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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments SN74ALVC16244AZRDR

Name: SN74ALVC16244AZRDR
Brand: Texas Instruments
SKU: SN74ALVC16244AZRDR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74ALVC16244AZRDR

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 54-TFBGA

Datasheet:: SN74ALVC16244AZRDR.pdf

Description:: IC BUFFER NON-INVERT 3.6V 54BGA

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Product details

Overview

SN74ALVC16244AZRDR from Texas Instruments is a 16-bit non-inverting buffer/driver with 3-state outputs, designed for 1.65-V to 3.6-V V_CC operation. It features ±24-mA output drive at 3.3 V, 3-ns max propagation delay at 3.3 V, and symmetrical active-low output-enable (OE) inputs. It is used in memory-address drivers, clock distribution networks, and bus-oriented transceivers in industrial control and embedded computing systems.

For engineers reviewing the SN74ALVC16244AZRDR datasheet, SN74ALVC16244AZRDR pinout, SN74ALVC16244AZRDR application, or SN74ALVC16244AZRDR equivalent, key selection criteria include voltage compatibility (1.65–3.6 V), 3-state output timing (t_pd ≤ 3 ns @ 3.3 V), output drive strength (±24 mA), latch-up immunity (>250 mA), and Pb-free VFBGA packaging.

Technical Context

The SN74ALVC16244AZRDR implements four independent 4-bit buffers, each with true outputs and dedicated active-low OE control. Its CMOS design ensures rail-to-rail input thresholds scaled to V_CC, supporting mixed-voltage interfacing across 1.65–3.6 V domains.

It uses advanced ALVC logic architecture with low dynamic power consumption (I_CC = 40 µA max @ 3.6 V) and high noise immunity-verified by ESD ratings of 2000-V HBM, 200-V MM, and 1000-V CDM-making it suitable for noise-sensitive digital backplanes and I/O expansion modules.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	1.65 V to 3.6 V - enables interoperability with 1.8-V, 2.5-V, and 3.3-V logic families without level shifters.
t_pd Max	3 ns @ 3.3 V - supports high-speed address/data buffering in sub-333-MHz synchronous buses.
I_OH/I_OL	±24 mA @ 3 V - drives heavy capacitive loads (e.g., >20 pF traces or multiple inputs) without signal degradation.
Output Type	3-state (high-impedance) - allows bidirectional bus sharing and prevents contention during system reset or power sequencing.
Input Thresholds	V_IH = 2.0 V, V_IL = 0.8 V @ 3.3 V - provides robust noise margin (>0.7 V) in electrically noisy industrial environments.
Latch-Up Immunity	>250 mA per JESD 17 - ensures survivability during transient overcurrent events on shared PCB power rails.

Pinout & Package

SN74ALVC16244AZRDR is packaged in a 54-ball VFBGA (ZRD, Pb-free), 5.5 mm × 3.5 mm, 0.5-mm pitch, with 1.2-mm max height. Ball assignments follow JEDEC MO-153-compliant layout.

Pin/Terminal	Circuit Role	Design Meaning
1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4	Buffer Outputs	True-level, 3-state outputs grouped in four 4-bit channels; each group shares one OE signal.
1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4	Buffer Inputs	CMOS-compatible inputs with V_CC-referenced thresholds; support hot-swap and partial-power-down operation.
1OE, 2OE, 3OE, 4OE	Output Enable	Active-low controls for respective 4-bit sections; OE tied to V_CC via pullup ensures safe high-Z state at power-up.
V_CC (Balls C3, C4, G3, G4, H3, H4)	Power Supply	Six dedicated V_CC balls minimize IR drop and improve simultaneous switching noise (SSN) performance.
GND (Balls B3, B4, D3, D4, E3, E4, F3, F4, J3, J4)	Ground	Ten GND balls provide low-inductance return paths, critical for maintaining signal integrity at >100-MHz edge rates.

Key Features

Feature	Design Value
Widebus™ Architecture	Optimized for high-density board layouts-replaces up to four discrete octal buffers with single 54-ball VFBGA footprint.
3.6-V Absolute Maximum Rating	Withstands 4.6-V transient surges on I/O pins, enabling use in legacy 5-V systems with series resistors or clamping diodes.
Low Input Capacitance	C_i = 6 pF - minimizes loading on upstream drivers and preserves rise/fall times in fanout-heavy configurations.
Controlled Output Slew Rate	∆t/∆v = 10 ns/V - limits EMI generation while maintaining clean edges into 50-pF loads.
Pb-Free & RoHS Compliant	ZRD package meets IPC/JEDEC J-STD-020 MSL Level-3 (260°C peak reflow), qualified for automated SMT assembly.

