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Texas Instruments SN74AHC244MPWREP

Part No.:
SN74AHC244MPWREP
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74AHC244MPWREP.pdf
Description:
IC BUF NON-INVERT 5.5V 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,532

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Product details

Overview

SN74AHC244MPWREP from Texas Instruments is an octal 3-state buffer/driver IC designed for memory address, clock, and bus interface applications in harsh environments. It operates from 2 V to 5.5 V, supports –55°C to +125°C extended temperature range, features ±25 mA output drive, <10 ns propagation delay at 5 V, and EPIC™ enhanced-temperature CMOS process.

For engineers reviewing the SN74AHC244MPWREP datasheet, SN74AHC244MPWREP pinout, SN74AHC244MPWREP application, or SN74AHC244MPWREP equivalent, this page delivers verified electrical specs, TSSOP-20 package details, functional behavior under power-up conditions, and qualified alternatives for high-reliability industrial and aerospace designs.

Technical Context

The SN74AHC244MPWREP implements two independent 4-bit noninverting buffers with separate 3-state enable inputs (1OE, 2OE). Each section passes A-input data to Y-outputs when its OE is low; outputs enter high-impedance state when OE is high. Input thresholds scale with VCC (VIH = 0.7×VCC min, VIL = 0.3×VCC max), ensuring robust noise immunity across supply voltages.

Designed for bus-hold-free operation, it requires all unused inputs tied to VCC or GND per SCBA004 guidance. Its EPIC™ process delivers latch-up immunity >250 mA (JESD 17) and ESD protection >1500 V (MIL-STD-833), making it suitable for systems requiring radiation-tolerant logic in extended thermal profiles.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2 V to 5.5 V - supports mixed-voltage system interfacing and brown-out tolerant operation
Operating Temp –55°C to +125°C - qualified per JEDEC/industry standards including HAST, temp cycle, and bond intermetallic life
tPLH / tPHL 3.9 ns (min) @ 5 V, 15 pF - enables reliable 100+ MHz bus timing in high-speed digital backplanes
IOL / IOH ±8 mA @ 5 V - drives standard TTL loads and multiple CMOS inputs without external buffering
IOZ (Off-State Leakage) ±2.5 µA @ 5.5 V - ensures minimal bus contention during 3-state transitions in multiplexed architectures
Input Capacitance (Ci) 2 pF (typ) @ 5 V - reduces switching noise and dynamic loading on upstream drivers
Power Dissipation Cap (Cpd) 8.6 pF @ 5 V - enables accurate dynamic power estimation for thermal design in sealed enclosures

Pinout & Package

TSSOP-20 package (PW), 0.65 mm pitch, 6.5 mm × 4.4 mm body, exposed pad not present, RoHS-compliant NiPdAu finish, MSL Level-1 (260°C peak reflow).

Pin/Terminal Circuit Role Design Meaning
1, 19 1OE, 2OE Active-low 3-state enable inputs - must be pulled up to VCC via resistor during power-up to prevent bus contention
2–5, 11–14 1A1–1A4, 2A1–2A4 Noninverting data inputs - accept 2-V to 5.5-V logic levels; require termination if floating
18, 16, 14, 12, 9, 7, 5, 3 1Y1–1Y4, 2Y1–2Y4 3-state buffered outputs - high-impedance when OE high; sink/source ±8 mA at 5 V
10 GND Ground reference - connect directly to low-impedance plane; decoupling capacitor required near pin
20 VCC Supply voltage - bypass with 0.1 µF ceramic capacitor to GND; supports 2–5.5 V operation

Key Features

Feature Design Value
Extended Temperature Range –55°C to +125°C operation with full parametric compliance - eliminates derating calculations for space-grade or downhole electronics
High-Drive 3-State Outputs ±8 mA drive at 5 V with <10 ns propagation delay - replaces discrete transistor buffers in legacy bus designs
Latch-Up Immunity >250 mA per JESD 17 - prevents destructive failure during transient overvoltage events in motor-control I/O stages
ESD Robustness >1500 V HBM, >150 V MM - sustains handling and board-level ESD without shielding in ruggedized test equipment
Controlled Baseline Single assembly/test site and single fabrication site - ensures consistent parametric distribution and long-term supply continuity

Applications

Memory Address Buffering Industrial Bus Transceiver

Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM/Flash devices in a PLC mainboard operating at –40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Noninverting octal buffer isolating MCU address pins from capacitive bus load; enables clean edge transitions at 20 MHz clock rate.

Use Value: Eliminates signal integrity issues caused by trace capacitance (>50 pF total), reducing setup/hold violations and enabling deterministic timing closure.

Use Scenario: Bidirectional data routing between FPGA and legacy parallel ADC/DAC modules in avionics sensor acquisition units.

IC Role / Device Role / Timing Role: Dual 4-bit 3-state driver enabling time-multiplexed read/write control of shared 8-bit data bus under FPGA arbitration logic.

Use Value: Prevents bus contention during state transitions using independent OE controls, eliminating need for external direction logic or bus switches.

High-Reliability Clock Distribution Aerospace Power Sequencing Interface

Use Scenario: Fan-out of 3.3 V clock signals to six synchronous logic blocks in a radiation-hardened satellite payload controller.

IC Role / Device Role / Timing Role: Low-skew buffer replicating master clock with matched tPLH/tPHL (<0.5 ns skew) across all eight outputs.

Use Value: Maintains sub-nanosecond clock alignment critical for JESD204B-like deterministic latency in multi-channel ADC sampling.

Use Scenario: Interfacing MIL-STD-1553B bus controller to discrete power rail supervisors in launch vehicle telemetry systems.

