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Texas Instruments SN74AHC125MDREP
- Part No.:
- SN74AHC125MDREP
- Manufacturer:
- Texas Instruments
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74AHC125MDREP.pdf
- Description:
- IC BUF NON-INVERT 5.5V 14SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,127
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Product details
Overview
SN74AHC125MDREP from Texas Instruments is a radiation-tolerant, high-reliability quadruple bus buffer gate with independent 3-state outputs, operating across –55°C to 125°C at 2 V–5.5 V supply. It features 8 ns max propagation delay (VCC = 3.3 V, CL = 15 pF), ±8 mA output drive, and latch-up immunity >250 mA per JESD 17 - used in space-grade data buses and avionics interface isolation.
For engineers reviewing the SN74AHC125MDREP datasheet, SN74AHC125MDREP pinout, SN74AHC125MDREP application, or SN74AHC125MDREP equivalent, key selection criteria include extended-temperature 3-state bus buffering, SOIC-14 radiation-hardened packaging, TI's EPIC™ CMOS process qualification, and compatibility with legacy AHC logic families in harsh-environment digital systems.
Technical Context
This device implements four independent noninverting buffers, each with dedicated active-low output-enable (OE) control. Each channel passes A→Y when OE is low and enters high-impedance state when OE is high - enabling bidirectional bus sharing without contention.
Designed for mission-critical operation, it uses TI's EPIC™ (Enhanced-Performance Implanted CMOS) process, supports controlled baseline manufacturing (single fab/assembly site), and meets MIL-STD-833 ESD ratings (>1000 V HBM, >150 V MM). Its absolute max ratings include –0.5 V to 7 V on VCC and inputs, ensuring robustness during power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2 V to 5.5 V - supports mixed-voltage system interfacing (e.g., 3.3 V logic driving 5 V backplane) |
| Propagation Delay (tPLH/tPHL) | 3.8 ns min / 6.5 ns max at VCC = 5 V, CL = 15 pF - enables ≤150 MHz bus operation with timing margin |
| Output Drive (IOL/IOH) | ±8 mA at VCC = 5 V - sufficient to drive 50 Ω transmission lines or fan-out to ≥10 standard AHC loads |
| Operating Temperature | –55°C to 125°C - qualified per JEDEC extended-temp standards including HAST, temperature cycling, and bond intermetallic life |
| Input Thresholds (VIH/VIL) | VIH = 3.85 V, VIL = 1.65 V at VCC = 5.5 V - ensures noise margins >0.7 V under worst-case supply and temp |
| Power Dissipation Capacitance | 14 pF at f = 1 MHz - predicts dynamic power consumption of ~0.7 mW per buffer at 10 MHz toggle rate |
Pinout & Package
SN74AHC125MDREP is housed in a 14-pin SOIC (D) package with 1.27 mm pitch, JEDEC MS-012AC compliant, moisture sensitivity level 1 (260°C peak reflow), and RoHS-compliant NiPdAu lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | OE (Active-Low Output Enable) | Independent enable control per buffer; tie high via pullup for safe power-up high-Z state |
| 2, 5, 9, 12 | A (Data Input) | Noninverting input for corresponding buffer channel |
| 3, 6, 8, 11 | Y (3-State Output) | Buffered output; high-impedance when OE = high, otherwise Y = A |
| 7 | GND | Ground reference for all logic and output stages |
| 14 | VCC | Positive supply rail; decoupling capacitor required within 10 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Extended Temperature Range | –55°C to 125°C operation with full parametric performance - eliminates derating in satellite payload electronics |
| Latch-Up Immunity | >250 mA per JESD 17 - prevents destructive latch-up during single-event transients in space radiation environments |
| ESD Robustness | >1000 V HBM, >150 V MM - sustains handling and board-level ESD events without functional interruption |
| Controlled Baseline | Single fabrication and test site - ensures consistent parametric distribution and long-term supply continuity for defense programs |
| EPIC™ Process Technology | Implanted CMOS with enhanced oxide integrity - delivers stable timing, low leakage (<40 µA ICC), and radiation tolerance |
Applications
| Avionics Data Bus Isolation | Satellite Onboard Computer I/O Expansion |
|---|---|
|
Use Scenario: Isolating ARINC 429 or MIL-STD-1553B bus drivers from processor I/O to prevent fault propagation during voltage transients. IC Role / Device Role / Timing Role: Quad 3-state buffer providing direction-controlled signal gating between microcontroller GPIO and hardened bus transceivers. Use Value: Prevents bus contention during reset or firmware crash by forcing high-Z state via OE control - critical for fault containment in DO-254 Level A systems. |
Use Scenario: Expanding FPGA I/O to interface with multiple telemetry sensors (e.g., pressure, temperature) in LEO satellite payloads. IC Role / Device Role / Timing Role: Level-shifting and fan-out buffer enabling 3.3 V FPGA to drive multiple 5 V sensor interfaces with precise timing alignment. Use Value: 3.8 ns propagation delay at 5 V ensures sub-10 ns skew across four channels - maintains synchronization in time-critical health-monitoring subsystems. |
| Defense Radar Signal Conditioning | Nuclear Plant Control System Interfacing |
|
Use Scenario: Buffering ADC output data streams in phased-array radar front-ends exposed to thermal cycling and ionizing radiation. IC Role / Device Role / Timing Role: High-speed, radiation-tolerant bus driver isolating analog-to-digital conversion results from FPGA-based beamforming logic. Use Value: Qualified per JEDEC HAST and temperature cycle testing ensures no parameter shift after 1000 cycles from –55°C to 125°C - guarantees lifetime reliability in radar shelters. |
Use Scenario: Interfacing safety PLC modules with legacy 5 V industrial sensors in Class 1 Div 1 hazardous locations. IC Role / Device Role / Timing Role: Electrically isolated bus buffer preventing ground-loop currents while maintaining deterministic 3-state control for fail-safe shutdown sequencing. Use Value: Latch-up immunity >250 mA prevents catastrophic failure during lightning-induced surges on sensor cables - meeting IEEE 1050 fault tolerance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quadruple 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AHC125MPWREP | TSSOP-14 package (4.4 mm × 5 mm), higher θJA (113°C/W), identical electrical specs and temp range | Better PCB area efficiency but lower thermal dissipation margin - suitable for compact, low-power avionics modules | Select when board space is constrained and thermal load remains <15 mW; verify reflow profile compatibility with PW footprint |
| SN54AHC125 | Military QML-38534 certified, same SOIC-14 package, identical logic function and speed, but wider qualification scope (including burn-in and lot acceptance tests) | Required for DoD procurement where QML certification is mandatory; not approved for space flight per NASA EEE-INST-002 | Choose for ground-based defense systems requiring full QML-38534 compliance; SN74AHC125MDREP is preferred for space-qualified designs |
Compared with SN74AHC125MPWREP and SN54AHC125, the SN74AHC125MDREP offers optimal balance of radiation-tolerant SOIC packaging, JEDEC-qualified extended-temperature performance, and TI's EPIC™ process stability - making it the default choice for spaceflight-qualified bus isolation where MSL-1 reflow and controlled baseline sourcing are mandatory.
