Texas Instruments SN74ALVCH16825DGGR
- Part No.:
- SN74ALVCH16825DGGR
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74ALVCH16825DGGR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 56TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,713
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Product details
Overview
SN74ALVCH16825DGGR from Texas Instruments is an 18-bit noninverting 3-state buffer/driver with bus-hold circuitry, designed for 1.65-V to 3.6-V VCC operation. It supports dual 9-bit or single 18-bit configurations, features two independent 2-input AND-type output-enable controls (active-low), and operates across –40°C to 85°C for memory address, clock, and bus interface applications.
For engineers reviewing the SN74ALVCH16825DGGR datasheet, SN74ALVCH16825DGGR pinout, SN74ALVCH16825DGGR application, or SN74ALVCH16825DGGR equivalent, key selection criteria include VCC range compatibility, bus-hold input retention, 3-state timing (ten/tdis), thermal impedance (θJA = 81°C/W), and TSSOP-56 package constraints.
Technical Context
This device implements two independent 9-bit sections, each with separate active-low OE inputs (OE1/OE2 per section) feeding a 2-input AND gate to control all nine outputs simultaneously. Bus-hold circuitry maintains valid logic levels on floating data inputs without external resistors, reducing BOM count and layout complexity.
Output drive strength scales with VCC: ±24 mA at 3.0 V, ±12 mA at 2.3–2.7 V, and ±4 mA at 1.65 V. Propagation delay (tpd) is 3.4 ns typical at VCC = 2.3 V and CL = 50 pF, while enable/disable times (ten/tdis) are 4.7–6.0 ns under same conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - enables interoperability across 1.8-V, 2.5-V, and 3.3-V logic domains |
| Output Drive | ±24 mA at 3.0 V - sufficient to drive 50-pF loads with <3.5-ns tpd in high-speed bus applications |
| Bus-Hold Current | ±75 µA at VCC = 3.0 V - actively retains input state without pullup/pulldown resistors |
| 3-State Timing | ten = 4.7 ns, tdis = 4.5 ns (VCC = 2.7 V) - ensures clean bus arbitration with minimal contention window |
| Operating Temp | –40°C to +85°C - qualified for industrial temperature environments without derating |
| Input Clamp Current | –50 mA - protects against transient overvoltage events per MIL-STD-883 Method 3015 |
| Thermal Impedance | θJA = 81°C/W (DGG package) - defines maximum power dissipation before junction exceeds 125°C |
Pinout & Package
TSSOP-56 (DGG) package: 13.9 mm × 6.1 mm × 1.2 mm body, 0.5-mm lead pitch, gull-wing leads, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE1, 1OE2, 2OE1, 2OE2 | Section output-enable control | Active-low AND-gated enables; tying OE to VCC via pullup ensures high-Z at power-up |
| 1A1–1A9, 2A1–2A9 | Data inputs | Bus-hold enabled; no external termination required for unused inputs |
| 1Y1–1Y9, 2Y1–2Y9 | True-buffered outputs | 3-state capable; outputs float when corresponding OE pair is high |
| VCC (Pins 7, 26, 42, 50) | Power supply | Four dedicated VCC pins reduce IR drop and improve noise immunity across wide bus |
| GND (Pins 4, 11, 14, 15, 23, 32, 35, 36, 44, 53) | Ground reference | Ten GND pins provide low-inductance return paths for 18 outputs and internal logic |
Key Features
| Feature | Design Value |
|---|---|
| Integrated bus-hold circuitry | Eliminates need for 18 external pullup/pulldown resistors on data inputs, reducing PCB area and assembly cost |
| Dual 9-bit or unified 18-bit configuration | Flexible partitioning allows use as two independent buffers or one wide bus driver without redesign |
| EPIC™ submicron CMOS process | Enables 1.65-V minimum VCC operation while maintaining >250 mA latch-up immunity per JESD17 |
| 2000-V HBM ESD protection | Exceeds MIL-STD-883 Method 3015, supporting robust handling in manufacturing and field deployment |
| Widebus™ family compatibility | Pin- and function-compatible with other TI Widebus devices for scalable bus interface design |
Applications
| Memory Address Buffering | Clock Distribution |
|---|---|
Use Scenario: Driving address lines from a microcontroller to multiple SRAM/Flash devices in a shared-bus architecture. IC Role / Device Role / Timing Role: Noninverting 18-bit buffer with simultaneous 3-state control per 9-bit section to isolate memory banks during access. Use Value: Bus-hold prevents floating address lines during chip-select transitions, eliminating glitches and read errors without external resistors. | Use Scenario: Distributing a system clock to multiple synchronous peripherals with matched trace lengths. IC Role / Device Role / Timing Role: Low-skew 18-bit fanout buffer delivering identical edge timing to multiple receivers. Use Value: 3.4-ns typical propagation delay and <0.3-ns skew between outputs ensure setup/hold margin compliance across all loads. |
| Backplane Data Interface | Industrial I/O Expansion |
