Texas Instruments SN74ABTH245DGVR
- Part No.:
- SN74ABTH245DGVR
- Manufacturer:
- Texas Instruments
- Package:
- 20-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74ABTH245DGVR.pdf
- Description:
- IC TXRX NON-INVERT 5.5V 20TVSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,098
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Product details
Overview
SN74ABTH245DGVR from Texas Instruments is an octal bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between A and B buses in industrial and embedded systems. It features ±32-mA high-drive outputs, bus-hold circuitry eliminating external pull resistors, Ioff support for hot insertion, and operates from –40°C to 85°C at 4.5–5.5 V.
For engineers reviewing the SN74ABTH245DGVR datasheet, SN74ABTH245DGVR pinout, SN74ABTH245DGVR application, or SN74ABTH245DGVR equivalent, this page delivers verified electrical specs, thermal performance (θJA = 92°C/W), switching timing (tPLH/tPHL ≤ 3.6 ns), bus-hold behavior, and hot-swap compatibility - all critical for legacy TTL-level bus isolation and level-shifting designs.
Technical Context
This device implements EPIC-IIB BiCMOS logic to achieve low power dissipation while maintaining TTL-compatible voltage thresholds (VIH = 2 V, VIL = 0.8 V) and robust output drive (–32 mA IOH, 64 mA IOL). Its direction-control (DIR) and output-enable (OE) inputs enable flexible bidirectional flow control without external logic.
The integrated bus-hold circuitry actively maintains valid logic levels on floating A/B port inputs (II(hold) = ±100 µA), and Ioff protection limits reverse current to ±100 µA when VCC = 0 V - both essential for system-level reliability during partial power-down or hot-plug events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL and mixed-voltage backplane interfaces. |
| IOH / IOL | –32 mA / 64 mA - drives heavy capacitive loads and long traces without external buffers in industrial backplanes. |
| tPLH / tPHL | ≤ 3.6 ns - supports high-speed data handshaking up to ~275 MHz in point-to-point configurations (CL = 50 pF). |
| θJA | 92°C/W - matches DGV (TSSOP-20) package thermal profile; requires minimal PCB copper for thermal management. |
| Bus-Hold Current | ±100 µA - actively clamps unused data lines to valid logic states, removing need for 4.7-kΩ pull-up/down resistors. |
| Ioff | ±100 µA at VCC = 0 - prevents damaging backflow current during hot insertion or partial system power-down. |
| Operating Temp | –40°C to +85°C - qualified for commercial/industrial environments including factory automation and test equipment. |
Pinout & Package
TSSOP-20 (DGV) package: 4.4 mm × 6.5 mm, 1.2 mm max height, 0.65 mm lead pitch, gull-wing leads, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 19 | DIR | Direction control: LOW enables B→A transfer; HIGH enables A→B transfer - determines data flow path synchronously. |
| 2–9 | A1–A8 | Input/output port A - connects to source bus; bus-hold active when floating; driven by DIR/OE logic. |
| 11–18 | B1–B8 | Input/output port B - connects to destination bus; identical bus-hold and drive capability as A-side. |
| 10 | GND | Ground reference - must be low-impedance connection to minimize ground bounce (VOLP < 1 V). |
| 20 | VCC | Power supply - decoupling capacitor (0.1 µF) required near pin for stable 5-V operation and noise immunity. |
| 19 | OE | Output enable: LOW activates transceiver; HIGH forces all A/B outputs into high-impedance state - isolates buses. |
Key Features
| Feature | Design Value |
|---|---|
| EPIC-IIB BiCMOS Process | Reduces static power consumption vs. standard bipolar TTL while retaining speed and drive strength. |
| Hot-Insertion Support | Ioff and power-up 3-state ensure safe insertion into live backplanes without disrupting adjacent devices. |
| Integrated Bus-Hold | Eliminates 16 external pull resistors (8 per side), reducing BOM count and board space in dense bus architectures. |
| High-Drive Outputs | –32 mA IOH / 64 mA IOL sustains signal integrity across 10+ cm PCB traces loaded with multiple TTL inputs. |
| Low Ground Bounce | VOLP < 1 V at VCC = 5 V, TA = 25°C - minimizes noise coupling into shared ground planes in multi-channel systems. |
Applications
| Industrial Backplane Interface | Legacy System Bus Isolation |
|---|---|
Use Scenario: Isolating CPU address/data bus from peripheral expansion slots in programmable logic controllers. IC Role / Device Role / Timing Role: Bidirectional bus transceiver enabling synchronous read/write cycles between master and slave modules. Use Value: Bus-hold eliminates pull resistors on 16-bit parallel bus; 3-state isolation prevents contention during slot reset or firmware update. |
Use Scenario: Interfacing modern microcontrollers to legacy ISA or VMEbus peripherals requiring 5-V TTL signaling. IC Role / Device Role / Timing Role: Level-shifting and direction-controlled data bridge between mismatched voltage domains and timing protocols. Use Value: High-drive outputs drive long bus stubs; tPLH/tPHL ≤ 3.6 ns meets ISA timing budgets without added wait states. |
| Test Equipment Signal Routing | Automated Test Fixture Control |
