Texas Instruments SN74AUC1G240YZPR

Overview

SN74AUC1G240YZPR from Texas Instruments is a single noninverting buffer/driver with 3-state output, designed for 1.65-V to 1.95-V V_CC operation. It delivers ±8-mA drive at 1.8 V, achieves 2.5-ns max propagation delay, and supports mixed-mode I/O up to 3.6 V. Used in low-voltage logic interfacing, level translation, and bus isolation in portable and space-constrained embedded systems.

For engineers reviewing the SN74AUC1G240YZPR datasheet, SN74AUC1G240YZPR pinout, SN74AUC1G240YZPR application, or SN74AUC1G240YZPR equivalent, key selection criteria include sub-1-V operability, I_off-enabled partial-power-down support, 132°C/W θ_JA thermal performance in YZP package, and NanoFree™ die-as-package construction for ultra-small footprint.

Technical Context

This device implements a single-channel noninverting buffer with active-low 3-state enable (OE), where output Y follows input A when OE is low and enters high-impedance state when OE is high. Logic operation is specified across 0.8-V to 2.7-V V_CC, with optimized timing and drive strength in the 1.65–1.95-V range.

It features I_off circuitry that disables outputs during power-down to prevent backflow current, and supports mixed-mode signal operation via 3.6-V tolerant I/O pins. ESD protection exceeds JESD 22 standards (2000-V HBM, 200-V MM, 1000-V CDM), and latch-up performance exceeds 100 mA per JESD 78 Class II.

Key Specifications

Pinout & Package

NanoFree™ WCSP (YZP) package: 5-bump, 0.23-mm large bump, Pb-free, bottom-side terminated die-scale package measuring 1.1 mm × 0.9 mm × 0.45 mm (max height). No external leadframe; solder bumps serve as terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar single-buffer-with-3-state-output applications.

Compared with SN74AUC1G240DBVR and SN74AUC1G240DCKR, the SN74AUC1G240YZPR offers the smallest footprint and best thermal performance, making it the optimal choice for miniaturized, thermally sensitive, and high-reliability portable electronics - despite identical logic behavior and electrical ratings.

Availability

SN74AUC1G240YZPR is available at Aetrix Electronics and suitable for portable sensor hubs, wearable power-rail isolation, and ultra-compact FPGA I/O expansion requiring stable component supply, long-term lifecycle assurance, and consistent NanoFree™ package delivery.

Supply support for SN74AUC1G240YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power logic and advanced packaging.

The SN74AUC1G240YZPR belongs to TI's AUC logic family - engineered for ultra-low-voltage, high-speed operation in space-constrained portable and medical electronics, emphasizing sub-1-V functionality and die-scale packaging.

FAQ

What is the minimum supply voltage for reliable operation of the SN74AUC1G240YZPR?

The SN74AUC1G240YZPR is fully functional down to 0.8 V V_CC, with recommended operation between 1.65 V and 1.95 V. At 0.8 V, it maintains logic integrity and specified timing margins, enabling use in energy-harvesting and ultra-low-power systems where traditional 1.8-V logic would fail. The SN74AUC1G240YZPR retains full I_off and 3.6-V I/O tolerance even at minimum V_CC.

How does the NanoFree™ YZP package of the SN74AUC1G240YZPR differ from standard SOT-23 or SC-70 packages?

The SN74AUC1G240YZPR uses NanoFree™ WCSP (YZP), a die-scale package where the silicon die itself serves as the package - no leadframe or mold compound. Measuring just 1.1 mm × 0.9 mm × 0.45 mm, it occupies 0.99 mm², versus 2.92 mm² for DBV and 2.1 mm² for DCK. This yields superior thermal resistance (132°C/W) and eliminates wirebond inductance, improving signal fidelity in high-speed, space-constrained designs.

Can the SN74AUC1G240YZPR safely interface a 3.3-V microcontroller GPIO with a 1.8-V FPGA input?

Yes - the SN74AUC1G240YZPR supports 3.6-V tolerant I/O, so its inputs accept 0–3.6 V regardless of V_CC. When powered at 1.8 V, it outputs 0–1.8 V levels compatible with the FPGA, while safely accepting 3.3-V signals from the microcontroller without clamping or damage. This eliminates external level-shifting components in mixed-voltage interconnects involving the SN74AUC1G240YZPR.

What is the recommended pull-up configuration for the OE pin of the SN74AUC1G240YZPR during power-up?

To ensure high-impedance output at power-up, OE should be pulled to V_CC via an external resistor. TI specifies the minimum value based on the driver's current-sinking capability - typically ≤10 kΩ for robust noise immunity. For the SN74AUC1G240YZPR, a 4.7-kΩ resistor is commonly used, ensuring OE remains high until firmware actively drives it low, preventing bus contention during boot.

Does the SN74AUC1G240YZPR support hot-swap or live-insertion in partially powered systems?

Yes - the SN74AUC1G240YZPR includes I_off circuitry that disables outputs and blocks current flow when V_CC = 0 V, even if input or output pins are biased to valid logic levels. This allows safe insertion into a live backplane or connection to powered peripherals without damaging the SN74AUC1G240YZPR or upstream components, meeting requirements for modular, field-upgradable systems.