Texas Instruments SN74AHCT16244DLR
- Part No.:
- SN74AHCT16244DLR
- Manufacturer:
- Texas Instruments
- Package:
- 48-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74AHCT16244DLR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 48SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,423
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Product details
Overview
SN74AHCT16244DLR from Texas Instruments is a 16-bit noninverting 3-state buffer/driver in SSOP-48 package, operating at 4.5–5.5 V with TTL-compatible inputs (VIH = 2 V, VIL = 0.8 V), 8 mA output drive, and propagation delay ≤10.5 ns (CL = 15 pF). It enables high-density bus interfacing in telecom infrastructure and industrial control systems.
For engineers reviewing the SN74AHCT16244DLR datasheet, SN74AHCT16244DLR pinout, SN74AHCT16244DLR application, or SN74AHCT16244DLR equivalent, key selection criteria include 3-state output control per 4-bit group, ±25 mA output current rating, -40°C to 125°C operating range, and SSOP-48 thermal resistance (RθJA = 64.6°C/W).
Technical Context
The SN74AHCT16244DLR implements four independent 4-bit noninverting buffers, each with dedicated active-low output-enable (OE) control (1OE–4OE). Its EPIC™ CMOS process ensures latch-up immunity >250 mA and ESD protection >2000 V HBM.
Distributed VCC/GND pins minimize switching noise; flow-through architecture supports optimized PCB routing. Input overvoltage tolerance up to 5.5 V enables safe 3.3 V-to-5 V level translation without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - Ensures compatibility with standard 5 V logic rails and margin for ripple. |
| Input Thresholds | VIH = 2 V, VIL = 0.8 V - Guarantees reliable recognition of TTL-level signals from legacy or mixed-voltage systems. |
| Output Drive | ±8 mA (IOH/IOL) - Sufficient for driving multiple CMOS loads or short traces without signal degradation. |
| Propagation Delay | tPLH/tPHL ≤ 10.5 ns @ CL = 15 pF - Supports 50+ MHz bus operation with timing margin. |
| Operating Temp | –40°C to 125°C - Qualified for extended industrial and automotive under-hood environments. |
| ESD Rating | 2000 V HBM - Meets MIL-STD-883 requirement for robust handling in manufacturing and field service. |
| Quiescent Current | ICC ≤ 40 µA - Enables low-power standby in always-on systems without significant leakage penalty. |
Pinout & Package
SSOP-48 (DL) package: 12.50 mm × 6.10 mm body, 0.5 mm pitch, 1.2 mm max height, JEDEC MO-153 compliant. Pin 1 marked by beveled corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE–4OE | Active-low output enable | Independently disables 4-bit output groups (Y1–Y4 per section); tie to VCC via pullup for power-up high-Z safety. |
| 1A1–4A4 | Buffer input | 16 TTL-compatible inputs grouped as four 4-bit channels; accepts 0–5.5 V with no damage. |
| 1Y1–4Y4 | 3-state noninverting output | 16 outputs with symmetrical drive; high-Z state activated when corresponding OE is high. |
| VCC (Pins 7,18,31,42) | Power supply | Distributed VCC pins reduce simultaneous switching noise and improve decoupling effectiveness. |
| GND (Pins 4,10,15,21,28,34,39,45) | Ground reference | Eight GND pins provide low-inductance return paths and minimize ground bounce across all 16 drivers. |
Key Features
| Feature | Design Value |
|---|---|
| TTL-Voltage Compatibility | Accepts 0.8 V/2 V input thresholds - eliminates need for level shifters when interfacing with legacy 5 V TTL or microcontrollers. |
| Distributed Power/Ground | Four VCC and eight GND pins - reduces voltage droop and ground bounce during concurrent switching of all 16 outputs. |
| Flow-Through Architecture | Input and output pins arranged on opposite sides - enables straight PCB trace routing, minimizing crosstalk and stub length. |
| Latch-Up Immunity | >250 mA per JESD17 - prevents destructive latch-up during transient overvoltage or hot-insertion events. |
| Slow Edge Rate Control | Controlled slew rate - suppresses output ringing and EMI in unterminated or lightly loaded transmission lines. |
Applications
| Telecom Infrastructure | Industrial Control Systems |
|---|---|
Use Scenario: Address/data bus buffering between FPGA and memory modules in base station backplanes. IC Role / Device Role / Timing Role: 16-bit 3-state buffer isolating high-speed memory access paths while enabling bus sharing among multiple controllers. Use Value: Distributed VCC/GND pins maintain signal integrity at 50+ MHz clock rates; 125°C rating supports fanless enclosure operation. | Use Scenario: I/O expansion for PLC CPU modules requiring isolation between field-side sensors and logic-side processors. IC Role / Device Role / Timing Role: Level-translating driver converting 3.3 V controller outputs to 5 V-compatible industrial bus standards (e.g., RS-485 transceiver control lines). Use Value: TTL-compatible inputs accept direct connection to microcontroller GPIO; ±25 mA drive supports long cable runs without repeaters. |
| Electronic Point-of-Sale Terminals | Motor Drive Interface Boards |