Use Scenario: Interfacing a CPU local bus to a 16-bit parallel backplane with hot-swap capability. IC Role / Device Role / Timing Role: Bidirectional-capable buffer (with external direction control) enabling data flow from CPU to peripheral cards. Use Value: Independent OE controls allow per-section isolation during card insertion/removal, preventing bus contention. | Use Scenario: Expanding GPIO count of a PLC controller by connecting discrete sensors and actuators to a parallel I/O port. IC Role / Device Role / Timing Role: Level-translating buffer driving 3.3-V I/O from a 1.8-V microcontroller core. Use Value: 1.65–3.6-V VCC range supports mixed-voltage systems, while ±24-mA drive handles LED indicators and relay coils directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 18-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16245ADGGR | No bus-hold; requires external termination; 32-pin TSSOP (two 8-bit sections) | Lacks input retention; suitable only where inputs are always driven | Select when BOM cost reduction outweighs risk of floating inputs |
| SN74AVC16835DGGR | Higher speed (tpd = 2.3 ns @ 3.3 V); no bus-hold; supports 1.2–3.6 V | Better for high-frequency buses (>100 MHz); requires external biasing | Choose for timing-critical designs where bus-hold is managed elsewhere |
Compared with SN74ALVCH16825DGGR, SN74LVC16245ADGGR reduces component count but increases layout sensitivity to floating nodes, while SN74AVC16835DGGR improves timing margin at the cost of added termination complexity and higher dynamic power.
Availability
SN74ALVCH16825DGGR is available at Aetrix Electronics and suitable for memory subsystems, clock distribution networks, industrial backplanes, and I/O expansion modules requiring stable component supply across extended temperature ranges.
Supply support for SN74ALVCH16825DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability interface ICs.
The SN74ALVCH16825DGGR belongs to TI's Widebus™ family of high-density bus interface devices, engineered specifically for low-voltage, high-speed memory and peripheral interconnect in industrial and computing systems.
FAQ
What is the minimum VCC voltage required for reliable operation of the SN74ALVCH16825DGGR?
The SN74ALVCH16825DGGR is fully characterized down to 1.65 V, with guaranteed performance across its entire operating range (1.65 V to 3.6 V). At 1.65 V, it delivers ±4 mA output drive and maintains bus-hold functionality with ±25 µA hold current. Operation below 1.65 V is not specified and may result in undefined logic states or increased static current.
Does the SN74ALVCH16825DGGR require external pullup resistors on its input pins?
No. The SN74ALVCH16825DGGR integrates active bus-hold circuitry on all data inputs (1A1–1A9, 2A1–2A9), which maintains valid logic levels on unused or floating inputs without external components. This eliminates the need for 18 discrete pullup/pulldown resistors, simplifying layout and reducing BOM cost.
How does the 3-state enable logic work on the SN74ALVCH16825DGGR?
The SN74ALVCH16825DGGR uses two independent 2-input AND gates per 9-bit section: outputs Y1–Y9 go high-impedance if either 1OE1 or 1OE2 is high; similarly, Y10–Y18 go high-impedance if either 2OE1 or 2OE2 is high. To guarantee high-Z during power-up, TI recommends tying all OE pins to VCC through a pullup resistor sized per the driver's sink capability.
Can the SN74ALVCH16825DGGR be used in mixed-voltage systems?
Yes. The SN74ALVCH16825DGGR supports VCC from 1.65 V to 3.6 V, allowing direct interfacing between 1.8-V, 2.5-V, and 3.3-V logic domains. Its input thresholds scale with VCC (e.g., VIH = 0.65×VCC at 1.65 V), ensuring reliable recognition of signals from lower- or higher-voltage drivers without level shifters.
What is the thermal performance of the SN74ALVCH16825DGGR in its DGG package?
The SN74ALVCH16825DGGR in the TSSOP-56 (DGG) package has a junction-to-ambient thermal resistance (θJA) of 81°C/W. At maximum rated power dissipation (40 µA ICC + dynamic load), junction temperature rise remains within safe limits up to +85°C ambient, provided standard PCB copper pour and airflow are maintained per JEDEC standards.
SN74ALVCH16825DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ALVCH
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 9
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74ALVCH16825DGGR FAQ
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6.How does Aetrix verify that SN74ALVCH16825DGGR is sourced from the original manufacturer or authorized distributors?
All SN74ALVCH16825DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74ALVCH16825DGGR meets industry standards.
7.What is the process for return or replacement of SN74ALVCH16825DGGR?
All SN74ALVCH16825DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74ALVCH16825DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74ALVCH16825DGGR part is unused and in its original packaging.
Return procedure for SN74ALVCH16825DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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