Texas Instruments SN74ALVTH16245DL

Overview

SN74ALVTH16245DL from Texas Instruments is a 16-bit dual-octal noninverting 3-state transceiver supporting 2.5-V/3.3-V V_CC, mixed-mode 5-V I/O tolerance, ±32/64 mA drive strength, bus-hold inputs, and hot-insertion capability via I_off and power-up 3-state logic. It enables bidirectional data flow between A and B buses in high-density memory or processor interconnect applications.

For engineers reviewing the SN74ALVTH16245DL datasheet, SN74ALVTH16245DL pinout, SN74ALVTH16245DL application, or SN74ALVTH16245DL equivalent, key selection criteria include its 48-pin SSOP (DL) package, 3.1 ns max t_PHL at 3.3 V, 0.55 V max V_OL at 64 mA, bus-hold current specifications (±75 µA), and guaranteed hot-swap isolation under I_off conditions.

Technical Context

This device implements a flow-through architecture with distributed V_CC/GND pins to minimize switching noise and supports two independent 8-bit transceiver sections-each controlled by dedicated DIR and OE inputs. Its ABT BiCMOS process delivers low static power dissipation while maintaining TTL-compatible input thresholds (V_IL = 0.8 V, V_IH = 2.0 V at 3.3 V).

The integrated bus-hold circuit eliminates external pullup/pulldown resistors by actively sustaining valid logic levels on floating inputs, with IBHL = 75 µA (sink) and IBHH = −75 µA (source) at V_CC = 3 V. Power-up 3-state ensures outputs remain high-impedance until V_CC exceeds 1.2 V, and I_off limits reverse current to ±100 µA when powered down.

Key Specifications

Pinout & Package

SN74ALVTH16245DL uses a 48-pin SSOP (DL) package with 0.5-mm pitch, 7.7 mm × 11.4 mm body size, and gull-wing leads. Pin assignments follow TI's standard Widebus™ layout optimized for flow-through routing and noise reduction via alternating V_CC/GND distribution.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar transceiver applications.

Compared with SN74LVC16245ADGGR and SN74AVC16245DGGR, the SN74ALVTH16245DL uniquely combines 3.3-V operation, 64-mA drive, integrated bus-hold, and I_off-enabled hot-swap-making it the sole option for robust, mixed-voltage, field-serviceable interconnects requiring zero external bias components.

Availability

SN74ALVTH16245DL is available at Aetrix Electronics and suitable for memory interconnect, processor bus extension, backplane interface, and test equipment signal routing requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for SN74ALVTH16245DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability interface ICs.

The SN74ALVTH16245DL belongs to TI's Widebus™ family of advanced transceivers designed specifically for mixed-voltage system interconnects in telecommunications infrastructure, industrial automation, and computing backplanes.

FAQ

What is the maximum output current specification for SN74ALVTH16245DL at 3.3-V V_CC?

The SN74ALVTH16245DL supports −32 mA high-level output current and 64 mA low-level output current under recommended operating conditions (V_CC = 3.3 V ± 0.3 V). These values are confirmed in the "Recommended Operating Conditions" table of the SCES066G datasheet and reflect worst-case drive capability across temperature and voltage ranges. This output strength allows direct interfacing with multiple TTL loads without external buffering.

Does SN74ALVTH16245DL support hot-plug operation, and how is it implemented?

Yes, SN74ALVTH16245DL supports hot-insertion via two integrated features: I_off circuitry disables outputs when V_CC = 0 V, limiting reverse current to ±100 µA, and power-up 3-state holds outputs in high-impedance until V_CC exceeds 1.2 V. Both mechanisms are explicitly verified in the Absolute Maximum Ratings and Recommended Operating Conditions sections of the SCES066G datasheet, making SN74ALVTH16245DL suitable for live backplane replacement in telecom and server systems.

What package type and dimensions does SN74ALVTH16245DL use?

SN74ALVTH16245DL uses a 48-pin SSOP (Shrink Small-Outline Package), designated DL in TI's ordering nomenclature. Its mechanical dimensions are 7.7 mm × 11.4 mm body size with 0.5-mm lead pitch, as documented in TI's MPDS006C mechanical drawing. The package includes gull-wing leads and complies with JEDEC MO-153 standards, enabling compatibility with standard SMT reflow profiles and automated optical inspection.

How does the bus-hold feature function on SN74ALVTH16245DL, and what are its electrical parameters?

The bus-hold circuit on SN74ALVTH16245DL actively maintains valid logic states on unused inputs without external resistors. At V_CC = 3 V, it sources −75 µA (IBHH) to hold high states and sinks +75 µA (IBHL) to hold low states, as specified in the Electrical Characteristics tables of SCES066G. This eliminates the need for 10-kΩ pullup/pulldown networks, reducing component count and improving signal integrity in high-density PCB layouts.

What is the propagation delay performance of SN74ALVTH16245DL at 3.3-V operation?

At V_CC = 3.3 V ± 0.3 V and C_L = 50 pF, SN74ALVTH16245DL achieves t_PHL ≤ 2.9 ns and t_PLH ≤ 3.1 ns for A↔B or B↔A data paths, per the Switching Characteristics table in SCES066G. These values represent worst-case maximum delays across temperature and voltage corners, ensuring timing predictability in synchronous bus designs such as memory controllers and FPGA peripheral interfaces.