Texas Instruments SN74AUC1G125YEPR
- Part No.:
- SN74AUC1G125YEPR
- Manufacturer:
- Texas Instruments
- Package:
- 5-XFBGA, DSBGA
- Datasheet:
-
SN74AUC1G125YEPR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 5DSBGA
- Quantity:
- Payment:

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Product details
Overview
SN74AUC1G125 from Texas Instruments is a single-channel 3-state bus buffer gate optimized for 1.8-V operation, delivering ±8-mA output drive, 2.5-ns max propagation delay at 1.8 V/30 pF, 0.8–2.7-V supply range, and over-voltage tolerant I/Os up to 3.6 V. It serves as a high-speed signal redriver in low-voltage digital interfaces such as memory data paths and FPGA I/O expansion.
For engineers reviewing the SN74AUC1G125 datasheet, SN74AUC1G125 pinout, SN74AUC1G125 application, or SN74AUC1G125 equivalent, key selection criteria include 3-state control timing (ten/tdis), Ioff-enabled partial power-down capability, ULTTL output impedance matching for 50–65-Ω transmission lines, and NanoFree™ DSBGA package compatibility with space-constrained PCB layouts.
Technical Context
The SN74AUC1G125 implements a noninverting buffer with active-low 3-state enable (OE), where output Y follows input A when OE is low and enters high-impedance when OE is high. Its ULTTL output structure dynamically adjusts impedance during transitions to suppress ringing and support direct connection to controlled-impedance traces ≤15 cm without external termination.
It supports partial power-down via Ioff circuitry that disables outputs and limits back-drive current when VCC = 0 V, while standard CMOS inputs require explicit biasing (VCC or GND) to prevent floating states. The device operates across 0.8–2.7 V but achieves optimal speed-power trade-off between 1.65 V and 1.95 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 2.7 V - enables interoperability with sub-1-V logic domains and compatibility with 1.2-V, 1.8-V, and 2.5-V systems. |
| Max Propagation Delay | 2.5 ns at 1.8 V, 30-pF load - supports >250-MHz signal re-driving in high-speed digital interconnects. |
| Output Drive Strength | ±8 mA at 1.8 V - sufficient to drive moderate-capacitance loads and short controlled-impedance lines without external buffers. |
| I/O Over-Voltage Tolerance | Up to 3.6 V independent of VCC - allows safe interfacing with higher-voltage peripherals in mixed-supply systems. |
| Ioff Current | ±10 µA at 2.7 V - ensures robust isolation during partial power-down, preventing back-current damage in hot-swap or sleep-mode applications. |
| Quiescent ICC | 10 µA maximum - minimizes static power in always-on signal conditioning paths within battery-sensitive devices. |
| Input Transition Rate | Min 3 ns/V at 2.3–2.7 V - mandates fast edge rates to avoid excessive shoot-through current and oscillation on CMOS inputs. |
Pinout & Package
SN74AUC1G125 is offered in three industry-standard 5-pin packages: SOT-23 (DBV), SC70 (DCK), and NanoFree™ DSBGA (YZP). All variants share identical pin functionality and logic behavior, differing only in footprint size and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OE) | Active-low output enable input | Drives Y to high-impedance when logic high; must be pulled to VCC via resistor during power-up to ensure defined state. |
| 2 (A) | Noninverting data input | Accepts 0.8–3.6-V logic signals; requires termination to VCC or GND if unused to prevent floating and undefined output. |
| 3 (GND) | Ground reference | Primary return path for all internal currents; must be connected to low-impedance system ground plane for signal integrity. |
| 4 (Y) | 3-state buffered output | Delivers A-level signal when OE is low; presents high-Z when OE is high; supports bidirectional bus arbitration. |
| 5 (VCC) | Positive supply | Supplies core logic and output drivers; requires local 0.1-µF bypass capacitor placed adjacent to pin per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| ULTTL Output Structure | Dynamic impedance control enables clean 50–65-Ω transmission line driving ≤15 cm without external termination resistors. |
| Ioff Partial Power-Down | Disables all outputs and limits leakage to ±10 µA when VCC = 0 V, enabling safe integration into hot-pluggable or multi-rail power architectures. |
| NanoFree™ DSBGA Packaging | Dies-as-packages (YZP) reduce footprint to 1.39 mm × 0.89 mm and improve thermal resistance (RθJB = 47.6°C/W), ideal for ultra-dense mobile PCBs. |
| Over-Voltage Tolerant I/Os | Withstands 3.6-V input/output voltages regardless of VCC level, simplifying level-shifting design in heterogeneous voltage domain systems. |
| Low-Power Operation | 10-µA max ICC and 2-pF input capacitance minimize dynamic and static power consumption in always-active signal conditioning nodes. |
Applications
| Mobile Memory Interface | FPGA I/O Expansion |
|---|---|
|
Use Scenario: Redriving DDRx data strobes and command/address lines between baseband processor and LPDDR memory in smartphones. IC Role / Device Role / Timing Role: Single-line 3-state buffer isolating memory bus segments, enabling low-latency read/write arbitration and noise suppression. Use Value: 2.5-ns tpd at 1.8 V ensures setup/hold timing margins are preserved across temperature and voltage corners in compact form factors. |
