Texas Instruments SN74ALVC244IPWREP

Overview

SN74ALVC244IPWREP from Texas Instruments is an octal buffer/driver with 3-state outputs, designed for 1.65-V to 3.6-V V_CC operation. It features two independent 4-bit channels, separate output-enable (OE) inputs per group, ±24-mA drive strength at 3.3 V, 2.8-ns max propagation delay, and latch-up immunity exceeding 250 mA - used in bus interface and level-shifting applications in industrial control backplanes.

For engineers reviewing the SN74ALVC244IPWREP datasheet, SN74ALVC244IPWREP pinout, SN74ALVC244IPWREP application, or SN74ALVC244IPWREP equivalent, key selection criteria include 3-state output timing, dual-OE control logic, TSSOP-20 thermal performance (θ_JA = 83°C/W), and extended temperature support (–40°C to 85°C) for ruggedized embedded systems.

Technical Context

This device implements dual-group non-inverting buffer architecture with independent 3-state control: 1OE enables Y1–Y4 outputs driven by A1–A4; 2OE enables Y1–Y4 outputs driven by A1–A4 of the second group. Each output transitions between active low-impedance states and high-impedance when OE is high.

Input thresholds are V_IL ≤ 0.35×V_CC (min) and V_IH ≥ 0.65×V_CC (min) across 1.65–3.6 V supply range, supporting mixed-voltage interfacing. Output voltage swing is rail-to-rail (0 V to V_CC), with VOL ≤ 0.55 V and VOH ≥ V_CC – 0.2 V under full load conditions.

Key Specifications

Pinout & Package

TSSOP-20 (PW) package: 6.5 mm × 4.4 mm × 1.2 mm body, 0.65-mm lead pitch, gull-wing leads, RoHS-compliant NiPdAu finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Compared with SN74ALVC244IPWREP, SN74LVC244APWRE4 offers identical functionality at lower cost but omits enhanced product change notification and qualification pedigree; 74ALVC244MTCX provides functional equivalence with slightly relaxed timing and different supply-chain traceability - neither is pin-compatible without layout verification due to differing thermal pad configurations and marking conventions.

Availability

SN74ALVC244IPWREP is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive body control modules, and medical diagnostic data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for SN74ALVC244IPWREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation history.

The SN74ALVC244IPWREP belongs to TI's enhanced-product (EP) logic portfolio, engineered for high-reliability industrial and aerospace applications with controlled baseline manufacturing, extended temperature qualification, and diminished manufacturing sources (DMS) support.

FAQ

What is the recommended power-up sequence for SN74ALVC244IPWREP to avoid bus contention?

TI recommends tying both 1OE and 2OE to V_CC through pullup resistors (minimum value determined by driver sink capability) during power-up. This ensures all outputs remain in high-impedance state until firmware asserts OE low, preventing unintended signal assertion on shared buses. The SN74ALVC244IPWREP does not require sequencing of V_CC relative to control signals, as its input thresholds scale with V_CC.

Does SN74ALVC244IPWREP support mixed-voltage operation between input and output sides?

No - SN74ALVC244IPWREP uses a single V_CC rail (1.65 V to 3.6 V) for both input logic thresholds and output drive levels. Input VIH/VIL are ratiometric to V_CC, and VOH/VOL swing from GND to V_CC. It cannot translate between disparate voltage domains like 1.8-V inputs to 3.3-V outputs without external level-shifting circuitry.

What is the maximum capacitive load SN74ALVC244IPWREP can drive while maintaining specified tpd?

TI specifies switching characteristics with CL = 30 pF (at 1.8 V/2.5 V) and CL = 50 pF (at 3.3 V). Driving loads beyond 50 pF increases propagation delay nonlinearly - for example, at 3.3 V and CL = 100 pF, tpd degrades to ~4.5 ns. For SN74ALVC244IPWREP, maintain trace + load capacitance ≤50 pF to guarantee 2.8-ns max tpd compliance.

How does the latch-up immunity of SN74ALVC244IPWREP impact PCB design for high-noise environments?

With latch-up immunity exceeding 250 mA per JESD17, SN74ALVC244IPWREP tolerates transient current injection without destructive failure - reducing need for series current-limiting resistors on I/O lines. However, PCB layout must still minimize ground bounce and use local V_CC/GND decoupling (0.1 µF ceramic near each power pin) to prevent false triggering during EFT bursts.

Is SN74ALVC244IPWREP compatible with standard TSSOP-20 footprints used for other TI logic devices?

Yes - SN74ALVC244IPWREP uses the PW package per JEDEC MO-153, matching mechanical dimensions (6.5 mm × 4.4 mm), lead pitch (0.65 mm), and land pattern requirements of TI's standard TSSOP-20 footprint. The exposed metal pad is not electrically connected; solder mask defined pads per IPC-7351 are recommended for optimal thermal and mechanical reliability.