Texas Instruments SN74ALVC245PW
- Part No.:
- SN74ALVC245PW
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74ALVC245PW.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:

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Inventory:539
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Product details
Overview
SN74ALVC245PW from Texas Instruments is an octal bus transceiver with 3-state outputs, designed for bidirectional asynchronous data transfer between 1.65-V to 3.6-V buses. It features ±24-mA output drive at 3.3 V, 3.4-ns max propagation delay, and operates across –40°C to 85°C. Used in level-shifting interfaces between mixed-voltage logic domains in embedded controllers and FPGA I/O expansion.
For engineers reviewing the SN74ALVC245PW datasheet, SN74ALVC245PW pinout, SN74ALVC245PW application, or SN74ALVC245PW equivalent, key selection criteria include voltage translation capability (1.65–3.6 V), 20-pin TSSOP package footprint, DIR/OE control logic, 3-state isolation behavior, and latch-up immunity exceeding 250 mA per JESD 17.
Technical Context
The SN74ALVC245PW implements dual-directional 8-bit data flow controlled by a single DIR input: low enables B→A transmission, high enables A→B transmission. Its OE input independently places all outputs in high-impedance state, enabling bus isolation during power sequencing or standby modes.
Designed for low-voltage CMOS operation, it supports mixed-supply interfacing without external level shifters. Input thresholds scale with VCC (VIH = 0.65×VCC min at 1.65 V; VIL = 0.35×VCC max), and output drive strength increases with supply voltage-reaching ±24 mA at 3.0 V-ensuring robust signal integrity in noise-sensitive digital systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - Enables interoperability between 1.8-V, 2.5-V, and 3.3-V logic domains without level-shifter ICs. |
| Max tpd | 3.4 ns at 3.3 V - Supports high-speed data handshaking in real-time control loops and memory-mapped peripheral interfaces. |
| Output Drive | ±24 mA at 3.0 V - Sustains full logic swing into 50-Ω transmission lines or multiple CMOS loads under worst-case timing conditions. |
| Latch-Up Immunity | >250 mA per JESD 17 - Ensures robustness against transient current surges during hot-swap or ESD events in industrial backplanes. |
| IOZ (Off-State Leakage) | ±10 µA at 3.6 V - Minimizes standby current in battery-backed subsystems and preserves signal integrity on shared buses during disable. |
| Input Capacitance (Ci) | 4.5 pF at 3.3 V - Reduces capacitive loading on driving gates, maintaining timing margins in high-fanout clock/data distribution networks. |
| Operating Temperature | –40°C to +85°C - Qualified for use in automotive body electronics, industrial PLC modules, and outdoor communications equipment. |
Pinout & Package
TSSOP-20 (PW) package: 6.5 mm × 4.4 mm × 1.2 mm body, 0.65 mm lead pitch, gull-wing leads, RoHS-compliant NiPdAu finish, MSL Level-1 (260°C, unlimited reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | DIR | Direction control: Low = B-to-A data flow; High = A-to-B data flow - enables single-wire bidirectional bus arbitration. |
| 2–9 | A1–A8 | Port A inputs/outputs - connects to microcontroller or ASIC local bus; referenced to same VCC as device. |
| 10 | GND | Ground reference - must be low-inductance connection to minimize ground bounce during simultaneous 8-bit switching. |
| 11 | VCC | Supply voltage input - bypassed with 0.1 µF ceramic capacitor near pin to suppress high-frequency supply noise. |
| 12 | OE | Output enable: Low = active transceiver; High = all outputs in high-Z - used for bus contention avoidance and power sequencing. |
| 13–20 | B1–B8 | Port B inputs/outputs - interfaces to peripheral bus or memory subsystem; electrically isolated from Port A when OE = high. |
Key Features
| Feature | Design Value |
|---|---|
| Voltage Translation | Supports 1.65–3.6 V operation on both ports - eliminates need for discrete level shifters in mixed-voltage SoC interconnects. |
| High-Speed Timing | 3.4 ns max tpd at 3.3 V - meets setup/hold requirements for 100+ MHz synchronous bus protocols like LPC or custom parallel interfaces. |
| Bus Isolation | True 3-state outputs with <±10 µA off-state leakage - prevents signal corruption during processor reset or firmware update sequences. |
| Robust ESD/Latch-Up | JESD 17 latch-up immunity >250 mA; HBM ESD rating ≥2000 V - suitable for manufacturing handling and field-replaceable module designs. |
| Thermal Performance | θJA = 83°C/W in TSSOP-20 - allows continuous 8-bit operation at full drive strength up to +85°C ambient without derating. |
Applications
| Industrial PLC Backplane Interface | FPGA I/O Expansion Bridge |
|---|---|
|
Use Scenario: Connecting a 3.3-V FPGA I/O bank to legacy 2.5-V or 1.8-V sensor interface cards in modular automation hardware. IC Role / Device Role / Timing Role: Bidirectional voltage-level translator and bus driver, controlled by FPGA GPIO for direction and enable management. Use Value: Eliminates discrete resistor-based level shifters while maintaining sub-4-ns propagation delay for deterministic sampling of fast analog-to-digital control signals. |
Use Scenario: Extending limited FPGA I/O pins to drive multiple SPI peripherals and status LEDs via a shared parallel bus. IC Role / Device Role / Timing Role: Octal transceiver providing configurable A↔B data path with OE-gated isolation during configuration or fault recovery. Use Value: Enables dynamic reconfiguration of peripheral mapping without PCB redesign; 24-mA drive supports direct LED sinking without current-limiting resistors. |
| Embedded Microcontroller Memory Mapping | Automotive Body Control Module Bus Arbitration |
|
