My Inquiry
My Account
Texas Instruments SN74AHC125QWBQARQ1
- Part No.:
- SN74AHC125QWBQARQ1
- Manufacturer:
- Texas Instruments
- Package:
- 14-WFDFN Exposed Pad
- Datasheet:
-
SN74AHC125QWBQARQ1.pdf
- Description:
- AUTOMOTIVE4-CH2-V TO 5.5-V BUFFE
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74AHC125QWBQARQ1 from Texas Instruments is an automotive-grade quadruple bus buffer gate with independent 3-state outputs, operating across 2 V to 5.5 V supply, supporting −40°C to +125°C ambient, with 8 ns typical propagation delay at 3.3 V and ±8 mA output drive capability. It enables bidirectional data isolation in industrial motor control and PoE power management circuits.
For engineers reviewing the SN74AHC125QWBQARQ1 datasheet, SN74AHC125QWBQARQ1 pinout, SN74AHC125QWBQARQ1 application, or SN74AHC125QWBQARQ1 equivalent, this page delivers verified package mapping (WQFN-14), functional truth table, thermal resistance (RθJA = 88.3°C/W), ESD ratings (HBM ±2000 V), and automotive qualification per AEC-Q100 Grade 1.
Technical Context
The SN74AHC125QWBQARQ1 implements four independent CMOS buffer channels, each with active-low 3-state enable (OE) controlling high-impedance output state. Its EPIC™ process ensures latch-up immunity >250 mA per JESD17 and stable operation under automotive transients.
Each channel passes A→Y when OE is low; outputs enter high-Z when OE is high. The WQFN-14 package includes an exposed thermal pad-soldered to GND or left floating per TI SLUA271 guidelines-to support thermal dissipation in compact motor-drive PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2 V to 5.5 V - supports dual-rail systems and legacy 3.3 V/5 V mixed-signal interfaces |
| Propagation Delay (tPLH/tPHL) | 3.8 ns min / 6.5 ns max @ 5 V, CL = 15 pF - enables timing-critical bus buffering in PLC backplanes |
| Output Drive (IOL/IOH) | ±8 mA @ 5 V - sufficient to drive 50 Ω transmission lines or fan-out to ≥10 AHC loads |
| Operating Temperature | −40°C to +125°C - qualified for under-hood automotive ECUs and industrial motor drives |
| ESD Rating (HBM) | ±2000 V - meets AEC-Q100-002 Level 2 for robust handling in automated assembly |
| RθJA | 88.3°C/W (WQFN-14) - enables 350 mW max power dissipation without external heatsink in 2-layer boards |
| Input Capacitance (Ci) | 4–10 pF @ 5 V - minimizes capacitive loading on upstream clock/data sources |
Pinout & Package
SN74AHC125QWBQARQ1 uses a 3 mm × 2.5 mm, 0.5 mm pitch WQFN-14 package (BQA) with exposed thermal pad. Pin 1 is located in quadrant Q1 per tape-and-reel orientation; thermal pad must be soldered to PCB ground plane for optimal thermal performance per TI SLUA271.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 OE, 4 OE, 8 OE, 13 OE | Active-low 3-state enable input | Drives respective Y output to high-Z when logic high; tie to VCC via pullup for power-up safety |
| 2 A1, 5 A2, 9 A3, 12 A4 | Buffer input | Accepts CMOS-level signals; all unused inputs must be tied to VCC or GND per SCBA004 |
| 3 Y1, 6 Y2, 10 Y3, 11 Y4 | Buffer output | 3-state CMOS output with ±8 mA drive; high-Z state prevents bus contention in shared-data architectures |
| 7 GND | Ground reference | Primary return path; connects to thermal pad for enhanced heat conduction |
| 14 VCC | Supply voltage | 2–5.5 V rail; decoupling capacitor (0.1 μF ceramic) required within 3 mm of pin |
| Thermal Pad | Exposed metal pad | Must be soldered to solid GND copper pour; not electrically connected internally - no signal routing beneath |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for automotive applications with full temperature range (−40°C to +125°C) and reliability testing |
| EPIC™ process technology | Delivers latch-up immunity >250 mA and stable parametric performance across voltage/temperature corners |
| Independent 3-state control per channel | Enables selective bus isolation without affecting other channels - critical for modular PLC I/O expansion |
| Low dynamic power consumption | Cpd = 14 pF at 5 V - reduces switching current and system-level EMI in PoE-powered endpoints |
| Robust noise immunity | VIL(D) = 1.5 V, VIH(D) = 3.5 V @ 5 V - tolerates >1 V noise margin on control lines in noisy motor-drive environments |
Applications
| Motor Drive Control | Industrial Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Isolating encoder feedback and PWM command signals between MCU and gate driver ICs in BLDC motor inverters. IC Role / Device Role / Timing Role: Bidirectional bus buffer with per-channel 3-state control, enabling safe signal handoff during fault shutdown sequences. Use Value: Prevents back-driving of MCU pins during overcurrent events; ±8 mA drive sustains signal integrity over 10 cm PCB traces. |
Use Scenario: Managing data flow between CPU module and hot-swappable I/O expansion cards in modular PLC chassis. IC Role / Device Role / Timing Role: Quadruple buffer with independent OE lines allows staggered card initialization and live insertion without bus contention. Use Value: 3.8 ns propagation delay ensures deterministic timing in 10 MHz backplane buses; WQFN-14 footprint saves space in dense I/O modules. |
| Power over Ethernet (PoE) Endpoint | Automotive Flow Meter Interface |
|
Use Scenario: Level-shifting and isolating MDIO/MDC management interface between PoE PSE controller and PHY in IEEE 802.3af/at devices. IC Role / Device Role / Timing Role: Voltage-tolerant buffer (2–5.5 V) translating 3.3 V management signals to 5 V PHY side while blocking fault currents. Use Value: HBM ±2000 V rating protects against ESD events during field servicing; low Ci avoids signal degradation on 25 MHz MDIO lines. |
Use Scenario: Interfacing Hall-effect sensor outputs to automotive microcontroller ADC inputs in fuel or coolant flow meters. IC Role / Device Role / Timing Role: Signal conditioner that buffers low-amplitude sensor pulses while rejecting engine bay noise via high noise margins. Use Value: −40°C to +125°C operation ensures reliability in under-dash mounting; 88.3°C/W RθJA allows passive cooling in sealed meter housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC125AQDRQ1 | Lower VCC range (1.65–3.6 V); 3.3 V only; 5 ns tPLH @ 3.3 V | Better suited for 3.3 V-only systems; lacks 5 V tolerance and automotive temp range extension | Select when system operates exclusively at 3.3 V and requires faster switching than AHC family |
| SN74AHC125QPWRQ1 | TSSOP-14 package (5 mm × 6.4 mm); RθJA = 147.7°C/W; same electrical specs | Preferred for prototyping or manual assembly; less thermally efficient but easier to rework | Choose for lab validation or low-volume production where WQFN reflow capability is unavailable |
Compared with SN74LVC125AQDRQ1, SN74AHC125QWBQARQ1 offers wider voltage flexibility and higher temperature resilience; compared with SN74AHC125QPWRQ1, it delivers superior thermal performance in space-constrained automotive modules despite identical logic behavior.
