Texas Instruments SN74ABTH16245DLR
- Part No.:
- SN74ABTH16245DLR
- Manufacturer:
- Texas Instruments
- Package:
- 48-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74ABTH16245DLR.pdf
- Description:
- IC TXRX NON-INVERT 5.5V 48SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,474
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Product details
Overview
SN74ABTH16245DLR from Texas Instruments is a 16-bit noninverting bus transceiver with 3-state outputs, designed for synchronous two-way data communication between A and B buses in high-speed digital systems. It features ±32-mA high-drive outputs, bus-hold circuitry on all data inputs, and operates over –40°C to 85°C at 4.5–5.5 V supply. Used in industrial backplanes and memory interface subsystems requiring robust signal integrity and isolation.
For engineers reviewing the SN74ABTH16245DLR datasheet, SN74ABTH16245DLR pinout, SN74ABTH16245DLR application, or SN74ABTH16245DLR equivalent, key selection considerations include its 48-pin SSOP (DL) package, direction-controlled bidirectional flow, OE-gated 3-state operation, and EPIC-II™ BiCMOS process enabling low ground bounce (<1 V) and latch-up immunity >500 mA.
Technical Context
The SN74ABTH16245DLR implements dual 8-bit or single 16-bit bidirectional data transfer via DIR-controlled signal routing and OE-enabled output disable. Its flow-through pin architecture minimizes PCB trace length asymmetry and reduces crosstalk in dense layouts.
It integrates active bus-hold circuitry eliminating external pullup/pulldown resistors, and features distributed VCC/GND pins plus internal power sequencing logic that ensures high-impedance state during power-up/down when VCC is below 2.1 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - Ensures compatibility with standard 5-V TTL and mixed-voltage system rails. |
| Output Drive | –32 mA IOH / +64 mA IOL - Supports heavy capacitive loads and fast edge rates without external buffering. |
| Propagation Delay | 1 ns to 3.9 ns (tPLH/tPHL) - Enables reliable operation in sub-10-ns timing-critical bus interfaces. |
| Bus-Hold Current | ±100 µA at VI = 0.8 V or 2 V - Maintains valid logic levels on floating data lines, reducing board-level component count. |
| Operating Temperature | –40°C to +85°C - Qualified for industrial-grade embedded control and communications equipment. |
| Package Thermal Impedance | 94°C/W (θJA, DL package) - Guides thermal design margining for sustained 16-bit switching activity. |
| Input Clamp Current | –18 mA - Limits damage from transient overvoltage events on control or data inputs. |
Pinout & Package
SN74ABTH16245DLR uses a 48-pin Shrink Small-Outline Package (SSOP, DL), 12.6 mm × 6.1 mm body, 0.5-mm pitch, 1.2-mm max height, JEDEC MO-153 compliant. Pin 1 located at top-left corner with quadrants defined per TI tape-and-reel spec.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction Control Input | Selects data flow direction per 8-bit section: DIR = L → B-to-A; DIR = H → A-to-B. |
| 1OE, 2OE | Output Enable Input | Active-low enable: OE = L activates transceiver; OE = H forces all outputs into high-impedance state. |
| 1A1–1A8, 2A1–2A8 | Port A Data Inputs/Outputs | First and second 8-bit bidirectional data terminals connected to local bus or controller side. |
| 1B1–1B8, 2B1–2B8 | Port B Data Inputs/Outputs | Corresponding 8-bit bidirectional terminals connected to remote bus or peripheral side. |
| VCC (Pins 7, 18, 28, 39, 48) | Power Supply | Distributed VCC pins reduce simultaneous switching noise and improve PDN stability across 16-bit switching. |
| GND (Pins 4, 10, 21, 31, 42) | Ground Reference | Multiple GND pins minimize ground bounce and provide low-inductance return paths for high-speed outputs. |
Key Features
| Feature | Design Value |
|---|---|
| EPIC-II™ BiCMOS Process | Reduces dynamic power dissipation vs. legacy bipolar designs while retaining TTL-compatible voltage thresholds and drive strength. |
| Flow-Through Architecture | Input and output pins arranged on opposite sides of package to enable straight PCB trace routing and minimize stub length. |
| High-Impedance Power Sequencing | Guaranteed Hi-Z state during VCC ramp from 0–2.1 V eliminates bus contention in multi-rail power-up scenarios. |
| Distributed VCC/GND Pins | Five VCC and five GND pins placed symmetrically to suppress simultaneous switching noise (SSN) in 16-bit parallel interfaces. |
| Bus-Hold Circuitry | Eliminates need for 10-kΩ external pullups on unused data lines-reduces BOM cost and layout area in modular backplane designs. |
Applications
| Industrial Backplane Interface | Memory Expansion Subsystem |
|---|---|
|
Use Scenario: Interfacing FPGA-based control modules with legacy ISA-style peripheral cards in programmable logic controllers. IC Role / Device Role / Timing Role: Bidirectional level-shifting and bus isolation transceiver managing data coherency between asynchronous clock domains. Use Value: Bus-hold prevents floating inputs during hot-swap events; 64-mA sink capability drives long traces with 50-pF load per line. |
Use Scenario: Extending SRAM or Flash memory address/data bus width in medical imaging frame buffers. IC Role / Device Role / Timing Role: Synchronous 16-bit data path extender with DIR/OE control synchronized to memory controller strobes. Use Value: Sub-4-ns propagation delay meets tight tAA/tOH timing budgets; distributed power pins stabilize VCC under burst write current. |
