Texas Instruments SN74AHCT16540DGVR
- Part No.:
- SN74AHCT16540DGVR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74AHCT16540DGVR.pdf
- Description:
- IC BUFFER INVERT 5.5V 48TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AHCT16540 from Texas Instruments is a 16-bit noninverting buffer/driver with dual 3-state control inputs (OE1, OE2), TTL-compatible inputs, and CMOS outputs operating at 4.5–5.5 V. It features flow-through pinout, distributed VCC/GND for noise suppression, and is rated for –40°C to 85°C. Used in wide-data-path bus interfacing between FPGAs and memory subsystems.
For engineers reviewing the SN74AHCT16540 datasheet, SN74AHCT16540 pinout, SN74AHCT16540 application, or SN74AHCT16540 equivalent, key selection criteria include 3-state timing (tPZH/tPHZ ≤ 12 ns @ 50 pF), ±8 mA drive strength, latch-up immunity (>250 mA), ESD robustness (>2 kV HBM), and TSSOP-48 package compatibility with high-density PCB layouts.
Technical Context
This device implements two independent 8-bit noninverting buffers, each controlled by a 2-input AND gate with active-low OE1/OE2 inputs-ensuring high-impedance output if either enable is high. The EPIC™ process enables TTL-level input compatibility while maintaining CMOS output swing and low static current.
Its flow-through architecture places inputs on one side and outputs on the opposite side of the 48-pin TSSOP package, minimizing trace crossovers. Distributed power/ground pins reduce simultaneous switching noise, and the design exceeds JESD 17 latch-up and MIL-STD-883 ESD specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage (VCC) | 4.5 V to 5.5 V - Ensures stable operation across industrial-grade 5 V rails with ±10% tolerance. |
| Input voltage compatibility | TTL-level (VIL ≤ 0.8 V, VIH ≥ 2 V) - Directly interfaces legacy 5 V TTL logic without level shifters. |
| Output drive (IOL/IOH) | ±8 mA - Sufficient to drive 50-pF loads with <9.5 ns propagation delay, supporting 20+ MHz bus signaling. |
| Propagation delay (tPLH/tPHL) | 1 ns (min) to 9.5 ns (max) @ 50 pF - Enables precise timing budgeting in synchronous data paths. |
| 3-state enable/disable time | tPZH/tPHZ ≤ 12 ns @ 50 pF - Guarantees fast bus release and acquisition for time-critical arbitration. |
| Operating temperature | –40°C to +85°C - Qualified for industrial ambient environments without derating. |
| ESD rating (HBM) | >2000 V - Reduces risk of handling damage during assembly and field service. |
Pinout & Package
SN74AHCT16540 is packaged in a 48-pin Thin Shrink Small-Outline Package (TSSOP-DGG), 12.5 mm × 6.1 mm × 1.2 mm, with 0.5 mm pitch and exposed thermal pad (not electrically connected). Pin 1 identifier located at top-left corner per JEDEC MO-153.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE1, 1OE2, 2OE1, 2OE2 | Active-low 3-state enable inputs (2 per 8-bit section) | AND-gated control: output goes high-Z if either OE is high - supports flexible bus arbitration and hot-swap isolation. |
| 1A1–1A8, 2A1–2A8 | Noninverting data inputs | Accept TTL-voltage signals; internally buffered to drive corresponding Y outputs with gain and noise margin. |
| 1Y1–1Y8, 2Y1–2Y8 | Noninverting 3-state outputs | CMOS-compatible swing (VOL ≤ 0.44 V @ 8 mA, VOH ≥ 3.8 V @ –8 mA) into 50-pF loads. |
| VCC (Pins 7, 18, 25, 36, 47) | Power supply | Distributed VCC pins minimize IR drop and high-frequency impedance, reducing ground bounce in multi-bit switching. |
| GND (Pins 4, 10, 15, 21, 29, 33, 40, 44) | Ground reference | Eight dedicated GND pins interleaved with VCC and I/O - lowers loop inductance and suppresses simultaneous switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through pinout | Inputs on left side (Pins 1–24), outputs on right side (Pins 25–48) - eliminates layer jumps and reduces crosstalk in dense routing. |
| Dual independent 3-state controls | Two 2-input AND gates (OE1/OE2 per 8-bit bank) - enables selective gating of upper/lower byte without external logic. |
| EPIC™ process technology | Enhanced-Performance Implanted CMOS - delivers TTL input thresholds with CMOS output drive and low ICC (≤40 µA max). |
| Latch-up immunity | >250 mA per JESD 17 - prevents destructive latch-up during transient overvoltage or hot-insertion events. |
| Thermal performance | θJA = 70°C/W (DGG) - supports continuous operation at full drive strength in compact industrial enclosures. |
Applications
| Memory Bus Interface | FPGA-to-ASIC Data Bridge |
|---|---|
Use Scenario: Bidirectional data transfer between microcontroller and parallel SRAM/Flash using shared address/data bus. IC Role / Device Role / Timing Role: Unidirectional buffer isolating MCU data lines from memory during write cycles; enables clean bus turn-around via synchronized OE control. Use Value: Eliminates bus contention with sub-10 ns enable/disable timing and ensures signal integrity across 16-bit paths up to 20 MHz. |
Use Scenario: Level-shifting and fanout buffering between Xilinx Artix FPGA I/O banks and legacy ASIC peripherals. IC Role / Device Role / Timing Role: Noninverting driver translating 3.3 V LVTTL FPGA outputs to 5 V TTL-compatible inputs on ASIC; provides 8 mA drive per line. Use Value: Maintains setup/hold margins with tPLH/tPHL ≤ 9.5 ns and supports mixed-voltage system integration without external resistors. |
| Industrial PLC Backplane | Test Equipment Signal Routing |