Use Scenario: Enabling/disabling peripheral signals (e.g., UART, SPI, GPIO) routed through FPGA I/O banks to external sensors or actuators. IC Role / Device Role / Timing Role: Logic-level signal gate controlled by FPGA configuration register, providing runtime signal routing flexibility. Use Value: Ioff protection prevents back-drive current when FPGA is unpowered, eliminating need for external isolation diodes or complex power sequencing. |
| Wearable Sensor Hub | Industrial PLC I/O Module |
|
Use Scenario: Buffering I²C/SPI signals from ultra-low-power MEMS sensors to an ARM Cortex-M host MCU operating at 1.2 V. IC Role / Device Role / Timing Role: Voltage-tolerant interface translator allowing 3.3-V sensor outputs to safely connect to 1.2-V MCU inputs. Use Value: 3.6-V I/O tolerance eliminates level-shifters; 0.8-V min VCC supports operation during brown-out conditions without reset. |
Use Scenario: Isolating field-side digital inputs from controller-side logic in modular industrial I/O cards with mixed 5-V/24-V supply domains. IC Role / Device Role / Timing Role: Signal conditioner placed between optocoupler outputs and FPGA input pins to restore rise/fall times degraded by long traces. Use Value: ±8-mA drive strength restores edge integrity across 10-cm PCB traces; ULTTL output reduces EMI in electrically noisy factory environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G125DBVR | Slower max tpd (3.7 ns @ 3.3 V, 30 pF); lower drive (±24 mA @ 3.3 V); 1.65–5.5-V VCC range. | Better suited for 3.3-V legacy systems; lacks 0.8-V operation and 3.6-V I/O tolerance. | Select when cost sensitivity outweighs speed/power needs and system operates ≥3.0 V. |
| 74AUP1G125GW,125 | Lower ICC (0.9 µA typ); slower tpd (6.3 ns @ 3.0 V); 0.8–3.6-V VCC; no Ioff. | Optimized for ultra-low static power in battery-backed applications; no partial power-down support. | Prefer for always-on sensor nodes where quiescent current dominates lifetime budget, not speed-critical paths. |
Compared with SN74LVC1G125DBVR and 74AUP1G125GW,125, the SN74AUC1G125 uniquely balances sub-3-ns speed, 0.8-V operability, Ioff, and 3.6-V I/O tolerance-making it the only choice for high-density, multi-voltage, hot-pluggable digital interfaces requiring both performance and robustness.
Availability
SN74AUC1G125 is available at Aetrix Electronics and suitable for mobile memory interfaces, FPGA I/O expansion, wearable sensor hubs, industrial PLC modules, and automotive infotainment subsystems requiring stable component supply across extended temperature and voltage ranges.
Supply support for SN74AUC1G125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed, low-voltage logic families.
The SN74AUC1G125 belongs to TI's AUC (Advanced Ultra-Low-Voltage CMOS) family, engineered specifically for sub-2-V high-speed digital signal integrity in space-constrained portable and industrial electronics.
FAQ
What is the minimum supply voltage required for reliable operation of the SN74AUC1G125?
The SN74AUC1G125 is fully specified down to 0.8 V per its Recommended Operating Conditions. At this voltage, it maintains functional logic behavior with reduced drive strength and increased propagation delay, making it suitable for ultra-low-power modes in battery-operated systems where the SN74AUC1G125 remains operational during brown-out events.
Does the SN74AUC1G125 support hot-swap or partial power-down applications?
Yes, the SN74AUC1G125 includes Ioff circuitry that actively disables outputs and limits leakage to ±10 µA when VCC = 0 V. This feature protects against back-drive current in hot-swap scenarios and enables safe integration into multi-rail systems where the SN74AUC1G125 may be powered independently of upstream/downstream logic.
Can the SN74AUC1G125 drive a 50-Ω transmission line directly without external termination?
Yes-the SN74AUC1G125's ULTTL output structure is explicitly designed to drive 50–65-Ω controlled-impedance lines up to 15 cm in length without external series or parallel termination. This capability is validated in TI's AUC application notes and confirmed by simulated waveform fidelity in Figure 9-2 of the SN74AUC1G125 datasheet.
What is the recommended pull-up resistor value for the OE pin of the SN74AUC1G125 during power-up?
Texas Instruments recommends a 10-kΩ pull-up resistor from OE to VCC to ensure the output remains in high-impedance during power-up sequences. This value balances sufficient current sinking (to overcome input leakage) with minimal static power draw, and is validated in the SN74AUC1G125 layout examples and functional mode descriptions.
Which package options are available for the SN74AUC1G125, and how do they differ thermally?
The SN74AUC1G125 is offered in SOT-23 (DBV), SC70 (DCK), and NanoFree™ DSBGA (YZP) packages. Thermal resistance differs significantly: YZP has RθJB = 47.6°C/W, DBV = 123.2°C/W, and DCK = 153.4°C/W. The YZP variant delivers superior board-level heat dissipation, critical for high-density layouts where the SN74AUC1G125 operates near its 85°C ambient limit.
SN74AUC1G125YEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 5-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-DSBGA (1.4x0.9)
SN74AUC1G125YEPR FAQ
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7.What is the process for return or replacement of SN74AUC1G125YEPR?
All SN74AUC1G125YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC1G125YEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC1G125YEPR part is unused and in its original packaging.
Return procedure for SN74AUC1G125YEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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