Applications

Memory Address Buffering	Clock Distribution
Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus. IC Role / Device Role / Timing Role: Non-inverting 3-state buffer isolating CPU address outputs from memory load capacitance and enabling chip-select arbitration. Use Value: Enables reliable 33-MHz burst addressing with t_pd ≤ 3 ns and ±24-mA drive, eliminating timing skew across parallel address lines.	Use Scenario: Distributing a system clock to multiple peripherals (e.g., ADC, DAC, FPGA configuration logic) with matched trace lengths. IC Role / Device Role / Timing Role: Low-skew, high-drive clock fanout buffer with independent enable control per 4-bit segment. Use Value: Maintains <100-ps inter-channel skew and drives >20-pF net capacitance without external termination or repeaters.
Industrial I/O Expansion	Embedded Bus Transceiver Interface
Use Scenario: Extending GPIO count of an ARM Cortex-M4 MCU to control relay banks, LED arrays, and sensor interfaces in PLC modules. IC Role / Device Role / Timing Role: Level-translating buffer between 3.3-V MCU I/O and 2.5-V/1.8-V peripheral logic, with configurable 3-state isolation. Use Value: Supports mixed-voltage operation (1.65–3.6 V) and delivers ±24-mA sink/source per pin-sufficient to directly drive LEDs or small solenoids.	Use Scenario: Interfacing a 16-bit data bus between an FPGA and external DDR2 controller or video encoder ASIC. IC Role / Device Role / Timing Role: Bidirectional bus driver with per-group OE control, allowing time-multiplexed read/write handshaking without bus contention. Use Value: Eliminates need for separate direction-control logic; 3-state outputs prevent data corruption during bus arbitration cycles.

Memory Address Buffering

Clock Distribution

Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus.

IC Role / Device Role / Timing Role: Non-inverting 3-state buffer isolating CPU address outputs from memory load capacitance and enabling chip-select arbitration.

Use Value: Enables reliable 33-MHz burst addressing with t_pd ≤ 3 ns and ±24-mA drive, eliminating timing skew across parallel address lines.

Use Scenario: Distributing a system clock to multiple peripherals (e.g., ADC, DAC, FPGA configuration logic) with matched trace lengths.

IC Role / Device Role / Timing Role: Low-skew, high-drive clock fanout buffer with independent enable control per 4-bit segment.

Use Value: Maintains <100-ps inter-channel skew and drives >20-pF net capacitance without external termination or repeaters.

Industrial I/O Expansion

Embedded Bus Transceiver Interface

Use Scenario: Extending GPIO count of an ARM Cortex-M4 MCU to control relay banks, LED arrays, and sensor interfaces in PLC modules.

IC Role / Device Role / Timing Role: Level-translating buffer between 3.3-V MCU I/O and 2.5-V/1.8-V peripheral logic, with configurable 3-state isolation.

Use Value: Supports mixed-voltage operation (1.65–3.6 V) and delivers ±24-mA sink/source per pin-sufficient to directly drive LEDs or small solenoids.

Use Scenario: Interfacing a 16-bit data bus between an FPGA and external DDR2 controller or video encoder ASIC.

IC Role / Device Role / Timing Role: Bidirectional bus driver with per-group OE control, allowing time-multiplexed read/write handshaking without bus contention.

Use Value: Eliminates need for separate direction-control logic; 3-state outputs prevent data corruption during bus arbitration cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74LVC16244ADGGR	Same logic function, TSSOP-48 package; higher θ_JA (70°C/W vs. 36°C/W); no Pb-free ZRD marking.	Preferred for prototyping or low-volume boards where manual soldering or socketing is required.	Select when board space allows larger TSSOP footprint and thermal budget permits higher junction temperature rise.
SN74ALVC16244ADLR	Same ALVC family, SSOP-48 package; identical electrical specs but different pinout and mechanical dimensions.	Suitable for legacy designs using SSOP footprints or where VFBGA rework capability is unavailable.	Choose when existing PCB layout uses SSOP-48 land pattern or when supply chain constraints limit VFBGA availability.