IC Role / Device Role / Timing Role: Level-shifting and isolation buffer translating 5 V control signals to 3.3 V supervisor enable inputs while surviving thermal cycling.

Use Value: Guarantees reliable power sequencing across –55°C to +125°C without parameter drift or latch-up, meeting DO-160 Section 22 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74AHC244MDWREP SOIC-20 package (DW), θJA = 58°C/W vs. 83°C/W for PW; same electrical specs and temp range Better thermal performance in convection-cooled PCBs; larger footprint limits high-density layouts Select when board layout allows SOIC and thermal margin is constrained below 40°C ambient rise
SN54AHC244 Military QML-38534 certified; identical logic function but tested to –55°C to +125°C with stricter screening (e.g., burn-in, lot acceptance tests) Required for DoD/aerospace programs mandating MIL-PRF-38534 Class V or S compliance Choose only when contractual specifications explicitly require QML certification - adds cost and lead time without electrical benefit

Compared with SN74AHC244MPWREP, SN74AHC244MDWREP offers superior thermal dissipation in open-frame industrial controllers, while SN54AHC244 provides mandatory military qualification documentation and screening rigor - neither is pin-compatible without layout revision due to differing package footprints and land patterns.

Availability

SN74AHC244MPWREP is available at Aetrix Electronics and suitable for industrial automation controllers, aerospace telemetry interfaces, high-reliability memory subsystems, and extended-temperature instrumentation requiring stable component supply across long production lifecycles.

Supply support for SN74AHC244MPWREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, precision, and long-term support.

The SN74AHC244MPWREP belongs to TI's enhanced-product (EP) logic family, engineered specifically for mission-critical applications demanding extended temperature operation, controlled manufacturing baseline, and full qualification pedigree.

FAQ

What is the maximum recommended operating voltage for SN74AHC244MPWREP?

The absolute maximum supply voltage for SN74AHC244MPWREP is 7 V, but the recommended operating range is strictly 2 V to 5.5 V per the datasheet. Operating above 5.5 V voids parametric guarantees and risks permanent damage due to oxide breakdown. All DC and AC specifications - including VOH, VOL, and propagation delay - are validated only within the 2–5.5 V window. For 5.5 V operation, ensure input signals remain ≤5.5 V and use appropriate decoupling.

Does SN74AHC244MPWREP support hot-swap or live-insertion?

SN74AHC244MPWREP does not include built-in hot-swap protection circuitry such as slew-rate limiting or undervoltage lockout. However, its 3-state outputs and high-impedance disable mode allow safe insertion into powered-backplane systems when OE is held high during insertion. TI recommends tying OE to VCC through a 10-kΩ pullup resistor and verifying bus settling time with oscilloscope capture before enabling data flow. No current-limiting series resistors are required on Y outputs for typical 50-pF loads.

How should unused inputs be handled on SN74AHC244MPWREP?

All unused inputs on SN74AHC244MPWREP - including A1–A4 and OE pins not in use - must be tied to either VCC or GND to prevent floating nodes that cause excessive ICC current, oscillation, or undefined output states. TI's application report SCBA004 confirms that unconnected CMOS inputs increase dynamic power and may trigger parasitic thyristor action. For OE pins, tie to VCC via pullup; for A inputs, connect directly to GND or VCC depending on desired default pass-through state.

What is the thermal resistance (θJA) of SN74AHC244MPWREP in its TSSOP-20 package?

The junction-to-ambient thermal resistance (θJA) for SN74AHC244MPWREP in the TSSOP-20 (PW) package is 83°C/W, measured per JESD 51-7 on a standard 4-layer JEDEC test board. This value assumes no copper pour or thermal vias beneath the package. To achieve lower effective θJA, add ≥20 thermal vias (0.3-mm diameter) under the exposed pad area (if present - note: PW has no exposed pad) and extend copper beyond the package outline. Derate power dissipation linearly above 25°C ambient using this θJA value.

Is SN74AHC244MPWREP compatible with 1.8-V logic systems?

No, SN74AHC244MPWREP is not compatible with 1.8-V logic systems. Its minimum specified VCC is 2 V, and input thresholds (VIH ≥ 0.7×VCC, VIL ≤ 0.3×VCC) yield VIH(min) = 1.4 V at 2 V - insufficient margin for reliable recognition of 1.8-V logic highs. Additionally, output VOH at 2 V is only 1.9 V (min), failing to meet 1.8-V system VIH requirements. Use SN74LVC244A or SN74AVC244 for true 1.8-V interfacing with level translation capability.

SN74AHC244MPWREP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AHC
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
8mA, 8mA
Voltage - Supply:
2V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP

SN74AHC244MPWREP FAQ

1.How can I place an order for SN74AHC244MPWREP through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74AHC244MPWREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74AHC244MPWREP reliable?

The price and inventory of SN74AHC244MPWREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AHC244MPWREP is usually 5 days.

3.What payment methods are accepted for SN74AHC244MPWREP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AHC244MPWREP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74AHC244MPWREP?

SN74AHC244MPWREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74AHC244MPWREP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74AHC244MPWREP?

For technical support, including SN74AHC244MPWREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AHC244MPWREP requirements.

6.How does Aetrix verify that SN74AHC244MPWREP is sourced from the original manufacturer or authorized distributors?

All SN74AHC244MPWREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AHC244MPWREP meets industry standards.

7.What is the process for return or replacement of SN74AHC244MPWREP?

All SN74AHC244MPWREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHC244MPWREP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74AHC244MPWREP part is unused and in its original packaging.

Return procedure for SN74AHC244MPWREP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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