Use Scenario: Parallel interface management between ARM-based POS processor and receipt printer/EMV card reader peripherals. IC Role / Device Role / Timing Role: Bidirectional bus buffer enabling shared data path between host and peripherals with independent OE control per function block. Use Value: Four independent OE pins allow selective activation of printer control, card reader status, and display update lines - reducing software overhead. | Use Scenario: Isolation and drive enhancement for microcontroller PWM outputs controlling gate drivers in BLDC motor inverters. IC Role / Device Role / Timing Role: Noninverting buffer amplifying low-current MCU outputs to robust 8 mA signals capable of charging gate capacitance quickly. Use Value: 10.5 ns max propagation delay preserves PWM edge fidelity; 125°C rating matches motor controller ambient temperature requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AHCT16244DGGR | TSSOP-48 package (12.5 × 4.4 mm); RθJA = 72.5°C/W; same electrical specs. | Better suited for space-constrained designs where board area is critical; slightly higher thermal resistance limits high-power density layouts. | Select DGGR when footprint reduction outweighs thermal performance needs; verify layout cooling for sustained 16-bit switching. |
| SN74AHCT16244DGVR | TVSOP-48 package (9.7 × 4.4 mm); RθJA = 83.5°C/W; identical logic and timing behavior. | Optimized for ultra-thin consumer electronics; lower profile (1.2 mm max) but reduced thermal mass increases junction temperature rise. | Choose DGVR only in thermally managed environments (e.g., forced air, heatsinking) or intermittent duty cycles. |
Compared with SN74AHCT16244DGGR and SN74AHCT16244DGVR, the SN74AHCT16244DLR offers the lowest thermal resistance (64.6°C/W) and largest pad area for solder joint reliability-critical for industrial systems requiring long-term operational stability without active cooling.
Availability
SN74AHCT16244DLR is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control systems, and electronic point-of-sale terminals requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for SN74AHCT16244DLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of experience in high-reliability industrial and automotive IC design.
The SN74AHCT16244DLR belongs to TI's Widebus™ family of high-density logic devices, engineered specifically to improve bus loading, noise immunity, and PCB layout efficiency in memory address, clock distribution, and system interconnect applications.
FAQ
What is the maximum output current per pin for the SN74AHCT16244DLR?
The SN74AHCT16244DLR supports ±25 mA continuous output current per pin, as specified in its Absolute Maximum Ratings table. However, for reliable operation within recommended conditions, the device is characterized for ±8 mA (IOL/IOH) - this is the guaranteed drive strength across –40°C to 125°C and ensures timing compliance and signal integrity. Exceeding ±8 mA may increase propagation delay or cause excessive heating.
Does the SN74AHCT16244DLR support 3.3 V input logic levels?
Yes, the SN74AHCT16244DLR accepts 3.3 V logic inputs reliably. Its TTL-compatible input thresholds (VIH = 2 V min, VIL = 0.8 V max) ensure correct recognition of 3.3 V CMOS high levels. This makes the SN74AHCT16244DLR ideal for 3.3 V-to-5 V level translation without external components, as confirmed in TI's Application Information section.
How should unused inputs be handled on the SN74AHCT16244DLR?
All unused inputs on the SN74AHCT16244DLR must be tied to either VCC or GND to prevent floating states that could cause increased ICC, erratic outputs, or EMI. TI explicitly recommends this in Section 7.3 and Layout Guidelines (Section 12.1). Leaving inputs unconnected violates the Recommended Operating Conditions and risks undefined functional behavior - especially critical in high-noise industrial environments where the SN74AHCT16244DLR is commonly deployed.
What is the thermal resistance (RθJA) of the SN74AHCT16244DLR in its SSOP-48 package?
The SN74AHCT16244DLR in SSOP-48 (DL) package has a junction-to-ambient thermal resistance (RθJA) of 64.6°C/W, as documented in Section 7.4 of the datasheet. This value is measured under standard JEDEC test conditions (single-layer board, 1 in² copper pad). It is the lowest RθJA among all SN74AHCT16244 package variants, making the SN74AHCT16244DLR the preferred choice for thermally demanding applications.
Can the SN74AHCT16244DLR be used in automotive applications?
The SN74AHCT16244DLR is qualified for operation from –40°C to 125°C and meets JESD17 latch-up and MIL-STD-883 ESD requirements, but it is not AEC-Q100 qualified. While its temperature range and robustness support under-hood industrial use (e.g., motor drives), TI does not certify the SN74AHCT16244DLR for automotive safety-critical systems. For automotive applications, consult TI's AEC-Q100-qualified alternatives or perform full qualification per your OEM's requirements.
SN74AHCT16244DLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AHCT
- Package/Case:
- 48-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 8mA, 8mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-SSOP
SN74AHCT16244DLR FAQ
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7.What is the process for return or replacement of SN74AHCT16244DLR?
All SN74AHCT16244DLR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHCT16244DLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AHCT16244DLR part is unused and in its original packaging.
Return procedure for SN74AHCT16244DLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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