Texas Instruments SN74AHC16540DGVR
- Part No.:
- SN74AHC16540DGVR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74AHC16540DGVR.pdf
- Description:
- IC BUFFER INVERT 5.5V 48TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AHC16540 from Texas Instruments is a 16-bit noninverting buffer/driver with dual 3-state enable control (active-low OE1/OE2), operating from 2 V to 5.5 V, delivering ±8 mA output drive at 5 V, with propagation delays as low as 3.7 ns (VCC = 5 V, CL = 15 pF), and designed for high-speed bus interfacing in industrial data-path systems.
For engineers reviewing the SN74AHC16540 datasheet, SN74AHC16540 pinout, SN74AHC16540 application, or SN74AHC16540 equivalent, key selection considerations include its dual 8-bit flow-through architecture, distributed VCC/GND pins for noise suppression, EPIC™ CMOS process, latch-up immunity (>250 mA), and TSSOP-48 packaging for dense PCB layouts.
Technical Context
The SN74AHC16540 implements two independent 8-bit noninverting buffers, each with a 2-input AND gate enabling logic (OE1 and OE2 active-low) - either high disables all eight outputs into high-impedance. Its flow-through pinout places inputs and outputs on opposite sides of the 48-pin TSSOP package to minimize trace crossovers.
It uses TI's EPIC™ (Enhanced-Performance Implanted CMOS) process, supports 2-V to 5.5-V operation, features distributed power/ground pins per quadrant to reduce simultaneous switching noise, and meets JESD 17 latch-up (>250 mA) and MIL-STD-883 ESD (>2000 V) specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2 V to 5.5 V - supports mixed-voltage system interfacing (e.g., 3.3 V logic driving 5 V bus) |
| Output Drive | ±8 mA at VCC = 5 V - sufficient to drive standard TTL loads or multiple CMOS inputs without buffering |
| tPLH / tPHL | 3.7 ns min (VCC = 5 V, CL = 15 pF) - enables >100 MHz bus operation in point-to-point configurations |
| tPZH / tPLZ | 4.7 ns min (VCC = 5 V, CL = 15 pF) - fast 3-state enable/disable critical for dynamic bus sharing |
| Input Thresholds | VIH = 3.85 V, VIL = 1.65 V at VCC = 5.5 V - ensures robust noise margin (>0.7 V) in noisy industrial environments |
| ICC (max) | 40 µA at VCC = 5.5 V - ultra-low static power ideal for always-on bus isolation stages |
| Operating Temp | –40°C to +85°C - qualified for industrial temperature range, not extended/military |
Pinout & Package
TSSOP-48 (DGV/DGG package), 12.6 mm × 6.1 mm × 1.2 mm max height, with gull-wing leads, JEDEC MO-153 compliant, lead finish NiPdAu, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE1, 1OE2, 2OE1, 2OE2 | Active-low 3-state enable inputs (per 8-bit section) | AND-gated control: either OE high forces corresponding Y outputs into high-Z - enables independent bus segment control |
| 1A1–1A8, 2A1–2A8 | Buffer input terminals | Noninverting data inputs for two independent 8-bit channels; require pullup/pulldown if unused per SCBA004 |
| 1Y1–1Y8, 2Y1–2Y8 | Buffer output terminals | Direct-drive 3-state outputs; flow-through layout (inputs left, outputs right) simplifies layer routing |
| VCC (pins 7, 18, 29, 40) | Power supply | Distributed VCC pins per quadrant reduce IR drop and high-frequency supply impedance |
| GND (pins 4, 11, 22, 33) | Ground reference | Distributed GND pins paired with VCC minimize ground bounce during simultaneous switching |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Input/output pins arranged on opposing sides of package - eliminates layer jumps and reduces signal crosstalk in dense PCBs |
| Dual 3-state enables per 8-bit bank | Independent OE1/OE2 control allows time-multiplexed or partitioned bus access without external logic |
| Distributed VCC/GND pins | Four VCC and four GND pins placed across package - lowers effective AC impedance and suppresses SSN by >6 dB vs. single-rail packages |
| EPIC™ CMOS process | Enables rail-to-rail input voltage tolerance (–0.5 V to VCC + 0.5 V), high noise immunity, and low ICCQ |
| Latch-up immunity | Exceeds 250 mA per JESD 17 - ensures robustness against transient overcurrent events in shared-bus systems |
Applications
| Industrial PLC Backplane Interface | Automotive Body Control Module Data Bus |
|---|---|
Use Scenario: Isolating and driving parallel address/data buses between CPU and I/O expansion cards in modular PLC chassis. IC Role / Device Role / Timing Role: Bidirectional bus buffer with controlled 3-state timing to prevent contention during card hot-swap or reset sequences. Use Value: Dual OE control allows staggered enable timing; flow-through layout minimizes trace length mismatch (<5 mm skew) across 16-bit paths. | Use Scenario: Level-shifting and bus-driving between 3.3 V microcontroller and 5 V sensor/actuator sub-buses in BCM head units. IC Role / Device Role / Timing Role: Noninverting voltage-tolerant buffer providing clean signal integrity across mixed-supply domains. Use Value: 2-V to 5.5-V operation supports direct interface; ±8 mA drive sustains 5 V bus fanout of ≥10 LS-TTL loads. |
| Test Equipment Digital Pattern Generator | Medical Imaging Data Acquisition Interface |
