Texas Instruments SN74AUC17RGYR

Overview

SN74AUC17RGYR from Texas Instruments is a hex Schmitt-trigger buffer IC operating from 0.8 V to 2.7 V supply, optimized for 1.65–1.95 V V_CC, with 1.8 ns max propagation delay at 1.8 V, ±8 mA output drive, and I_off support for partial-power-down mode - used in low-voltage signal conditioning and noise-immune level translation in portable interface circuits.

For engineers reviewing the SN74AUC17RGYR datasheet, SN74AUC17RGYR pinout, SN74AUC17RGYR application, or SN74AUC17RGYR equivalent, key selection criteria include sub-1.8-V operation capability, Schmitt-trigger hysteresis (≥0.37 V at 1.65 V), I_off current ≤10 µA, 14-pin VQFN package thermal pad requirements, and 3.6-V I/O tolerance for mixed-mode interfacing.

Technical Context

This device implements six independent noninverting buffers with Schmitt-trigger inputs, providing distinct VT+ (e.g., 0.79–1.16 V at 1.65 V) and VT– (e.g., 0.39–0.62 V at 1.65 V) thresholds to reject input noise and ensure clean signal transitions. It supports bidirectional voltage-level shifting between 0.8-V and 3.6-V domains without external biasing.

The I_off circuitry actively disables outputs during power-down, blocking current backflow up to ±10 µA at 2.7 V on I/O pins, while maintaining latch-up immunity >100 mA per JESD 78 Class II. All inputs require termination to V_CC or GND to prevent floating-node instability.

Key Specifications

Pinout & Package

VQFN-14 (RGY) package, 3.5 mm × 3.5 mm body, 0.5 mm pitch, 1 mm max height, with exposed thermal pad requiring solder connection to PCB ground plane for thermal and mechanical stability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex Schmitt-trigger buffer applications.

Compared with SN74LVC17APWR and SN74AUP1G17DBVR, the SN74AUC17RGYR uniquely combines sub-1-V operation, 3.6-V I/O tolerance, and integrated six-channel buffering - making it optimal for compact, multi-rail, battery-sensitive designs where pin count and power domain flexibility are constrained.

Availability

SN74AUC17RGYR is available at Aetrix Electronics and suitable for USB interface conditioning, low-power sensor signal routing, and multi-rail power sequencing requiring stable component supply and long-term industrial availability.

Supply support for SN74AUC17RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The SN74AUC logic family targets ultra-low-voltage, high-speed digital interface applications - specifically designed for sub-1.8-V systems requiring noise-immune signal integrity and mixed-voltage interoperability.

FAQ

What is the minimum operating voltage for SN74AUC17RGYR?

The SN74AUC17RGYR operates down to 0.8 V V_CC, with full functionality including Schmitt-trigger thresholds and I_off protection confirmed across the 0.8–2.7 V range. At 0.8 V, t_pd is 6.7 ns (CL = 15 pF), and output drive is reduced but functional per datasheet Electrical Characteristics table.

Does SN74AUC17RGYR require external pull-up or pull-down resistors on unused inputs?

Yes - all unused inputs of the SN74AUC17RGYR must be externally tied to either V_CC or GND to prevent floating nodes, which could cause excessive ICC, oscillation, or undefined output states. This requirement is explicitly stated in TI's SCBA004 application report referenced in the datasheet.

Can SN74AUC17RGYR safely interface a 3.3-V signal to a 1.8-V microcontroller?

Yes - the SN74AUC17RGYR supports 3.6-V tolerant inputs and outputs, allowing direct connection of 3.3-V signals to its I/O pins while V_CC = 1.8 V. No external level-shifting components are needed, and VIH/VIL thresholds scale with V_CC to maintain logic compatibility.

What is the purpose of the exposed thermal pad on the SN74AUC17RGYR RGY package?

The exposed thermal pad on the SN74AUC17RGYR RGY package must be soldered to a PCB copper pour connected to GND. It serves dual roles: improving thermal dissipation (θ_JA = 47 °C/W) and enhancing mechanical attachment reliability. Omitting this connection degrades both thermal performance and long-term solder joint integrity.

How does the I_off feature of SN74AUC17RGYR protect system-level interconnects?

The I_off circuitry in SN74AUC17RGYR disables all outputs when V_CC = 0, limiting current flow through I/O pins to ≤10 µA even if external voltages up to 3.6 V are applied. This prevents damaging back-current from live buses into a powered-down subsystem - critical for hot-plug and partial-power-down architectures.