Texas Instruments SN74AUC1G19YZPRB

Overview

SN74AUC1G19YZPRB from Texas Instruments is a single 1-of-2 decoder/demultiplexer IC operating from 0.8 V to 2.7 V, optimized for 1.65–1.95 V supply. It buffers input A and routes true (Y0) and complemented (Y1) outputs when enable (E) is low, delivering ±8-mA drive at 1.8 V, 3 ns max propagation delay, and Ioff support for partial-power-down mode. It serves in portable audio routing and low-voltage logic level translation.

For engineers reviewing the SN74AUC1G19YZPRB datasheet, SN74AUC1G19YZPRB pinout, SN74AUC1G19YZPRB application, or SN74AUC1G19YZPRB equivalent, key selection criteria include sub-1-V operability, 3.6-V I/O tolerance for mixed-mode signal interfacing, latch-up immunity (>100 mA), and NanoFree™ DSBGA packaging for ultra-compact PCB layouts.

Technical Context

The SN74AUC1G19YZPRB implements positive-logic decoding with active-low enable control: when E = L, Y0 = A and Y1 = Ā; when E = H, both outputs go high-impedance. Its Ioff circuitry disables outputs during power-down to prevent backflow current, enabling safe hot-insertion in multi-rail systems.

Designed for sub-1-V operation down to 0.8 V, it maintains full functionality across 0.8–2.7 V while achieving 3 ns tpd at 1.8 V (CL = 15 pF). Its 3.6-V I/O tolerance allows interoperability with higher-voltage logic families without level shifters.

Key Specifications

Pinout & Package

SN74AUC1G19YZPRB uses a 6-ball DSBGA (YZP) package measuring 1.50 mm × 0.90 mm with 0.5-mm ball pitch and 0.5-mm max height. The NanoFree™ construction places the silicon die directly into the board-facing package, eliminating wirebonds and reducing parasitic inductance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar decoder/demultiplexer applications.

Compared with SN74AUC1G19YZPRB, SN74AUP1G19YZPR trades speed for lower static power, while 74LVC1G19GW,125 sacrifices sub-1-V capability and package size for broader voltage compatibility and higher drive strength-making SN74AUC1G19YZPRB optimal for space- and voltage-constrained portable designs.

Availability

SN74AUC1G19YZPRB is available at Aetrix Electronics and suitable for portable audio routing, SSD power sequencing, and embedded PC I/O expansion requiring stable component supply, long-term lifecycle assurance, and consistent DSBGA packaging.

Supply support for SN74AUC1G19YZPRB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in low-power and high-reliability IC design.

The SN74AUC1G19YZPRB belongs to TI's AUC Sub-1-V Little Logic family, engineered specifically for ultra-low-voltage portable and battery-operated applications where size, power, and mixed-signal interoperability are critical.

FAQ

What is the recommended operating voltage range for the SN74AUC1G19YZPRB?

The SN74AUC1G19YZPRB is fully specified for operation from 0.8 V to 2.7 V, with optimal performance targeted at 1.65 V to 1.95 V. Its 3.6-V I/O tolerance allows safe interfacing with higher-voltage logic families even when VCC is as low as 0.8 V. This makes SN74AUC1G19YZPRB suitable for modern sub-1-V processor I/O domains while maintaining backward compatibility.

Does the SN74AUC1G19YZPRB support partial-power-down operation?

Yes, the SN74AUC1G19YZPRB includes Ioff circuitry that disables outputs when VCC = 0 V, limiting off-state current to ±10 µA. This prevents damaging current backflow between powered and unpowered sections of a system, enabling safe use in hot-swap and dynamically powered architectures. The Ioff feature is explicitly validated per JEDEC JESD78 Class II latch-up testing.

What is the maximum propagation delay of the SN74AUC1G19YZPRB at 1.8 V?

The maximum propagation delay (tpd) of the SN74AUC1G19YZPRB is 3 ns at VCC = 1.8 V with CL = 15 pF, as specified in the switching characteristics table. This value applies to both A→Y0 and A→Y1 paths under recommended operating conditions and confirms its suitability for timing-critical signal routing in portable audio and SSD control applications.

Which package type does the SN74AUC1G19YZPRB use, and what are its dimensions?

The SN74AUC1G19YZPRB uses the YZP package: a 6-ball DSBGA (Die Size Ball Grid Array) measuring 1.50 mm × 0.90 mm with 0.5-mm ball pitch and ≤0.5-mm overall height. As a NanoFree™ device, it eliminates traditional packaging materials-using the silicon die itself as the package-resulting in minimal parasitics and superior thermal performance for dense portable layouts.

How does the SN74AUC1G19YZPRB handle ESD protection?

The SN74AUC1G19YZPRB exceeds JEDEC standards for ESD robustness: 2000-V Human-Body Model (HBM), 200-V Machine Model (MM), and 1000-V Charged-Device Model (CDM). These ratings are verified per JESD22-A114, JESD22-A115, and JESD22-C101, ensuring reliable handling and operation in standard manufacturing and end-user environments without added protection components.