Texas Instruments SN74ALVCH16952DGVR

Overview

SN74ALVCH16952DGVR from Texas Instruments is a 16-bit registered transceiver with 3-state outputs, designed for bidirectional data flow between two 16-bit buses (A and B) in 1.65-V to 3.6-V systems. It features dual 8-bit register sets, bus-hold circuitry on all data inputs, independent clock-enable and output-enable controls per direction, and operates across –40°C to 85°C. It is used in high-speed board-level interconnects such as memory expansion, FPGA-to-ASIC bridging, and modular backplane interfaces.

For engineers reviewing the SN74ALVCH16952DGVR datasheet, SN74ALVCH16952DGVR pinout, SN74ALVCH16952DGVR application, or SN74ALVCH16952DGVR equivalent, key selection criteria include its dual-clock-register architecture, bus-hold input retention, 3.3-V/2.5-V/1.8-V compatibility, TSSOP-56 package footprint, and timing parameters including tpd ≤ 4.6 ns at 3.3 V and fclock = 150 MHz.

Technical Context

This device implements two independent 8-bit D-type flip-flop banks-one for A→B and one for B→A data paths-each controlled by dedicated clock (CLKAB/CLKBA), clock-enable (CLKENAB/CLKENBA), and output-enable (OEAB/OEBA) signals. Data is latched on the low-to-high clock transition when clock-enable is low, and outputs enter high-impedance state when output-enable is high.

Bus-hold circuitry actively maintains unused or floating data inputs at valid logic levels without external pullup/pulldown resistors. All control inputs require static biasing to VCC or GND for reliable operation, and power-up/down sequencing mandates OE tied to VCC via pullup to ensure defined 3-state behavior.

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package: 13.9 mm × 6.1 mm × 1.2 mm max height, 0.5-mm pitch, lead-free NiPdAu finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar registered transceiver applications.

Compared with SN74LVC16952DGGR and SN74ALVTH16952DGVR, the SN74ALVCH16952DGVR uniquely combines bus-hold, wide VCC range, low ICC, and 150-MHz capability in a single TSSOP-56 package - making it optimal for modern low-voltage, high-reliability parallel bus designs where component count and power are critical.

Availability

SN74ALVCH16952DGVR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA-to-ASIC bridging, modular backplane interconnects, and hot-swappable I/O module hubs requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for SN74ALVCH16952DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability interface ICs and process technologies like EPIC™.

The SN74ALVCH16952DGVR belongs to TI's Widebus™ family of advanced bus-interface devices, engineered specifically for high-speed, low-voltage parallel data transfer in space-constrained industrial and computing systems.

FAQ

What is the function of bus-hold circuitry in the SN74ALVCH16952DGVR?

The bus-hold circuitry in the SN74ALVCH16952DGVR actively maintains unused or floating data inputs (A1–A8, B1–B8) at their last-valid logic state using weak feedback transistors. This eliminates the need for external pullup or pulldown resistors, reducing BOM cost and PCB area while preventing undefined logic states during power-up, hot-swap events, or tri-stated conditions. The hold current is ±75 µA at 3.0 V.

Can the SN74ALVCH16952DGVR operate at 1.8 V and still meet timing specifications?

Yes, the SN74ALVCH16952DGVR is fully characterized down to 1.65 V and meets all timing specifications at 1.8 V, including tpd ≤ 4.6 ns, tsu ≥ 1.5 ns, and fclock = 150 MHz. Its EPIC™ submicron process ensures consistent performance across the full 1.65–3.6 V range, making it suitable for mixed-voltage systems with 1.8-V FPGAs or microcontrollers without level-shifting circuitry.

How does the SN74ALVCH16952DGVR handle power-up sequencing to avoid bus contention?

To prevent bus contention during power-up, the SN74ALVCH16952DGVR requires OEAB and OEBA to be held high (3-state) until VCC stabilizes. TI recommends tying OE pins to VCC through a pullup resistor - minimum value determined by driver sink capability - ensuring outputs remain high-impedance until firmware or hardware asserts OE low. This avoids unintended data leakage or short-circuit currents on shared buses.

Is the SN74ALVCH16952DGVR pin-compatible with other 56-pin TSSOP transceivers like the SN74ALVCH162245?

No, the SN74ALVCH16952DGVR is not pin-compatible with SN74ALVCH162245 or other non-registered transceivers. Its 56-pin TSSOP (DGG) footprint matches mechanically, but pin functions differ significantly: SN74ALVCH16952DGVR has dual clock, clock-enable, and output-enable controls per 8-bit port, whereas SN74ALVCH162245 uses single-direction OE and no registers. Signal routing and PCB layout must be redesigned for functional replacement.

What thermal considerations apply to the SN74ALVCH16952DGVR in high-density layouts?

The SN74ALVCH16952DGVR has a θJA of 81°C/W in the DGG package. In high-density layouts, thermal performance depends heavily on copper pour area under the exposed pad (if present) and adjacent ground/power planes. TI's recommended land pattern includes 28 thermal vias to internal layers. For continuous 150-MHz operation with full 32-bit toggling, keep ambient temperature below 70°C or add localized airflow to maintain junction temperature ≤125°C.