Use Scenario: Isolating modular I/O cards from central controller bus in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: 16-bit bus buffer with independent OE control per byte - allows hot-swap detection and card-specific bus enablement. Use Value: High ESD immunity (>2 kV HBM) and –40°C to +85°C rating ensure reliability in electrically noisy factory environments. |
Use Scenario: Multiplexing DUT signals to multiple measurement instruments (oscilloscope, logic analyzer, DMM) in automated test systems. IC Role / Device Role / Timing Role: 3-state output selector enabling one instrument to access the bus while others remain isolated. Use Value: Fast tPZL/tPLZ ≤ 12 ns ensures minimal signal interruption during instrument switching, preserving waveform fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AHCT16244DGVR | Noninverting, but with individual output-enable per 4-bit group (4 × OE), not dual-byte OE. | Better suited for fine-grained bus partitioning; less optimal for byte-wide memory interface control. | Choose when per-nibble enable granularity is required over byte-level synchronization. |
| 74LVTH16244DGGR | Lower VCC range (2.7–3.6 V), LVCMOS input thresholds, higher speed (tPD ≈ 3.5 ns), no TTL compatibility. | Designed for 3.3 V systems only; incompatible with 5 V TTL sources without level translation. | Prefer for modern low-voltage designs where TTL interoperability is unnecessary and speed is critical. |
Compared with SN74AHCT16540, SN74AHCT16244DGVR offers finer enable control but lacks flow-through layout and dual-OE synchronization, while 74LVTH16244DGGR trades TTL compatibility and 5 V operation for lower voltage and faster timing - making SN74AHCT16540 the optimal choice for industrial 5 V bus isolation requiring robust noise immunity and byte-synchronized gating.
Availability
SN74AHCT16540 is available at Aetrix Electronics and suitable for memory subsystems, FPGA interconnects, industrial backplanes, and automated test equipment requiring stable component supply and long-term industrial lifecycle support.
Supply support for SN74AHCT16540 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in industrial-grade interface ICs.
The SN74AHCT16540 belongs to TI's Widebus™ family of high-speed bus interface devices, engineered specifically for noise-resilient, high-density data path buffering in industrial and communications infrastructure.
FAQ
What is the recommended power-up sequence for SN74AHCT16540 to avoid bus contention?
TI recommends tying OE1 and OE2 to VCC through a pullup resistor (value determined by driver sink capability) during power-up to ensure outputs remain in high-impedance state until system initialization completes. This prevents undefined states on shared buses. The SN74AHCT16540 datasheet specifies this practice to guarantee safe power sequencing without requiring external reset circuitry.
Does SN74AHCT16540 support hot-swap insertion in live backplanes?
Yes - SN74AHCT16540 features latch-up immunity exceeding 250 mA per JESD 17 and ESD protection >2000 V HBM, enabling robust operation during hot-plug events. Its distributed VCC/GND pins and flow-through layout further reduce transient coupling. However, OE must be held inactive (high) until power stabilizes, as specified in the SN74AHCT16540 application guidance.
Can SN74AHCT16540 drive 50-pF loads at 20 MHz reliably?
Yes - SN74AHCT16540 guarantees tPLH/tPHL ≤ 9.5 ns and tPZH/tPHZ ≤ 12 ns into 50-pF loads at VCC = 5 V, supporting clean signal edges up to ~20 MHz. Its ±8 mA drive strength and low output capacitance (CO = 3 pF) ensure minimal rise/fall time degradation, making SN74AHCT16540 suitable for high-speed parallel bus applications.
What is the function of the dual OE inputs (OE1 and OE2) on SN74AHCT16540?
Each 8-bit section (1Y1–1Y8 and 2Y1–2Y8) has two active-low OE inputs wired as an AND gate: both OE1 and OE2 must be low for outputs to drive; if either is high, all eight outputs go high-impedance. This dual-control architecture allows fail-safe bus isolation - e.g., one OE tied to system reset, the other to local controller - ensuring SN74AHCT16540 remains safely disabled under fault conditions.
Is SN74AHCT16540 pin-compatible with older 74ACT or 74F series 16-bit buffers?
No - SN74AHCT16540 uses a proprietary flow-through pinout optimized for PCB layout (inputs left, outputs right), differing from legacy 74ACT16540 or 74F540 packages. While functionally equivalent, mechanical compatibility requires board redesign. The SN74AHCT16540 datasheet confirms its DGG/DL/DGV footprints are unique to the AHCT family and not drop-in replacements for earlier families.
SN74AHCT16540DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AHCT
- Package/Case:
- 48-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 8mA, 8mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TVSOP
SN74AHCT16540DGVR FAQ
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7.What is the process for return or replacement of SN74AHCT16540DGVR?
All SN74AHCT16540DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AHCT16540DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AHCT16540DGVR part is unused and in its original packaging.
Return procedure for SN74AHCT16540DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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