Texas Instruments SN74AHCT367DGVR

Overview

SN74AHCT367DGVR from Texas Instruments is a hex buffer and line driver with 3-state outputs, designed for memory address, clock, and bus-oriented applications. It features dual 4-line/2-line configuration, TTL-voltage-compatible inputs (VIH = 2 V, VIL = 0.8 V), 5-V supply operation, and ±8-mA output drive capability. Used in telecom infrastructure and network switches where controlled bus isolation and level translation are required.

For engineers reviewing the SN74AHCT367DGVR datasheet, SN74AHCT367DGVR pinout, SN74AHCT367DGVR application, or SN74AHCT367DGVR equivalent, key selection considerations include 3-state enable timing (tPZH/tPLZ ≤ 9 ns at 50 pF), thermal resistance (RθJA = 124.5 °C/W), input overvoltage tolerance (up to 5.5 V), and TVSOP-16 package compatibility with high-density PCB layouts.

Technical Context

The SN74AHCT367DGVR implements two independent 3-state buffer groups: one with four channels (1A1–1A4 → 1Y1–1Y4) enabled by active-low 1OE, and another with two channels (2A1–2A2 → 2Y1–2Y2) enabled by active-low 2OE. Each output drives noninverted logic with CMOS-level VOH/VOL (3.94 V / 0.36 V at 8 mA) under 4.5–5.5 V supply.

Its architecture supports voltage translation from 3.3-V logic domains to 5-V buses while maintaining slow edge rates (Δt/Δv ≥ 20 ns/V) to suppress ringing. Input clamping and ESD protection (±2000 V HBM/CDM) ensure robustness in noisy industrial and telecom environments.

Key Specifications

Pinout & Package

SN74AHCT367DGVR uses a 16-pin TVSOP (Thin Very Small Outline Package) with 0.65-mm pitch, 3.6 mm × 6.4 mm body size, and 2-mm max height - optimized for space-constrained routing and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex buffer with 3-state output applications.

Compared with SN74AHCT244DBR and 74LVC244APW, the SN74AHCT367DGVR uniquely balances 5-V bus compatibility, TTL input acceptance, and compact TVSOP-16 packaging - making it optimal for space-constrained 3.3-V-to-5-V interface points where six channels suffice.

Availability

SN74AHCT367DGVR is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, and consumer electronics applications requiring stable component supply, long-term manufacturability, and RoHS-compliant packaging.

Supply support for SN74AHCT367DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and communications markets.

The SN74AHCT367DGVR belongs to TI's AHCT logic family, engineered for 5-V systems requiring TTL-compatible inputs, 3-state bus control, and enhanced noise immunity in high-density digital interfaces.

FAQ

What is the maximum output current per channel for the SN74AHCT367DGVR?

The SN74AHCT367DGVR supports ±8 mA DC output current per channel under recommended operating conditions (VCC = 4.5–5.5 V, TA = –40°C to +125°C). Absolute maximum ratings allow ±25 mA per output, but sustained operation above ±8 mA may exceed thermal limits given its RθJA of 124.5 °C/W in the TVSOP package. Always verify junction temperature in final layout.

Does the SN74AHCT367DGVR support level translation between 3.3-V and 5-V logic domains?

Yes, the SN74AHCT367DGVR supports unidirectional level translation from 3.3-V logic to 5-V buses. Its TTL-compatible inputs accept VIH ≥ 2.0 V and VIL ≤ 0.8 V, allowing direct connection to 3.3-V LVTTL outputs. Outputs swing rail-to-rail (VOH ≈ 3.94 V, VOL ≈ 0.36 V at 8 mA) into 5-V loads, making SN74AHCT367DGVR ideal for mixed-voltage system interfacing without external translators.

How should unused inputs be handled on the SN74AHCT367DGVR?

All unused inputs on the SN74AHCT367DGVR must be tied to a valid logic level - either VCC or GND - to prevent floating states that cause increased ICC, noise susceptibility, or undefined outputs. TI recommends connecting unused A inputs to GND (for low-power idle state) or VCC (to force known Y outputs), and unused OE pins to VCC via pull-up to ensure default high-impedance outputs during power-up.

What is the thermal performance of the SN74AHCT367DGVR in its TVSOP package?

The SN74AHCT367DGVR in TVSOP (DGV) package has a junction-to-ambient thermal resistance (RθJA) of 124.5 °C/W. At 8 mA per channel and 5.5 V supply, typical power dissipation is <1 mW per gate, but worst-case ICC (40 µA) plus switching losses must be evaluated. For continuous operation at +125°C ambient, total power must stay below ~400 mW to keep junction temperature within safe limits.

Can the SN74AHCT367DGVR replace the SN74AHCT367DR in an existing SOIC-based design?

No, the SN74AHCT367DGVR cannot be used as a drop-in replacement for SN74AHCT367DR due to incompatible packages: DGV is a 16-pin TVSOP (3.6 mm × 6.4 mm, 0.65-mm pitch), while DR is a 16-pin SOIC (9.9 mm × 6 mm, 1.27-mm pitch). Pin functions match, but PCB layout, solder stencil, and reflow profile differ significantly. Migration requires board revision and validation of signal integrity in the denser TVSOP layout.