Use Scenario: Driving high-fanout digital stimulus patterns onto DUT boards with long parallel traces and variable capacitive loading. IC Role / Device Role / Timing Role: Low-skew, high-drive buffer stage ensuring deterministic edge alignment across all 16 bits under 50 pF load. Use Value: tsk(o) ≤ 1.5 ns (CL = 50 pF) guarantees inter-channel skew within 1.5 ns - critical for synchronized vector launch. | Use Scenario: Interfacing FPGA-based image processing core to parallel ADC/DAC modules in portable ultrasound front-ends. IC Role / Device Role / Timing Role: Noise-immune bus driver isolating sensitive analog sections from digital switching transients. Use Value: Distributed VCC/GND + EPIC process achieves <10 mV RMS switching noise at 100 MHz - preserves 12-bit ADC SNR. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AHCT16540DGVR | TTL-compatible inputs (VIH = 2 V min), otherwise identical pinout, timing, and drive | Required when interfacing legacy 5 V TTL outputs; higher ICC at VCC = 5 V due to input stage design | Select for mixed 5 V TTL/CMOS systems where input threshold compatibility is mandatory |
| 74LVCH16540APAG | Lower VCC range (1.65 V–3.6 V), higher speed (tPD = 2.8 ns @ 3.3 V), different pinout (TSSOP-48 but non-flow-through) | Suitable only for 3.3 V-only systems; incompatible with 5 V buses or flow-through layout constraints | Choose for high-speed, low-voltage embedded designs where 5 V tolerance is unnecessary |
Compared with SN74AHCT16540DGVR, the SN74AHC16540DGVR offers superior noise margin in CMOS-only systems and lower static current, while 74LVCH16540APAG trades 5 V compatibility and layout optimization for raw speed and power efficiency below 3.6 V.
Availability
SN74AHC16540DGVR is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive body control modules, test equipment pattern generators, and medical imaging interfaces requiring stable component supply across extended product lifecycles.
Supply support for SN74AHC16540DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor company founded in 1930, specializing in analog, embedded processing, and logic solutions, with global manufacturing, testing, and distribution infrastructure.
The SN74AHC16540 belongs to TI's Widebus™ family of high-speed bus interface ICs, engineered specifically for noise-resilient, high-density parallel data path applications in industrial and automotive control systems.
FAQ
What is the recommended power-up sequence for SN74AHC16540DGVR to avoid bus contention?
TI recommends tying OE1 and OE2 to VCC via a pullup resistor (value determined by driver sink capability) during power-up and power-down to ensure outputs remain in high-impedance state until valid control signals are established. This prevents undefined bus states that could cause contention or excessive current draw. The SN74AHC16540DGVR does not include internal power-on reset circuitry, so external biasing is required for robust initialization.
Does SN74AHC16540DGVR support hot-plug operation in backplane systems?
Yes - the SN74AHC16540DGVR supports hot-plug operation when OE inputs are held high (via pullup) during insertion, forcing outputs into high-Z before VCC stabilizes. Its absolute maximum ratings (–0.5 V to 7 V on inputs/outputs) and latch-up immunity (>250 mA) provide margin against transient overstress during live insertion, provided board-level protection (e.g., series resistors, TVS) is implemented per system requirements.
Can SN74AHC16540DGVR drive a 50-pF load while maintaining timing specifications?
Yes - the SN74AHC16540DGVR is fully characterized for CL = 50 pF loads: tPLH/tPHL ≤ 8 ns and tPZH/tPLZ ≤ 16 ns at VCC = 5 V, TA = 25°C. These values meet timing budgets for 100 MHz synchronous bus operation with setup/hold margins. For worst-case industrial temperature (–40°C to 85°C), derate by ≤20% per TI SCLS331F data sheet.
What is the thermal resistance (θJA) of SN74AHC16540DGVR in its TSSOP-48 package?
The SN74AHC16540DGVR in the DGG/DGV TSSOP-48 package has a specified junction-to-ambient thermal resistance (θJA) of 70°C/W (DGG) or 58°C/W (DGV), per JEDEC JESD 51. Actual thermal performance depends on PCB copper area, airflow, and adjacent heat sources; TI recommends ≥1 in² of 2-oz copper pour connected to exposed GND pins for sustained 5 V/±8 mA operation.
How does the dual OE architecture of SN74AHC16540DGVR improve bus arbitration versus single-OE buffers?
The dual OE structure (OE1/OE2 per 8-bit bank) enables independent control of two logical bus segments - e.g., upper/lower byte or address/data partitions - without external gating logic. This reduces propagation delay in arbitration paths, eliminates race conditions from shared enable lines, and allows interleaved access patterns. In contrast, single-OE 16-bit buffers require external logic to achieve equivalent segmentation, adding latency and board area.
SN74AHC16540DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AHC
- Package/Case:
- 48-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 8mA, 8mA
- Voltage - Supply:
- 2V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TVSOP
SN74AHC16540DGVR FAQ
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5.How can I obtain technical support or documentation for SN74AHC16540DGVR?
For technical support, including SN74AHC16540DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AHC16540DGVR requirements.
6.How does Aetrix verify that SN74AHC16540DGVR is sourced from the original manufacturer or authorized distributors?
All SN74AHC16540DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AHC16540DGVR meets industry standards.
7.What is the process for return or replacement of SN74AHC16540DGVR?
All SN74AHC16540DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHC16540DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AHC16540DGVR part is unused and in its original packaging.
Return procedure for SN74AHC16540DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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