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Texas Instruments SN74AUC126RGYR
- Part No.:
- SN74AUC126RGYR
- Manufacturer:
- Texas Instruments
- Package:
- 14-VFQFN Exposed Pad
- Datasheet:
-
SN74AUC126RGYR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 14VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,250
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Product details
Overview
SN74AUC126RGYR from Texas Instruments is a quadruple bus buffer gate with 3-state outputs, designed for low-voltage digital logic interfacing in mixed-signal systems. It operates from 0.8 V to 2.7 V (optimized at 1.6–1.95 V), delivers ±8-mA output drive at 1.8 V, achieves 2.1 ns max propagation delay, and supports Ioff partial-power-down mode - enabling use in battery-powered portable interfaces and voltage-level translation between 1.8-V and 3.3-V domains.
For engineers reviewing the SN74AUC126RGYR datasheet, SN74AUC126RGYR pinout, SN74AUC126RGYR application, or SN74AUC126RGYR equivalent, key selection criteria include sub-2-V operation capability, 3-state bus isolation timing, Ioff-enabled power sequencing, and QFN-14 thermal performance in space-constrained PCB layouts.
Technical Context
This device implements four independent noninverting buffers, each with dedicated 3-state output-enable (OE) control. All outputs enter high-impedance state when OE is low, and all inputs tolerate up to 3.6-V signals regardless of VCC - enabling robust level-shifting across voltage domains without external components.
The Ioff circuitry actively disables outputs during power-down, blocking reverse current flow even when VCC = 0 V and input/output pins are biased to active voltages. Its 1.8-V optimized design achieves 2.1 ns tpd with 15-pF load, while maintaining <10 µA ICC across the full operating temperature range (–40°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - supports ultra-low-voltage SoC I/O rails and legacy 1.8-V/2.5-V system interfaces |
| tpd (Max) | 2.1 ns at 1.8 V, CL = 15 pF - enables high-speed data buffering in DDR memory subsystems and FPGA configuration buses |
| Output Drive | ±8 mA at 1.8 V - sufficient to drive multiple CMOS loads or short PCB traces without signal degradation |
| Ioff Current | ±10 µA max at VI/VO = 2.7 V, VCC = 0 V - prevents backflow damage during hot-insertion or staggered power sequencing |
| IOZ (Hi-Z Leakage) | ±10 µA at VCC = 2.7 V - ensures stable bus contention-free isolation in shared-data-path architectures |
| ESD Rating | 2000-V HBM, 200-V MM, 1500-V CDM - meets industrial-grade reliability requirements without external protection |
| Input Voltage Tolerance | –0.5 V to 3.6 V - allows direct connection to 3.3-V drivers while powered from 1.8-V supply |
Pinout & Package
VQFN-14 (RGY) package: 3.5 mm × 3.5 mm body, 0.5 mm pitch, 1 mm max height, exposed thermal pad requiring PCB soldering for thermal and mechanical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | OE (Output Enable) | Active-high enable per channel; tie low via pulldown resistor for guaranteed Hi-Z at power-up |
| 2, 5, 9, 12 | A (Input) | Noninverting data input for corresponding buffer channel |
| 3, 6, 8, 11 | Y (Output) | 3-state buffered output; high-impedance when OE = L |
| 7 | GND | Ground reference for all logic and power domains |
| 14 | VCC | Core supply (0.8–2.7 V); must be decoupled locally with 0.1-µF ceramic capacitor |
Key Features
| Feature | Design Value |
|---|---|
| 1.8-V Optimized Logic | Guaranteed operation at 1.6–1.95 V with 2.1 ns speed - matches modern low-power microcontroller I/O voltage rails |
| Ioff Partial-Power-Down | Enables safe multi-rail system power sequencing without risk of latch-up or backfeed current |
| 3.6-V I/O Tolerance | Accepts 3.3-V inputs while powered from 1.8-V supply - eliminates need for discrete level shifters |
| Low ICC | 10 µA max supply current - extends battery life in always-on sensor interface and IoT edge nodes |
| Thermal Pad Integration | Exposed die-pad requires solder connection to PCB ground plane - improves thermal resistance by >30% vs. standard QFN |
Applications
| Mobile Baseband Interface | FPGA Configuration Bus |
|---|---|
|
Use Scenario: Isolating and buffering JTAG/SWD debug signals between 1.8-V application processor and 3.3-V FPGA during boot and firmware update. IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing voltage-tolerant bidirectional signal conditioning with controlled enable timing. Use Value: Eliminates external level translators while ensuring glitch-free boundary scan access and meeting 2.1-ns setup/hold timing margins. |
Use Scenario: Driving configuration data from 1.8-V flash memory to FPGA configuration pins operating at 2.5-V. IC Role / Device Role / Timing Role: Quad-channel unidirectional bus buffer enabling simultaneous bit loading with precise 3-state control during reconfiguration. Use Value: Supports 100+ MHz configuration clock rates with sub-3 ns propagation delay and zero added skew across channels. |
| Industrial Sensor Hub | Wearable Display Interface |
|
Use Scenario: Multiplexing analog sensor ADC outputs and digital status lines onto a shared 1.8-V microcontroller bus under varying power states. IC Role / Device Role / Timing Role: Power-aware bus isolator using Ioff to prevent backfeed when sensor subsystem is powered down independently. Use Value: Enables selective subsystem sleep modes without compromising bus integrity or requiring complex power-gating logic. |
Use Scenario: Interfacing AMOLED display controller (1.8-V) with touch controller (2.8-V) on compact wearable PCB. IC Role / Device Role / Timing Role: Low-capacitance (2.5 pF Ci), low-delay buffer supporting high-frequency SPI/I²C clock/data lines. Use Value: Maintains signal integrity at 20+ MHz SPI rates while occupying only 3.5 mm × 3.5 mm area - critical for size-constrained wearables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC126APWR | Wider VCC range (1.65–3.6 V); higher tpd (3.7 ns @ 3.3 V); no sub-1-V operation | Better suited for 3.3-V-only systems; lacks Ioff and 1.8-V optimization | Select when interfacing legacy 3.3-V peripherals without need for ultra-low-voltage support |
| 74AUP1G125GW,125 | Single-channel; lower drive (±4 mA @ 1.2 V); smaller XSON-6 package; 1.8-V typical but not optimized | Used where per-channel enable granularity and minimal footprint outweigh quad integration | Choose for space-limited designs needing individual channel control rather than grouped buffering |
Compared with SN74LVC126APWR and 74AUP1G125GW,125, the SN74AUC126RGYR uniquely combines quad-channel density, 1.8-V speed optimization, Ioff safety, and 3.6-V I/O tolerance - making it the preferred choice for next-generation low-power mixed-voltage interconnects where timing, power, and reliability are co-constrained.