Availability
SN74AHC125MDREP is available at Aetrix Electronics and suitable for avionics data bus isolation, satellite onboard computer I/O expansion, defense radar signal conditioning, and nuclear plant control system interfacing requiring stable component supply across extended temperature and radiation-exposed environments.
Supply support for SN74AHC125MDREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability logic solutions, with over 50 years of aerospace and defense component heritage.
The SN74AHC125MDREP belongs to TI's Enhanced Product (EP) logic family, engineered specifically for mission-critical applications demanding extended temperature operation, radiation tolerance, and controlled manufacturing - targeting space, aviation, and nuclear infrastructure markets.
FAQ
What is the maximum clock frequency supported by SN74AHC125MDREP in a bus interface application?
The SN74AHC125MDREP does not operate as a clocked device but as a combinational buffer. Its 3.8 ns propagation delay (VCC = 5 V, CL = 15 pF) supports reliable data transfer up to ~150 MHz in point-to-point bus configurations. For synchronous systems, timing margins must account for board trace delays and setup/hold requirements of downstream receivers - the SN74AHC125MDREP itself imposes no inherent frequency limit beyond its specified switching characteristics.
Does SN74AHC125MDREP require external pull-up resistors on OE pins, and if so, what value is recommended?
Yes - to ensure high-impedance state during power-up/power-down, each OE pin of the SN74AHC125MDREP must be tied to VCC via a pull-up resistor. TI recommends ≥10 kΩ for typical applications; the minimum value depends on the current-sinking capability of the driving source. For microcontroller-driven OE control, 4.7 kΩ provides robust noise immunity while limiting steady-state current to <0.5 mA per channel at 5 V.
Is SN74AHC125MDREP pin-compatible with commercial-grade SN74AHC125 variants?
Yes - the SN74AHC125MDREP shares identical pinout, logic function, and DC/AC electrical specifications with commercial SN74AHC125 devices in SOIC-14 packages. However, it adds extended temperature qualification (–55°C to 125°C), enhanced process controls, and radiation-related reliability testing not present in standard catalog versions.
What is the thermal resistance (θJA) of SN74AHC125MDREP in its SOIC-14 package, and how does it affect power dissipation?
The SN74AHC125MDREP in SOIC-14 (D package) has a thermal resistance θJA of 86°C/W. At maximum ambient temperature (125°C) and junction limit (150°C), this allows only ~290 mW total power dissipation. With typical ICC <40 µA and dynamic power ~0.7 mW per buffer at 10 MHz, thermal design margin is ample - no heatsink required under normal operation.
Can SN74AHC125MDREP be used in 2.5 V systems, and what are the guaranteed performance limits at that supply?
Yes - the SN74AHC125MDREP is fully specified down to 2 V VCC. At 2.5 V, VOH is guaranteed ≥2.3 V (IOH = –50 µA), VOL ≤0.2 V (IOL = 50 µA), and propagation delay increases to ≤11.5 ns (CL = 15 pF). Input thresholds scale proportionally (VIH ≈ 1.75 V, VIL ≈ 0.75 V), preserving noise margins above 0.5 V in typical 2.5 V systems.
SN74AHC125MDREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AHC
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 8mA, 8mA
- Voltage - Supply:
- 2V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SOIC
SN74AHC125MDREP FAQ
1.How can I place an order for SN74AHC125MDREP through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AHC125MDREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AHC125MDREP reliable?
The price and inventory of SN74AHC125MDREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AHC125MDREP is usually 5 days.
3.What payment methods are accepted for SN74AHC125MDREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AHC125MDREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AHC125MDREP?
SN74AHC125MDREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AHC125MDREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AHC125MDREP?
For technical support, including SN74AHC125MDREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AHC125MDREP requirements.
6.How does Aetrix verify that SN74AHC125MDREP is sourced from the original manufacturer or authorized distributors?
All SN74AHC125MDREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AHC125MDREP meets industry standards.
7.What is the process for return or replacement of SN74AHC125MDREP?
All SN74AHC125MDREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHC125MDREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AHC125MDREP part is unused and in its original packaging.
Return procedure for SN74AHC125MDREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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