Availability
SN74AHC125QWBQARQ1 is available at Aetrix Electronics and suitable for motor drive control, industrial PLC backplanes, and Power over Ethernet endpoint designs requiring stable component supply across extended temperature ranges and automotive lifecycle commitments.
Supply support for SN74AHC125QWBQARQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive-grade logic solutions, with over 50 years of innovation in high-reliability IC design.
SN74AHC125QWBQARQ1 belongs to TI's AHC logic family designed specifically for automotive and industrial applications demanding wide voltage operation, robust ESD immunity, and guaranteed performance across extreme temperatures.
FAQ
What is the maximum operating temperature for SN74AHC125QWBQARQ1?
The SN74AHC125QWBQARQ1 is rated for continuous operation from −40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements for automotive under-hood and industrial motor-control environments. This specification is validated across all electrical parameters in the datasheet's recommended operating conditions table.
Does SN74AHC125QWBQARQ1 support 5 V logic levels?
Yes, SN74AHC125QWBQARQ1 fully supports 5 V logic operation: its VCC range extends to 5.5 V, input voltage tolerance reaches 5.5 V, and output drive is specified at ±8 mA with VOL ≤ 0.5 V and VOH ≥ 3.8 V at 5 V - enabling direct interfacing with legacy 5 V microcontrollers and peripherals.
How should the thermal pad on SN74AHC125QWBQARQ1 be connected?
The exposed thermal pad on SN74AHC125QWBQARQ1 must be soldered to a PCB ground plane using a grid of ≥4 thermal vias (0.3 mm diameter, filled/plugged) beneath the pad, per TI SLUA271 guidelines. It is not electrically connected internally and may be tied to GND or left floating - but grounding optimizes both thermal dissipation (RθJA = 88.3°C/W) and EMI suppression.
Is SN74AHC125QWBQARQ1 pin-compatible with other SN74AHC125-Q1 variants?
SN74AHC125QWBQARQ1 shares identical pin functions and logic behavior with SOIC (D) and TSSOP (PW) variants of SN74AHC125-Q1, but its WQFN-14 (BQA) package has different mechanical dimensions and pad layout. No PCB redesign is needed only if migrating from another BQA variant; migration from D or PW packages requires board layout revision due to differing pin pitch and thermal pad presence.
What is the recommended power supply decoupling for SN74AHC125QWBQARQ1?
TI recommends a 0.1 μF X7R ceramic capacitor placed within 3 mm of the VCC pin (Pin 14) and GND (Pin 7), with short, low-inductance traces. For systems with multiple SN74AHC125QWBQARQ1 devices, add a bulk 4.7 μF tantalum or aluminum electrolytic capacitor near the power entry point to suppress low-frequency ripple.
SN74AHC125QWBQARQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AHC
- Package/Case:
- 14-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 8mA, 8mA
- Voltage - Supply:
- 2V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 14-WQFN (3x2.5)
SN74AHC125QWBQARQ1 FAQ
1.How can I place an order for SN74AHC125QWBQARQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AHC125QWBQARQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AHC125QWBQARQ1 reliable?
The price and inventory of SN74AHC125QWBQARQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AHC125QWBQARQ1 is usually 5 days.
3.What payment methods are accepted for SN74AHC125QWBQARQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AHC125QWBQARQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AHC125QWBQARQ1?
SN74AHC125QWBQARQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AHC125QWBQARQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AHC125QWBQARQ1?
For technical support, including SN74AHC125QWBQARQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AHC125QWBQARQ1 requirements.
6.How does Aetrix verify that SN74AHC125QWBQARQ1 is sourced from the original manufacturer or authorized distributors?
All SN74AHC125QWBQARQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AHC125QWBQARQ1 meets industry standards.
7.What is the process for return or replacement of SN74AHC125QWBQARQ1?
All SN74AHC125QWBQARQ1 units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHC125QWBQARQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AHC125QWBQARQ1 part is unused and in its original packaging.
Return procedure for SN74AHC125QWBQARQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74AHC125QWBQARQ1 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments
-
SN74LVC2G17DBVR
Texas Instruments
-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments
-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