Availability
SN74AUC126RGYR is available at Aetrix Electronics and suitable for mobile baseband interfaces, FPGA configuration buses, industrial sensor hubs, and wearable display interfaces requiring stable component supply, long-term lifecycle assurance, and consistent QFN-14 packaging.
Supply support for SN74AUC126RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronic components.
The SN74AUC126RGYR belongs to TI's AUC logic family - engineered specifically for ultra-low-voltage, high-speed digital interfacing in portable and battery-operated systems where power efficiency and signal integrity are critical.
FAQ
What is the minimum supply voltage required for functional operation of the SN74AUC126RGYR?
The SN74AUC126RGYR is fully specified from 0.8 V to 2.7 V, with guaranteed operation down to 0.8 V. However, its optimized performance window is 1.6 V to 1.95 V - at 0.8 V, propagation delay increases significantly (e.g., 5.8 ns typ), and output drive drops to ±0.7 mA. For reliable high-speed operation, SN74AUC126RGYR should be operated within its 1.6–1.95 V sweet spot.
Does the SN74AUC126RGYR support hot-swap or live-insertion into a powered system?
Yes - the SN74AUC126RGYR supports hot-swap via its Ioff feature. When VCC = 0 V, the Ioff circuitry limits input/output leakage to ±10 µA even if pins are biased to 2.7 V, preventing damaging back-current flow. This makes SN74AUC126RGYR suitable for modular backplane designs and field-replaceable units where cards may be inserted while system power remains active.
How should unused inputs on the SN74AUC126RGYR be handled to ensure stable operation?
All unused inputs on the SN74AUC126RGYR must be tied to either VCC or GND - floating inputs can cause excessive ICC, oscillation, or unpredictable output states due to CMOS threshold sensitivity. TI recommends connecting unused OE pins to GND (to disable outputs) and unused A inputs to GND or VCC depending on desired default logic level. This requirement is explicitly stated in the recommended operating conditions section of the SN74AUC126RGYR datasheet.
What is the thermal pad soldering requirement for the SN74AUC126RGYR's RGY package?
The SN74AUC126RGYR's VQFN-14 (RGY) package includes an exposed thermal pad that must be soldered to a PCB copper pour connected to GND. TI specifies this as mandatory for both thermal dissipation (θJA = 47°C/W) and mechanical reliability. The recommended land pattern uses 80% solder paste coverage on a 2.05 mm × 2.05 mm thermal pad with 0.125-mm stencil thickness - failure to solder the pad degrades thermal performance by >30% and risks solder joint fracture under thermal cycling.
Can the SN74AUC126RGYR be used as a level shifter between 1.8-V and 3.3-V logic domains?
Yes - the SN74AUC126RGYR supports true level-shifting functionality: it accepts 0–3.6-V inputs while powered from 1.8-V VCC, and outputs swing rail-to-rail (0 to VCC). When driving a 3.3-V receiver, the 1.8-V output may fall below VIH thresholds; however, when receiving 3.3-V signals (e.g., from a 3.3-V microcontroller GPIO), SN74AUC126RGYR interprets them correctly without damage - making it ideal for unidirectional upstream signal conditioning in mixed-voltage systems.
SN74AUC126RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 14-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-VQFN (3.5x3.5)
SN74AUC126RGYR FAQ
1.How can I place an order for SN74AUC126RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC126RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC126RGYR reliable?
The price and inventory of SN74AUC126RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC126RGYR is usually 5 days.
3.What payment methods are accepted for SN74AUC126RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC126RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AUC126RGYR?
SN74AUC126RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC126RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC126RGYR?
For technical support, including SN74AUC126RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC126RGYR requirements.
6.How does Aetrix verify that SN74AUC126RGYR is sourced from the original manufacturer or authorized distributors?
All SN74AUC126RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC126RGYR meets industry standards.
7.What is the process for return or replacement of SN74AUC126RGYR?
All SN74AUC126RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC126RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC126RGYR part is unused and in its original packaging.
Return procedure for SN74AUC126RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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