Texas Instruments SN74AUC07RGYR

Overview

SN74AUC07RGYR from Texas Instruments is a hex buffer/driver IC with six independent open-drain outputs, designed for 1.65-V to 1.95-V V_CC operation and 3.6-V I/O tolerant inputs. It delivers 2.2 ns max propagation delay at 1.8 V, ±8-mA output drive, and supports partial-power-down via I_off. It enables wired-OR logic in low-voltage level-shifting interfaces such as I²C bus extensions.

For engineers reviewing the SN74AUC07RGYR datasheet, SN74AUC07RGYR pinout, SN74AUC07RGYR application, or SN74AUC07RGYR equivalent, key selection criteria include open-drain compatibility, sub-2-V supply operation, I_off support for hot-insertion, low ICC (≤10 µA), and QFN-14 thermal performance (θ_JA = 47 °C/W).

Technical Context

This device implements six non-inverting buffers with open-drain outputs, requiring external pull-up resistors to define high-level logic states. Each channel operates across 0.8-V to 2.7-V V_CC, but is optimized for 1.65–1.95 V - enabling interoperability between 1.8-V logic domains and higher-voltage peripherals.

The I_off circuitry actively disables all outputs when V_CC = 0 V, blocking current backflow up to ±10 µA, making it suitable for live insertion and mixed-supply systems. Input thresholds scale with V_CC (VIH = 0.65×V_CC, VIL = 0.35×V_CC) across the 1.1–1.95-V range, ensuring noise margin stability.

Key Specifications

Pinout & Package

VQFN-14 (RGY) package: 3.5 mm × 3.5 mm body, 0.5 mm lead pitch, 1.0 mm max height, exposed thermal pad on bottom. Requires soldering of thermal pad to PCB ground plane for optimal thermal and mechanical reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex open-drain buffer applications.

Compared with SN74LVC07AQPWRQ1 and SN74AUP1G07DBVR, the SN74AUC07RGYR uniquely combines 1.8-V-optimized speed (2.2 ns), sub-1-V operation, and six-channel integration in a 3.5-mm QFN - making it optimal for compact, battery-sensitive, mixed-voltage digital interfaces.

Availability

SN74AUC07RGYR is available at Aetrix Electronics and suitable for industrial sensor interfaces, I²C bus extensions, hot-swappable module interconnects, low-power GPIO expansion, and mixed-voltage logic translation requiring stable component supply and long-term manufacturability.

Supply support for SN74AUC07RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, personal electronics, and communications markets.

The SN74AUC07RGYR belongs to TI's AUC logic family - engineered specifically for ultra-low-voltage, high-speed, mixed-signal interface applications where 1.8-V operation, I/O tolerance, and power-aware design are critical.

FAQ

What is the minimum supply voltage for reliable operation of the SN74AUC07RGYR?

The SN74AUC07RGYR is fully operational down to 0.8 V V_CC, though its guaranteed specifications - including 2.2 ns max t_pd and ±8-mA I_OL - apply within the 1.65–1.95 V range. At 0.8 V, functionality is maintained but timing and drive strength degrade per datasheet curves; the SN74AUC07RGYR remains usable in ultra-low-power wake-up or energy-harvesting contexts where speed is secondary.

Does the SN74AUC07RGYR support I²C bus operation?

Yes, the SN74AUC07RGYR supports I²C bus extension and arbitration due to its six open-drain outputs, 3.6-V I/O tolerance, and compatibility with standard 1.8-V/3.3-V pull-up configurations. Its 2.2 ns t_pd at 1.8 V preserves timing margins for Fast-mode (400 kHz) I²C, and the I_off feature prevents bus contention during power sequencing - making the SN74AUC07RGYR suitable for robust multi-domain I²C implementations.

How should the thermal pad on the SN74AUC07RGYR QFN package be handled?

The exposed thermal pad on the SN74AUC07RGYR (RGY package) must be soldered to a PCB copper pour connected to GND for both thermal dissipation and mechanical stability. TI recommends ≥80% solder paste coverage and a thermal via array beneath the pad. Failure to connect the pad increases θ_JA beyond the rated 47 °C/W, risking thermal throttling or long-term reliability issues - proper pad implementation ensures the SN74AUC07RGYR maintains its 10-µA ICC and 2.2 ns timing under continuous load.

Can unused inputs on the SN74AUC07RGYR be left floating?

No - all unused inputs on the SN74AUC07RGYR must be tied to either V_CC or GND. Floating CMOS inputs cause increased ICC, noise susceptibility, and potential oscillation due to undefined threshold states. TI explicitly requires this in SCBA004; leaving inputs unconnected violates the SN74AUC07RGYR's recommended operating conditions and may elevate ICC beyond the 10-µA maximum or induce erratic output behavior.

Is the SN74AUC07RGYR pin-compatible with other 14-pin logic buffers like the SN74LV07A?

No - the SN74AUC07RGYR is not pin-compatible with SN74LV07A or similar 14-pin hex buffers. While both use 14-pin QFN packages, the SN74AUC07RGYR has alternating input-output pinout (A1-Y1-A2-Y2…), whereas SN74LV07A uses grouped inputs (pins 1–6) and outputs (pins 10–15). The SN74AUC07RGYR pin mapping is unique to the AUC family; substituting without layout revision will result in incorrect signal routing and functional failure.