Use Scenario: Interfacing an ARM Cortex-M7 MCU (3.3 V) to external SRAM or NOR flash operating at 2.5 V in automotive infotainment head units. IC Role / Device Role / Timing Role: Asynchronous bidirectional data buffer with DIR-controlled flow direction and OE-synchronized chip select gating. Use Value: Maintains memory read/write timing budgets across voltage domains; ±24-mA drive ensures reliable address/data strobe edge rates over 10-cm PCB traces. |
Use Scenario: Isolating LIN or CAN transceiver data lines from a central body controller MCU during sleep mode to reduce quiescent current. IC Role / Device Role / Timing Role: 3-state bus isolator activated by MCU wake signal; DIR fixed to route diagnostic data unidirectionally during boot. Use Value: Achieves <10 µA system standby current by disabling transceiver outputs while preserving MCU internal bus integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC245APW | Lower drive (±24 mA only at 3.3 V; drops to ±12 mA at 2.5 V); identical pinout and logic function. | Suitable for lower-speed 2.5-V-only systems where 3.3-V compatibility is unnecessary. | Select when operating exclusively below 2.7 V and cost sensitivity outweighs 3.3-V margin. |
| 74AVC245TTR | Higher speed (2.2 ns tpd at 3.3 V); same VCC range and 20-pin TSSOP package; different pin assignment (DIR/OE swapped). | Requires PCB layout revision due to non-identical pinout; better for timing-critical DDR memory buffers. | Choose only if board redesign is feasible and sub-2.5-ns propagation is mandatory for system timing closure. |
Compared with SN74LVC245APW and 74AVC245TTR, the SN74ALVC245PW delivers consistent ±24-mA drive across its full 1.65–3.6-V range and maintains pin compatibility with legacy ALVC designs-making it optimal for drop-in upgrades in existing 3.3-V industrial control boards.
Availability
SN74ALVC245PW is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA I/O expansion bridges, and automotive body control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74ALVC245PW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-reliability logic and interface solutions.
The SN74ALVC245PW belongs to TI's Advanced Low-Voltage CMOS (ALVC) logic family, engineered for low-power, high-speed bidirectional data transfer in mixed-voltage embedded systems where timing predictability and bus isolation are critical.
FAQ
What is the recommended power-up sequence for SN74ALVC245PW to avoid bus contention?
TI recommends tying OE to VCC through a pullup resistor (minimum value determined by driver sink capability) to ensure outputs remain in high-impedance state during power-up. This prevents unintended data coupling between A and B buses before the controlling MCU initializes DIR and OE. The SN74ALVC245PW datasheet specifies this sequence to eliminate glitches in systems with asynchronous power rails.
Can SN74ALVC245PW operate reliably at 1.65 V while driving a 50-pF load?
Yes. At 1.65 V, SN74ALVC245PW guarantees VOL ≤ 0.45 V and VOH ≥ 1.2 V with 4-mA load, and switching characteristics (tpd ≤ 6 ns) are specified for CL = 50 pF. The device's rail-to-rail input thresholds and low dynamic power dissipation (Cpd = 25 pF at 1.8 V) ensure functional timing closure even at minimum VCC with moderate capacitive loading.
Is SN74ALVC245PW pin-compatible with SN74LVC245APW?
Yes. SN74ALVC245PW and SN74LVC245APW share identical TSSOP-20 (PW) package dimensions, pin numbering, and pin functions-including DIR on pin 1, OE on pin 12, and A/B port assignments. Both meet JEDEC MO-153 mechanical standards, enabling direct replacement without PCB modification.
What thermal considerations apply when operating SN74ALVC245PW at 3.3 V with all 8 channels driven?
At 3.3 V with all outputs sourcing/sinking ±24 mA, total power dissipation is ~120 mW. With θJA = 83°C/W in TSSOP-20, junction temperature rise is ~10°C above ambient-well within the +85°C limit. TI recommends a 25-mm² copper pour under the exposed pad area (if using thermally enhanced variant) and two 0.3-mm vias for additional heat conduction in high-density layouts.
Does SN74ALVC245PW support hot-insertion or live bus swapping?
SN74ALVC245PW is not rated for hot-insertion. Its absolute maximum ratings specify VI and VO limits relative to VCC/GND, and no current-limiting or slew-rate control is built in. For live-swap applications, external series resistors (e.g., 10–22 Ω) on A/B lines and careful sequencing of VCC/OE are required-TI provides guidance in application report SCBA004 for managing floating inputs during insertion.
SN74ALVC245PW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ALVC
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74ALVC245PW FAQ
1.How can I place an order for SN74ALVC245PW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74ALVC245PW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74ALVC245PW reliable?
The price and inventory of SN74ALVC245PW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74ALVC245PW is usually 5 days.
3.What payment methods are accepted for SN74ALVC245PW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74ALVC245PW transactions.
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4.How is shipping managed for SN74ALVC245PW?
SN74ALVC245PW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74ALVC245PW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74ALVC245PW?
For technical support, including SN74ALVC245PW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74ALVC245PW requirements.
6.How does Aetrix verify that SN74ALVC245PW is sourced from the original manufacturer or authorized distributors?
All SN74ALVC245PW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ALVC245PW meets industry standards.
7.What is the process for return or replacement of SN74ALVC245PW?
All SN74ALVC245PW units undergo pre-shipment inspection (PSI). If there is an issue with SN74ALVC245PW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ALVC245PW part is unused and in its original packaging.
Return procedure for SN74ALVC245PW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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