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Texas Instruments SN74ALVC125PW

Part No.:
SN74ALVC125PW
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
14-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74ALVC125PW.pdf
Description:
IC BUF NON-INVERT 3.6V 14TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:191

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Product details

Overview

SN74ALVC125PW from Texas Instruments is a quadruple bus buffer gate with 3-state outputs, designed for 1.65 V to 3.6 V operation in low-voltage digital systems. It provides four independent non-inverting buffers, each with active-low output-enable control, ±24-mA drive capability at 3.3 V, and 2.8 ns max propagation delay - enabling high-speed data routing in FPGA I/O expansion, memory interface buffering, and level-translating logic buses.

For engineers reviewing the SN74ALVC125PW datasheet, SN74ALVC125PW pinout, SN74ALVC125PW application, or SN74ALVC125PW equivalent, key selection criteria include its TSSOP-14 package footprint, 3.3-V-compatible 1.65–3.6-V supply range, guaranteed 3-state isolation (±10 µA off-state leakage), and JESD 17 latch-up immunity (>250 mA), critical for mixed-voltage board interconnects and hot-swap-capable subsystems.

Technical Context

This device implements four identical CMOS buffer stages, each with separate 3-state control (OE) and non-inverting transfer logic (A → Y). Output drivers are symmetrically rated for ±24 mA at 3.0 V, supporting bidirectional bus driving when paired with complementary devices. Input thresholds scale with VCC (VIH = 0.65×VCC min at 1.65 V; VIL = 0.35×VCC max), ensuring robust noise margin across the full supply range.

Power integrity is maintained via low quiescent current (10 µA max ICC at 3.6 V) and minimal dynamic power dissipation (19 pF Cpd per gate at 3.3 V). The design meets JESD 22 ESD standards (2000-V HBM, 200-V MM, 1000-V CDM), and thermal resistance θJA = 113°C/W confirms suitability for compact, thermally constrained PCB layouts using the PW package.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage Range1.65 V to 3.6 V - enables direct interfacing with 1.8-V, 2.5-V, and 3.3-V logic families without level shifters
Max Propagation Delay2.8 ns at 3.3 V - supports >350-MHz data throughput in point-to-point buffered paths
Output Drive Strength±24 mA at 3.0 V - drives 50-Ω transmission lines or loads up to 10 LVTTL inputs with controlled edge rates
Off-State Leakage±10 µA at 3.6 V - ensures high-impedance integrity during bus arbitration or power sequencing
Input Threshold ScalingVIH = 0.65×VCC (min), VIL = 0.35×VCC (max) - maintains consistent switching points across supply voltage variations
Latch-up Immunity>250 mA per JESD 17 - prevents destructive latch-up during transient overvoltage or ground bounce events
ESD Rating2000-V HBM, 200-V MM, 1000-V CDM - qualifies for handling in standard assembly environments without special ESD controls

Pinout & Package

TSSOP-14 (PW) package: 4.4 mm × 5.0 mm body, 0.65 mm lead pitch, 1.2 mm max height, JEDEC MO-153 compliant, RoHS-compliant NiPdAu lead finish, MSL Level-1 (260°C peak reflow).

Pin/TerminalCircuit RoleDesign Meaning
1, 4, 10, 13Output Enable (OE)Active-low control per buffer; tie high to disable output and enter high-Z state
2, 5, 9, 12Data Input (A)Non-inverting input for corresponding buffer stage; accepts 1.65–3.6-V logic levels
3, 6, 8, 11Data Output (Y)3-state buffered output; driven low/high when OE = low, high-Z when OE = high
7GNDGround reference for all internal circuitry and I/O; must be low-impedance connection
14VCCPrimary power supply; bypass with 0.1 µF ceramic capacitor near pin for noise suppression