| Test Equipment Data Acquisition | Automated Test Fixture Control |
|
Use Scenario: Routing sensor data from multiple analog front-end channels to a central ADC/DSP processor in benchtop analyzers. IC Role / Device Role / Timing Role: Isolating and multiplexing parallel digital sensor outputs onto shared test bus under microcontroller command. Use Value: High-impedance disable state prevents back-driving during reconfiguration; latch-up immunity >500 mA protects against ESD-induced latch-up. |
Use Scenario: Controlling relay banks and DIO modules in semiconductor wafer probers using PXI-compatible backplane signals. IC Role / Device Role / Timing Role: Directional bus repeater enabling master-slave handshaking between host controller and fixture I/O expansion cards. Use Value: Flow-through pinout simplifies controlled-impedance routing on 6-layer test fixture PCBs; ±32-mA drive sustains signal integrity over 15-cm ribbon cables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16245ADGGR | 3.3-V only operation; lower drive (–24/+24 mA); CMOS process; no bus-hold | Suitable for 3.3-V-only systems with lower noise margin requirements and external pullup availability | Choose when migrating to lower-voltage logic families and accepting reduced drive strength and added external components. |
| SN74ABT16245DLR | No bus-hold; higher ICC (32 mA typical vs. 2 mA for ABTH); same pinout and voltage range | Used where bus-hold is unnecessary and higher static power is acceptable for marginal timing improvement | Select only if bus-hold is explicitly disabled in system design and higher quiescent current is tolerable. |
Compared with SN74LVC16245ADGGR and SN74ABT16245DLR, the SN74ABTH16245DLR uniquely combines 5-V operation, bus-hold integration, and EPIC-II™ low-noise performance-making it optimal for industrial backplanes where reliability, noise immunity, and component count reduction are critical.
Availability
SN74ABTH16245DLR is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory expansion subsystems, automated test fixture control, and data acquisition systems requiring stable component supply across extended product lifecycles.
Supply support for SN74ABTH16245DLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.
The SN74ABTH16245DLR belongs to TI's Widebus™ family of high-speed bus interface ICs, engineered specifically for noise-resilient, high-density parallel data interconnects in industrial control and instrumentation systems.
FAQ
What is the operating temperature range for SN74ABTH16245DLR?
The SN74ABTH16245DLR is characterized for operation from –40°C to +85°C, meeting industrial-grade environmental requirements. This range is validated per TI's recommended operating conditions and supported by thermal derating data in the SCBS662I datasheet. The SN74ABTH16245DLR maintains full electrical specifications-including propagation delay, drive strength, and bus-hold functionality-across this entire span.
Does SN74ABTH16245DLR require external pullup resistors on data lines?
No, the SN74ABTH16245DLR includes integrated bus-hold circuitry on all A and B port data inputs, providing ±100 µA holding current to maintain valid logic levels on unused or floating lines. This eliminates the need for external 10-kΩ pullup/pulldown resistors, reducing BOM cost and PCB real estate-confirmed in the device description and electrical characteristics table of the SCBS662I datasheet.
What package type does SN74ABTH16245DLR use, and what are its key mechanical dimensions?
The SN74ABTH16245DLR uses a 48-pin Shrink Small-Outline Package (SSOP, DL) per JEDEC MO-153. Its body measures 12.6 mm × 6.1 mm with 0.5-mm lead pitch and maximum height of 1.2 mm. Pin 1 orientation follows quadrant Q1 per TI's tape-and-reel specification, and the package includes 5 VCC and 5 GND pins for low-noise power distribution.
How does SN74ABTH16245DLR handle power-up and power-down sequencing?
The SN74ABTH16245DLR enters a guaranteed high-impedance state when VCC is between 0 V and 2.1 V, preventing bus contention during power ramp. Above 2.1 V, OE must be actively controlled-TI recommends tying OE to VCC via a pullup resistor (value determined by driver sink capability) to ensure Hi-Z until firmware initializes direction and enable logic.
What is the maximum output current rating for SN74ABTH16245DLR?
The SN74ABTH16245DLR supports –32 mA high-level output current (IOH) and +64 mA low-level output current (IOL) under recommended operating conditions. These values are specified at VCC = 4.5 V and TA = 25°C, and remain functional across the full –40°C to +85°C range per the absolute maximum ratings table in SCBS662I.
SN74ABTH16245DLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABTH
- Package/Case:
- 48-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-SSOP
SN74ABTH16245DLR FAQ
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7.What is the process for return or replacement of SN74ABTH16245DLR?
All SN74ABTH16245DLR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABTH16245DLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABTH16245DLR part is unused and in its original packaging.
Return procedure for SN74ABTH16245DLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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