Texas Instruments SN74AUC1G19YZPR

Overview

SN74AUC1G19YZPR from Texas Instruments is a 1-of-2 decoder/demultiplexer in a 6-ball DSBGA (YZP) package, operating from 0.8 V to 2.7 V with optimized 1.65–1.95 V performance. It features active-low enable (E), true (Y0) and complemented (Y1) outputs, ±8-mA drive at 1.8 V, 3 ns max propagation delay, and Ioff support for partial-power-down mode - used in portable audio routing, SSD control logic, and low-voltage embedded signal selection.

For engineers reviewing the SN74AUC1G19YZPR datasheet, SN74AUC1G19YZPR pinout, SN74AUC1G19YZPR application, or SN74AUC1G19YZPR equivalent, key selection criteria include sub-1-V operability, 3.6-V I/O tolerance for mixed-mode interfacing, latch-up immunity (>100 mA), and NanoFree™ package footprint constraints in space-constrained portable designs.

Technical Context

The SN74AUC1G19YZPR implements positive-logic decoding: when E is low, Y0 mirrors A and Y1 is its inverse; when E is high, both outputs go high-impedance. Its Ioff circuitry disables outputs during power-down, blocking backflow current even if inputs/outputs are driven while VCC = 0.

Designed for ultra-low-voltage operation, it supports 0.8-V minimum supply with full functionality and maintains 2.7-V absolute maximum ratings. Switching performance is characterized at CL = 15 pF and CL = 30 pF, with tpd as low as 1.7 ns at 2.5 V and 15 pF load.

Key Specifications

Pinout & Package

SN74AUC1G19YZPR uses a 6-ball DSBGA (YZP) package measuring 1.50 mm × 0.90 mm with 0.5-mm pitch, NanoFree™ construction where the silicon die serves as the package substrate - ideal for ultra-thin portable devices requiring minimal board area and low profile.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar decoder/demultiplexer applications.

Compared with SN74AUC1G19YZPR, SN74AUP1G19YZPR trades speed for lower static power, while SN74LVC1G19DBVR sacrifices miniaturization and ultra-low-voltage capability for broader voltage compatibility - making SN74AUC1G19YZPR optimal for next-gen portable devices demanding size, speed, and sub-1-V operation simultaneously.

Availability

SN74AUC1G19YZPR is available at Aetrix Electronics and suitable for portable audio routing, SSD control logic, and embedded PC power sequencing requiring stable component supply, long-term lifecycle support, and consistent DSBGA packaging.

Supply support for SN74AUC1G19YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with decades of innovation in low-power and miniature packaging technologies.

The SN74AUC1G19YZPR belongs to TI's AUC Sub-1-V Little Logic family, engineered specifically for space-constrained, battery-powered applications needing high-speed decoding below 1 V while maintaining interoperability with higher-voltage system components.

FAQ

What is the recommended operating voltage range for SN74AUC1G19YZPR?

The SN74AUC1G19YZPR is fully specified for 0.8 V to 2.7 V operation, with optimal performance targeted at 1.65 V to 1.95 V. It supports mixed-mode I/O up to 3.6 V, allowing reliable interfacing with 3.3-V or 2.5-V logic even when powered from 1.8 V. This makes SN74AUC1G19YZPR especially valuable in portable systems where multiple supply domains coexist on a single PCB.

Does SN74AUC1G19YZPR support partial-power-down mode?

Yes, SN74AUC1G19YZPR includes Ioff circuitry that disables outputs during power-down, limiting Ioff current to ±10 µA max. This prevents damaging current backflow when VCC = 0 but inputs or outputs remain driven - a critical feature for battery-isolated subsystems in tablets, SSDs, and wireless headsets where sections power up/down independently.

What is the package type and footprint of SN74AUC1G19YZPR?

SN74AUC1G19YZPR uses a 6-ball DSBGA (YZP) package measuring 1.50 mm × 0.90 mm with 0.5-mm ball pitch. As a NanoFree™ device, the silicon die itself forms the package - eliminating leadframe and reducing thickness to ≤0.5 mm. This enables placement in ultra-thin form factors such as slim tablets and compact SSD modules where height and area are tightly constrained.

How does the enable (E) pin function on SN74AUC1G19YZPR?

The E pin on SN74AUC1G19YZPR is an active-low enable: when E is low, Y0 follows A and Y1 follows NOT(A); when E is high, both Y0 and Y1 enter high-impedance state. This behavior is confirmed in the function table (Table 1) and logic diagram of the SN74AUC1G19YZPR datasheet, enabling clean bus isolation and dynamic signal path control in portable systems.

What are the key ESD and latch-up specifications for SN74AUC1G19YZPR?

SN74AUC1G19YZPR exceeds JESD 78 Class II latch-up immunity (>100 mA) and JESD 22 ESD ratings: 2000-V HBM, 200-V MM, and 1000-V CDM. These values are verified per industry-standard test methods and ensure robust handling during assembly and operation in consumer electronics environments - directly supporting reliability requirements for AV receivers, Blu-ray players, and enterprise tablets using SN74AUC1G19YZPR.