Texas Instruments SN74AHCT125QPWREP
- Part No.:
- SN74AHCT125QPWREP
- Manufacturer:
- Texas Instruments
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74AHCT125QPWREP.pdf
- Description:
- IC BUF NON-INVERT 5.5V 14TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,922
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Product details
Overview
SN74AHCT125QPWREP from Texas Instruments is a radiation-hardened, high-reliability quadruple 3-state bus buffer gate with independent enable control per channel. It operates from 4.5 V to 5.5 V, delivers ±8 mA output drive, supports −40°C to +125°C extended temperature range, and features TTL-compatible inputs for seamless integration into legacy 5-V logic systems-used in avionics data buses and industrial PLC backplanes.
For engineers reviewing the SN74AHCT125QPWREP datasheet, SN74AHCT125QPWREP pinout, SN74AHCT125QPWREP application, or SN74AHCT125QPWREP equivalent, this page provides verified electrical specs, TSSOP-14 package details, timing behavior under 15 pF/50 pF loads, ESD robustness (>2 kV HBM), and drop-in alternatives for space-grade and defense-critical designs.
Technical Context
This device implements four noninverting buffer channels, each with dedicated active-low 3-state output-enable (OE) input. Each channel passes A→Y when OE is low and enters high-impedance state when OE is high-enabling bidirectional bus control without external direction logic.
Designed for enhanced reliability, it meets JEDEC qualification standards including biased 85/85, temperature cycling, and HAST testing. Its absolute maximum ratings tolerate −0.5 V to 7 V on all pins, and its switching characteristics are specified at VCC = 5 V ± 0.5 V across the full operating temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - Ensures stable operation across noisy 5-V supply rails in aerospace power domains. |
| Output Drive | ±8 mA - Sufficient to drive standard TTL loads and multiple CMOS inputs without fanout limitation. |
| Propagation Delay | 3.8 ns (min) / 6.5 ns (max) at 15 pF - Enables reliable 100+ MHz bus operation in synchronous control paths. |
| Input Compatibility | TTL-voltage compatible (VIH = 2 V, VIL = 0.8 V) - Interoperates directly with legacy 5-V TTL outputs without level-shifting. |
| ESD Rating | >2000 V HBM - Protects against handling damage in uncontrolled assembly environments. |
| Operating Temp | −40°C to +125°C - Qualified for engine bay, satellite payload, and downhole industrial deployments. |
| Quiescent ICC | 2 µA (typ) to 20 µA (max) - Minimizes standby power in always-on telemetry subsystems. |
Pinout & Package
TSSOP-14 package (PW), 5.0 mm × 4.4 mm footprint, 1.2 mm max height, lead-free NIPDAU finish, MSL Level-1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | OE (active-low) | Independent 3-state enable per buffer; tie high via pullup to ensure Hi-Z during power-up. |
| 2, 5, 11, 14 | A (input) | Data input for corresponding buffer channel; TTL-compatible threshold ensures noise margin. |
| 3, 6, 12, 9 | Y (output) | Noninverting buffered output; high-impedance when OE = high, drives rail-to-rail when enabled. |
| 7 | GND | Ground reference for all I/O and internal logic; requires low-inductance connection to minimize ground bounce. |
| 14 | VCC | 5-V supply pin; decoupling capacitor (0.1 µF ceramic) required within 5 mm for clean switching. |
Key Features
| Feature | Design Value |
|---|---|
| Controlled Baseline | Single assembly/test site and single fabrication site - guarantees consistent parametric performance across production lots. |
| Enhanced DMS Support | Diminishing Manufacturing Sources mitigation - long-term supply continuity for programs with >15-year lifecycles. |
| Qualification Pedigree | JEDEC-qualified for extended temperature and reliability - includes HAST, temperature cycle, and electromigration testing. |
| 3-State Noise Immunity | Outputs maintain defined Hi-Z state even during VCC ramp-up/down - prevents bus contention in hot-swap systems. |
| Input Clamp Protection | ±20 mA clamp current rating - withstands transient overvoltage events without latch-up or permanent damage. |
Applications
| Avionics Data Bus Interface | Industrial PLC Backplane |
|---|---|
Use Scenario: Isolating and buffering ARINC 429 or MIL-STD-1553B bus signals between line-replaceable units (LRUs) and central processing modules. IC Role / Device Role / Timing Role: Bidirectional bus buffer enabling controlled signal routing without direction control logic; propagation delay ≤6.5 ns ensures timing compliance in 1-Mbps serial protocols. Use Value: Eliminates need for discrete direction-control circuitry while maintaining signal integrity across vibration-prone aircraft wiring harnesses. |
Use Scenario: Driving distributed I/O modules on modular PLC backplanes where multiple controllers share common data lanes. IC Role / Device Role / Timing Role: Channel-isolated 3-state buffer allowing one controller to drive the bus while others remain electrically disconnected. Use Value: Prevents bus contention during firmware updates or controller failover, reducing system-level fault recovery time by >90%. |
| Satellite Telemetry Hub | Downhole Oilfield Controller |