Use Scenario: Dynamic reconfiguration of signal paths in automated board test systems using relayless switching. IC Role / Device Role / Timing Role: Low-latency bidirectional data switch controlled via FPGA GPIO for stimulus/response routing. Use Value: OE-controlled 3-state allows glitch-free bus sharing among multiple DUT interfaces; θJA = 92°C/W supports compact stacked layouts. |
Use Scenario: Controlling parallel I/O lines (e.g., JTAG, boundary scan, or sensor arrays) in production test fixtures. IC Role / Device Role / Timing Role: Robust bus driver ensuring reliable logic-level translation under noisy factory floor conditions. Use Value: Ioff protection prevents damage during fixture cable swaps; latch-up immunity >500 mA per JESD 17 enhances field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC245A | 3.3-V only operation (1.65–3.6 V); lower drive (–24 mA / 24 mA); no bus-hold; CMOS input thresholds. | Suitable for modern low-voltage digital systems but incompatible with 5-V TTL buses without level shifters. | Select when migrating to 3.3-V logic families and external pull resistors are acceptable. |
| SN74ABT245 | Same 5-V operation and pinout, but lacks Ioff and bus-hold; higher ICC (30 mA typical); no hot-insertion support. | Functional replacement where hot-swap is not required and board layout accommodates external pull resistors. | Choose only for cost-sensitive legacy upgrades where thermal margin and bus stability are less critical. |
Compared with SN74LVC245A and SN74ABT245, the SN74ABTH245DGVR uniquely combines 5-V TTL compatibility, integrated bus-hold, Ioff-enabled hot insertion, and 92°C/W thermal performance - making it irreplaceable in industrial backplane and test fixture designs requiring zero-resistor bus termination and live-system modularity.
Availability
SN74ABTH245DGVR is available at Aetrix Electronics and suitable for industrial backplane interface, legacy system bus isolation, and automated test fixture control requiring stable component supply across extended product lifecycles.
Supply support for SN74ABTH245DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of industrial-grade component heritage.
The ABTH logic family targets high-reliability, high-drive 5-V bus interfacing applications - specifically engineered for noise-immune data transfer in factory automation, test equipment, and military-grade commercial systems.
FAQ
What is the maximum operating temperature range for the SN74ABTH245DGVR?
The SN74ABTH245DGVR is characterized for operation from –40°C to +85°C, meeting industrial temperature requirements. This range is validated per the recommended operating conditions in the official TI datasheet SCBS663D, and applies specifically to the DGV (TSSOP-20) package variant. Operation outside this range may result in undefined timing or output behavior.
Does the SN74ABTH245DGVR require external pull-up or pull-down resistors on its data lines?
No. The SN74ABTH245DGVR includes active bus-hold circuitry on all A and B port inputs, which maintains valid logic levels on floating lines with ±100 µA hold current. This eliminates the need for external pull resistors - a key design simplification confirmed in the device description and electrical characteristics tables of the SCBS663D datasheet.
Is the SN74ABTH245DGVR compatible with hot-insertion into a live 5-V backplane?
Yes. The SN74ABTH245DGVR incorporates Ioff circuitry that limits reverse current to ±100 µA when VCC = 0 V, and power-up 3-state logic that holds outputs in high-impedance until VCC exceeds 2.1 V. These features are explicitly validated for hot-insertion applications per the datasheet's "Ioff and Power-Up 3-State Support Hot Insertion" section.
What is the thermal resistance (θJA) of the SN74ABTH245DGVR in its DGV package?
The SN74ABTH245DGVR in the DGV (TSSOP-20) package has a junction-to-ambient thermal resistance (θJA) of 92°C/W, as specified in the Absolute Maximum Ratings table of the SCBS663D datasheet. This value assumes standard JEDEC test conditions (single-layer 1-in² copper pad) and informs heatsinking requirements for continuous 64-mA IOL operation.
How does the direction-control (DIR) and output-enable (OE) logic interact in the SN74ABTH245DGVR?
In the SN74ABTH245DGVR, OE must be LOW to activate the transceiver; when OE is HIGH, all A/B outputs enter high-impedance regardless of DIR state. When OE is LOW, DIR determines direction: DIR = LOW enables B→A data flow, and DIR = HIGH enables A→B flow - per the Function Table in the SCBS663D datasheet.
SN74ABTH245DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ABTH
- Package/Case:
- 20-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TVSOP
SN74ABTH245DGVR FAQ
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7.What is the process for return or replacement of SN74ABTH245DGVR?
All SN74ABTH245DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ABTH245DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ABTH245DGVR part is unused and in its original packaging.
Return procedure for SN74ABTH245DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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