Key Features

FeatureDesign Value
Wide Supply Range Operation1.65–3.6 V enables single-supply interoperability across 1.8-V, 2.5-V, and 3.3-V domains without external translation
High-Speed Performance2.8 ns tpd at 3.3 V allows use in sub-5-ns timing-critical paths such as DDR address/control buffering
Robust Output Drive±24 mA at 3.0 V supports fanout to multiple LVTTL/LVCMOS loads or short PCB traces without signal degradation
Controlled Power-Up BehaviorOE pins default to disable state; pull-up resistors to VCC ensure defined high-Z on power ramp to prevent bus contention
Industry-Standard ESD ProtectionHBM 2000 V / MM 200 V / CDM 1000 V eliminates need for external protection diodes in most applications

Applications

FPGA I/O Expansion InterfaceLow-Voltage Memory Bus Buffering

Use Scenario: Expanding limited FPGA I/O pins to drive multiple peripheral control lines while maintaining timing integrity.

IC Role / Device Role / Timing Role: Non-inverting 3-state buffer providing isolated, slew-rate-controlled signal routing between FPGA bank and external GPIO expanders or configuration EEPROMs.

Use Value: Enables clean separation of timing domains with 2.8 ns propagation delay and <10 µA off-state leakage, preventing back-drive during partial reconfiguration.

Use Scenario: Isolating and strengthening address/data signals between a 3.3-V microcontroller and 1.8-V serial flash memory.

IC Role / Device Role / Timing Role: Voltage-tolerant bus buffer translating logic levels while preserving setup/hold margins across supply boundaries.

Use Value: Operates reliably at 1.8 V (min spec) and 3.3 V (max drive), eliminating need for discrete level shifters and reducing BOM count by one component per signal pair.

Hot-Swappable Module Backplane InterfaceIndustrial PLC Digital I/O Conditioning

Use Scenario: Managing signal integrity on a modular backplane where cards may be inserted/removed under power.

IC Role / Device Role / Timing Role: 3-state bus isolator preventing backfeeding from powered modules into unpowered slots during insertion.

Use Value: Guaranteed high-Z state with ±10 µA leakage and JESD 17 latch-up immunity (>250 mA) ensures safe hot-plug operation without system reset.

Use Scenario: Conditioning noisy 24-V industrial sensor inputs before digitization by a 3.3-V microcontroller ADC.

IC Role / Device Role / Timing Role: Input signal conditioner and noise filter driver, interfacing opto-isolated inputs to low-voltage logic with controlled rise/fall times.

Use Value: ±24-mA drive strength sustains signal integrity over longer PCB runs; input hysteresis (via external resistor networks) improves noise rejection in electrically harsh environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC125APWSame TSSOP-14 package, but LVC family: lower drive (±24 mA only at 3.3 V; degrades below 2.7 V), higher tpd (3.7 ns typical)Suitable for static 3.3-V-only systems; not recommended for mixed 1.8/2.5/3.3-V designs requiring guaranteed 1.65-V operationSelect SN74LVC125APW only if cost is primary concern and supply is fixed at 3.3 V with no margin for voltage droop.
74AVC125TTRSTMicroelectronics part in TSSOP-14; identical 1.2–3.6-V range and 2.5 ns tpd, but different pinout (OE on pins 1/2/13/14 vs. SN74ALVC125PW's 1/4/10/13)Requires PCB layout revision due to non-pin-compatible OE placement; supports same voltage scaling but lacks TI's JESD 17 latch-up ratingChoose 74AVC125TTR only if dual-sourcing is required and board redesign is acceptable; verify OE routing compatibility.

Compared with SN74LVC125APW and 74AVC125TTR, the SN74ALVC125PW delivers superior low-voltage performance down to 1.65 V with tighter timing (2.8 ns max), stronger drive consistency across voltage range, and industry-leading latch-up immunity - making it the preferred choice for dynamically scaled or mixed-voltage embedded systems where reliability and timing margin are critical.

Availability

SN74ALVC125PW is available at Aetrix Electronics and suitable for FPGA I/O expansion, low-voltage memory bus buffering, hot-swappable module interfaces, and industrial PLC digital I/O conditioning requiring stable component supply and long-term production continuity.