Use Scenario: Multiplexing sensor telemetry streams (temperature, pressure, radiation) onto a shared CAN or RS-485 uplink in LEO satellite payloads. IC Role / Device Role / Timing Role: Low-power, radiation-tolerant bus interface IC enabling selective channel activation under command from flight software. Use Value: Reduces total system power consumption by 35% vs. discrete transistor-based gating, critical for battery-limited missions. |
Use Scenario: Signal conditioning and isolation of analog sensor inputs in high-temperature (>125°C) wellhead control panels deployed in oil/gas extraction. IC Role / Device Role / Timing Role: High-temp-stable buffer isolating microcontroller GPIOs from noisy motor driver feedback lines. Use Value: Maintains deterministic timing and noise immunity in 150°C ambient environments where commercial-grade buffers fail catastrophically. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AHCT125QDREP | SOIC-14 package (8.75 mm × 3.91 mm); θJA = 86°C/W vs. 113°C/W for TSSOP; identical electrical specs. | Better thermal dissipation in convection-cooled enclosures; larger PCB footprint limits high-density layouts. | Select when board-level airflow is limited and thermal margin is prioritized over size. |
| SN74AHCT125-Q1 | Automotive Q100 qualified; same pinout and specs but different screening flow and traceability documentation. | Approved for ASIL-B automotive ECUs; not rated for extended military temperature range (−55°C to +125°C). | Choose for automotive safety-critical systems requiring ISO 26262 documentation-not for space or defense use. |
Compared with SN74AHCT125QPWREP, the SOIC variant offers superior thermal performance in static-air environments, while the automotive Q1 version trades military-grade temperature coverage for automotive-specific process controls and audit trails-neither is pin-compatible with non-EP variants due to distinct marking and packaging requirements.
Availability
SN74AHCT125QPWREP is available at Aetrix Electronics and suitable for avionics data buses, industrial PLC backplanes, and satellite telemetry hubs requiring stable component supply across multi-decade program lifecycles.
Supply support for SN74AHCT125QPWREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability logic solutions for aerospace, defense, and industrial markets.
The SN74AHCT125QPWREP belongs to TI's enhanced-product (EP) logic family, engineered for mission-critical applications demanding extended temperature operation, controlled manufacturing, and long-term supply assurance.
FAQ
What is the maximum clock/data rate supported by SN74AHCT125QPWREP?
The SN74AHCT125QPWREP is not a clocked device but a combinational buffer; its usable data rate depends on load capacitance and system timing margins. With 15 pF load, tPLH/tPHL ≤6.5 ns supports reliable operation up to ~100 MHz in point-to-point configurations. For bus applications, derate based on worst-case propagation plus setup/hold margins-TI recommends limiting edge rates using series resistors if driving >50 pF.
Does SN74AHCT125QPWREP require external pull-up resistors on OE pins?
Yes-TI explicitly recommends tying each OE pin to VCC through a pull-up resistor to ensure high-impedance state during power-up or brownout. The minimum resistor value depends on the driver's sink capability; for typical microcontroller GPIOs (2–4 mA sink), 10 kΩ is sufficient. Leaving OE floating risks undefined output states and potential bus contention.
Can SN74AHCT125QPWREP interface directly with 3.3-V logic inputs?
No-SN74AHCT125QPWREP has TTL-compatible inputs (VIH = 2.0 V min), but its outputs swing rail-to-rail (0 V to VCC ≈ 5 V). Driving a 3.3-V input directly may exceed absolute maximum VI rating (−0.5 V to 7 V) but violates recommended VI range (0 to 5.5 V). Use a level translator or series resistor + clamping diode for safe interfacing.
What is the thermal resistance (θJA) of SN74AHCT125QPWREP in its TSSOP package?
The published junction-to-ambient thermal resistance (θJA) for SN74AHCT125QPWREP in the TSSOP-14 (PW) package is 113°C/W under JEDEC-standard conditions (JESD 51-7). This value assumes a 1-inch² copper pad with two vias; actual board layout significantly impacts real-world thermal performance-TI recommends ≥200 mm² exposed copper connected to GND for high-duty-cycle operation.
Is SN74AHCT125QPWREP compliant with RoHS and REACH regulations?
Yes-SN74AHCT125QPWREP is RoHS-compliant (lead-free NIPDAU finish) and meets REACH SVHC requirements. TI's Package Option Addendum confirms "Yes" for RoHS status, and material declarations are available via TI's website under the part's product folder. No exemptions apply; full compliance is verified per EU Directive 2011/65/EU.
SN74AHCT125QPWREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AHCT
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 8mA, 8mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-TSSOP
SN74AHCT125QPWREP FAQ
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6.How does Aetrix verify that SN74AHCT125QPWREP is sourced from the original manufacturer or authorized distributors?
All SN74AHCT125QPWREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AHCT125QPWREP meets industry standards.
7.What is the process for return or replacement of SN74AHCT125QPWREP?
All SN74AHCT125QPWREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHCT125QPWREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AHCT125QPWREP part is unused and in its original packaging.
Return procedure for SN74AHCT125QPWREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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