout (short traces, ground plane) and decoupling (0.1 µF ceramic near VCC/GND) are used. Exceeding 150 pF risks violating timing margins.
Can SN74ABT827NTG4 replace older 74F or 74AS logic in existing designs?
Yes, SN74ABT827NTG4 is a functional and pin-compatible upgrade for 74F827 and 74AS827 in 24-pin DIP sockets. It matches their truth table, DC specs, and timing (with improved speed and lower power), while adding BiCMOS benefits like reduced ground bounce and higher latch-up immunity - no PCB changes required.
What is the thermal resistance (θJA) of SN74ABT827NTG4 in its NT package?
The SN74ABT827NTG4 in the NT (plastic DIP) package has a junction-to-ambient thermal resistance (θJA) of 67°C/W, as specified in the datasheet. This value assumes standard JEDEC test conditions (single-layer board, 1 in² copper pad). Actual thermal performance depends on PCB copper area, airflow, and nearby heat sources - derate power dissipation accordingly for ambient temperatures near 85°C.
SN74ABT827NTG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABT
- Package/Case:
- 24-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 24-PDIP
SN74ABT827NTG4 FAQ
1.How can I place an order for SN74ABT827NTG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ABT827NTG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ABT827NTG4 reliable?
The price and inventory of SN74ABT827NTG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ABT827NTG4 is usually 5 days.
3.What payment methods are accepted for SN74ABT827NTG4?
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4.How is shipping managed for SN74ABT827NTG4?
SN74ABT827NTG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ABT827NTG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ABT827NTG4?
For technical support, including SN74ABT827NTG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ABT827NTG4 requirements.
6.How does Aetrix verify that SN74ABT827NTG4 is sourced from the original manufacturer or authorized distributors?
All SN74ABT827NTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ABT827NTG4 meets industry standards.
7.What is the process for return or replacement of SN74ABT827NTG4?
All SN74ABT827NTG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABT827NTG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABT827NTG4 part is unused and in its original packaging.
Return procedure for SN74ABT827NTG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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