Texas Instruments SN74ALVCH162344GR

Overview

SN74ALVCH162344 from Texas Instruments is a 1-bit-to-4-bit address driver with 3-state outputs, designed for V_CC operation from 1.65 V to 3.6 V. It features ±12-mA output drive at 3.3 V, 4.4 ns max propagation delay, integrated 26-Ω series output resistors, and bus-hold circuitry on all data inputs-enabling direct interface with memory address buses in multi-bank DRAM or SRAM systems.

For engineers reviewing the SN74ALVCH162344 datasheet, SN74ALVCH162344 pinout, SN74ALVCH162344 application, or SN74ALVCH162344 equivalent, key selection criteria include its 56-pin TSSOP (DGG) package, per-bank independent output-enable control (OE1–OE4), 3.3-V-compatible logic thresholds, and absence of external termination requirements due to on-die series resistance.

Technical Context

This device implements eight independent 1-bit-to-4-bit address translation channels (A1–A8 → B1–B4 per bank), each with dedicated 3-state output enable (OE1–OE4). All inputs feature active bus-hold circuitry eliminating external pullup/pulldown resistors, and outputs incorporate calibrated 26-Ω series resistors to suppress overshoot/undershoot without layout compromises.

It operates across industrial temperature range (–40°C to +85°C) with supply voltage flexibility (1.65 V–3.6 V), supports mixed-voltage interfacing via level-shifted input thresholds (e.g., V_IL = 0.35×V_CC at 1.65 V), and meets JESD 17 latch-up immunity (>250 mA), making it suitable for high-density memory subsystems requiring deterministic timing and robust signal integrity.

Key Specifications

Pinout & Package

The SN74ALVCH162344 is housed in a 56-pin Thin Shrink Small Outline Package (TSSOP) with 0.5-mm pitch and 1.2-mm maximum height (JEDEC MO-153 compliant, package code DGG).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar address driver applications.

Compared with SN74ALVCH162344DL and SN74LVC162344DGGR, the SN74ALVCH162344GR delivers optimal balance of industrial temperature rating, integrated bus-hold, and compact TSSOP packaging-making it the preferred choice for volume production of space-constrained memory subsystems requiring zero-external-component reliability.

Availability

SN74ALVCH162344 is available at Aetrix Electronics and suitable for DDR memory subsystems, multi-bank SRAM controllers, FPGA-based memory interfaces, industrial microcontroller expansions, and test equipment requiring stable component supply with guaranteed long-term sourcing.

Supply support for SN74ALVCH162344 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability interface and memory support ICs.

The SN74ALVCH162344 belongs to TI's Widebus™ family of advanced bus-interface devices, engineered specifically for high-speed, low-voltage memory address distribution in industrial, telecom, and computing applications.

FAQ

What is the primary function of the SN74ALVCH162344?

The SN74ALVCH162344 is a 1-bit-to-4-bit address driver with 3-state outputs, designed to translate individual address bits into parallel 4-bit segments for memory bank selection. Its core function is to distribute and buffer address signals across multiple memory devices while maintaining signal integrity through integrated 26-Ω series resistors and bus-hold circuitry-eliminating external components in SN74ALVCH162344-based designs.

Does the SN74ALVCH162344 require external pullup or pulldown resistors on its inputs?

No, the SN74ALVCH162344 does not require external pullup or pulldown resistors because it features active bus-hold circuitry on all data inputs. This internal circuitry maintains unused or undriven inputs at valid logic levels, preventing floating states that could cause metastability or increased power consumption. Using external resistors with the SN74ALVCH162344 bus-hold function is explicitly discouraged in the datasheet.

What package type and dimensions does the SN74ALVCH162344GR use?

The SN74ALVCH162344GR uses a 56-pin Thin Shrink Small Outline Package (TSSOP) with package code DGG, measuring 13.9 mm × 6.0 mm × 1.2 mm max height and 0.5-mm lead pitch. It complies with JEDEC MO-153 standards and is optimized for automated surface-mount assembly with 2000 units per tape-and-reel reel-distinct from the SSOP-56 (DL) variant used in the SN74ALVCH162344DL.

How does the SN74ALVCH162344 handle power-up and power-down sequencing?

To ensure high-impedance outputs during power-up or power-down, the output-enable (OE1–OE4) inputs of the SN74ALVCH162344 must be tied to V_CC through a pullup resistor. The minimum resistor value depends on the current-sinking capability of the driving source, as specified in the SN74ALVCH162344 datasheet. This prevents unintended output states that could disrupt memory initialization sequences.

Can the SN74ALVCH162344 operate reliably at 1.8 V supply voltage?

Yes, the SN74ALVCH162344 is fully specified to operate at 1.8 V (within its 1.65 V–3.6 V V_CC range), delivering guaranteed performance including 4.9 ns max t_pd, ±2 mA output drive, and valid input thresholds (V_IL = 0.63 V, V_IH = 1.17 V). This makes the SN74ALVCH162344 suitable for modern low-power memory interfaces where 1.8-V operation reduces system power consumption without sacrificing timing margins.