Supply support for SN74ALVC125PW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of experience in high-reliability industrial and automotive-grade components.

The SN74ALVC125PW belongs to TI's ALVC (Advanced Low-Voltage CMOS) logic family, engineered specifically for high-speed, low-power, mixed-voltage digital interfacing in space-constrained embedded systems.

FAQ

What is the minimum operating voltage for SN74ALVC125PW?

The SN74ALVC125PW operates down to 1.65 V, as specified in the Recommended Operating Conditions table. At this voltage, it maintains functional logic behavior with VIH ≥ 1.07 V (0.65×VCC) and VIL ≤ 0.58 V (0.35×VCC), enabling reliable use in battery-powered or dynamically scaled systems where supply may dip below 1.8 V. This specification is verified across the full −40°C to +85°C temperature range.

Does SN74ALVC125PW support hot-swap applications?

Yes, the SN74ALVC125PW supports hot-swap applications due to its guaranteed high-impedance state during power transitions, ±10 µA off-state leakage at 3.6 V, and >250 mA latch-up immunity per JESD 17. To ensure safe operation, OE pins should be tied to VCC via a pull-up resistor (value determined by driver sink capability) to force outputs into high-Z before VCC stabilizes. This prevents bus contention during card insertion.

What is the maximum output current capability of SN74ALVC125PW at 2.5 V?

At 2.5 V, the SN74ALVC125PW delivers ±12 mA output current (IOL = +12 mA, IOH = −12 mA), as specified in the Recommended Operating Conditions table. This is sufficient to drive 10 LVTTL loads or terminate a 50-Ω line with controlled edge rates. The device maintains this drive strength across the full operating temperature range (−40°C to +85°C) without derating.

Is SN74ALVC125PW pin-compatible with SN74LVC125APW?

Yes, the SN74ALVC125PW and SN74LVC125APW share identical TSSOP-14 pinouts, including matching positions for VCC (pin 14), GND (pin 7), and all four OE/A/Y signal pairs. Both devices follow the same top-side marking convention (VA125) and thermal profile (MSL Level-1). However, note that electrical performance differs - especially at VCC < 2.7 V - so functional validation is required despite mechanical compatibility.

What PCB layout guidance applies to SN74ALVC125PW's TSSOP-14 package?

TI recommends a land pattern with 0.45 mm pad width, 1.5 mm pad length, and 0.65 mm center-to-center spacing (per PW0014A outline). A 0.125 mm stencil with trapezoidal apertures improves paste release. Place a 0.1 µF X7R ceramic capacitor within 3 mm of pin 14 (VCC), and route GND (pin 7) to a solid plane with multiple vias. Avoid routing high-speed signals under the device body to minimize crosstalk.

SN74ALVC125PW Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74ALVC
Package/Case:
14-TSSOP (0.173", 4.40mm Width)
Packaging:
Bulk
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP

SN74ALVC125PW FAQ

1.How can I place an order for SN74ALVC125PW through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74ALVC125PW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74ALVC125PW reliable?

The price and inventory of SN74ALVC125PW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ALVC125PW is usually 5 days.

3.What payment methods are accepted for SN74ALVC125PW?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ALVC125PW transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74ALVC125PW?

SN74ALVC125PW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74ALVC125PW order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74ALVC125PW?

For technical support, including SN74ALVC125PW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ALVC125PW requirements.

6.How does Aetrix verify that SN74ALVC125PW is sourced from the original manufacturer or authorized distributors?

All SN74ALVC125PW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ALVC125PW meets industry standards.

7.What is the process for return or replacement of SN74ALVC125PW?

All SN74ALVC125PW units undergo pre-shipment inspection (PSI). If there is an issue with SN74ALVC125PW, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74ALVC125PW part is unused and in its original packaging.

Return procedure for SN74ALVC125PW:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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