Compared with SN74ALVC16244ADGGR and SN74ALVC16244ADLR, the SN74ALVC16244AZRDR offers superior thermal performance (θ_JA = 36°C/W), smaller PCB area (5.5 × 3.5 mm vs. 12.6 × 6.2 mm), and Pb-free compliance-critical for high-density industrial modules requiring automated assembly and long-term reliability.

Availability

SN74ALVC16244AZRDR is available at Aetrix Electronics and suitable for memory address buffering, clock distribution, industrial I/O expansion, and embedded bus transceiver applications requiring stable component supply and long-lifecycle support.

Supply support for SN74ALVC16244AZRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74ALVC16244AZRDR belongs to TI's Widebus™ ALVC logic family, engineered for high-speed, low-voltage, high-density digital interface applications in space-constrained embedded systems.

FAQ

What is the recommended power-up sequence for SN74ALVC16244AZRDR?

TI recommends tying all OE inputs to V_CC through a pullup resistor (minimum value determined by driver current-sinking capability) to ensure outputs remain in high-impedance state during power-up or power-down. This prevents bus contention before the host controller initializes. The SN74ALVC16244AZRDR itself has no internal power-on reset; external sequencing must guarantee V_CC stabilizes before asserting valid OE or input signals.

Does SN74ALVC16244AZRDR support mixed-voltage operation between input and output sides?

Yes, the SN74ALVC16244AZRDR supports mixed-voltage operation: inputs tolerate 0–3.6 V regardless of V_CC, and outputs swing rail-to-rail between GND and V_CC. When V_CC = 2.5 V, inputs from a 3.3-V source remain compatible because VIH is defined as 1.7 V min-ensuring reliable logic recognition without external level shifters.

What is the maximum capacitive load SN74ALVC16244AZRDR can drive while maintaining 3-ns propagation delay?

The 3-ns t_pd specification for SN74ALVC16244AZRDR is guaranteed under standard test conditions with CL = 50 pF. At 3.3 V, it maintains this timing up to 50 pF; beyond that, delay increases linearly-e.g., ~3.8 ns at 100 pF. For heavier loads, derating curves in the datasheet show t_pd remains <5 ns up to 150 pF, provided output current stays within ±24 mA limits.

Can SN74ALVC16244AZRDR be used in automotive applications?

The SN74ALVC16244AZRDR is rated for –40°C to +85°C operation and exceeds JESD 17 latch-up and JESD 22 ESD standards, but it is not AEC-Q100 qualified. It may be used in under-hood or infotainment subsystems only after full system-level validation-including temperature cycling, vibration, and EMC testing-as TI does not guarantee automotive-grade reliability or extended temperature range without explicit qualification.

How does the ZRD package of SN74ALVC16244AZRDR differ from the GRD variant?

The SN74ALVC16244AZRDR (ZRD) is the Pb-free version of the 54-ball VFBGA, while SN74ALVC16244AGRDR (GRD) is the leaded variant. Both share identical ball map, thermal resistance (θ_JA = 36°C/W), and electrical specs. The ZRD package complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 MSL Level-3, making it suitable for lead-free reflow processes and environmentally regulated markets.

SN74ALVC16244AZRDR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74ALVC

Package/Case:: 54-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 4

Number of Bits per Element:: 4

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 24mA, 24mA

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-BGA Microstar Junior (8x5.5)

SN74ALVC16244AZRDR FAQ

1.How can I place an order for SN74ALVC16244AZRDR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74ALVC16244AZRDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74ALVC16244AZRDR reliable?

The price and inventory of SN74ALVC16244AZRDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ALVC16244AZRDR is usually 5 days.

3.What payment methods are accepted for SN74ALVC16244AZRDR?

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4.How is shipping managed for SN74ALVC16244AZRDR?

SN74ALVC16244AZRDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74ALVC16244AZRDR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74ALVC16244AZRDR?

For technical support, including SN74ALVC16244AZRDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ALVC16244AZRDR requirements.

6.How does Aetrix verify that SN74ALVC16244AZRDR is sourced from the original manufacturer or authorized distributors?

All SN74ALVC16244AZRDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ALVC16244AZRDR meets industry standards.

7.What is the process for return or replacement of SN74ALVC16244AZRDR?

All SN74ALVC16244AZRDR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ALVC16244AZRDR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74ALVC16244AZRDR part is unused and in its original packaging.

Return procedure for SN74ALVC16244AZRDR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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