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Texas Instruments SN74AUC240RGYR
- Part No.:
- SN74AUC240RGYR
- Manufacturer:
- Texas Instruments
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
SN74AUC240RGYR.pdf
- Description:
- IC BUFFER INVERT 2.7V 20VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,512
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Product details
Overview
SN74AUC240RGYR from Texas Instruments is an octal 3-state inverting buffer/driver optimized for 1.8-V operation with ±8-mA output drive, 1.7-ns max propagation delay at 1.8 V, and 3.6-V I/O tolerance-designed for memory address drivers, clock distribution, and bus-transceiver applications in low-voltage embedded systems.
For engineers reviewing the SN74AUC240RGYR datasheet, SN74AUC240RGYR pinout, SN74AUC240RGYR application, or SN74AUC240RGYR equivalent, key selection criteria include sub-2-V supply compatibility, Ioff-enabled partial-power-down support, high-speed 1.8-V logic interfacing, and QFN-20 thermal performance in space-constrained PCB layouts.
Technical Context
This device integrates two independent 4-bit inverting buffers, each with dedicated active-low output-enable (OE) control. Its dual-OE architecture enables selective channel isolation without affecting adjacent data paths, supporting dynamic bus arbitration in multi-master systems.
Designed for 0.8-V to 2.7-V operation (optimized at 1.65–1.95 V), it features Ioff circuitry that disables outputs during power-down to prevent backflow current, and supports mixed-mode signaling via 3.6-V-tolerant I/Os-enabling safe interfacing between 1.8-V logic and higher-voltage peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - operates down to sub-1-V for ultra-low-power modes; rated for stable 1.8-V core logic |
| tpd (max) | 1.7 ns at 1.8 V - enables >500-MHz data rates in short-trace clock or address buffering |
| Output Drive | ±8 mA at 1.8 V - sufficient to drive 15-pF loads with <2-ns edge fidelity in compact routing |
| Ioff Current | ±10 µA - ensures safe isolation during partial power-down without external pull resistors |
| IOH/VOL | −8 mA / 0.45 V at 1.65 V - guarantees rail-to-rail logic swing under full load for noise margin integrity |
| ESD Rating | 2000-V HBM - meets industrial-grade robustness for handling and board-level integration |
| Package | VQFN-20 (RGY), 3.5 × 4.5 mm - exposes thermal pad for enhanced heat dissipation in dense layouts |
Pinout & Package
VQFN-20 (RGY) package with 0.5-mm pitch, 3.5 mm × 4.5 mm body, 1.0-mm max height, and exposed thermal pad requiring solder connection to PCB ground plane for thermal and mechanical reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 6, 7, 8, 9 | Input A1–A4, B1–B4 | Eight buffered input channels grouped as two 4-bit banks; non-inverting inputs per functional block |
| 12, 13, 14, 15, 17, 18, 19, 20 | Output Y1–Y4, W1–W4 | Inverting outputs corresponding to A/B inputs; 3-state capable with OE control |
| 5, 11 | OE1, OE2 | Active-low enable controls for respective 4-bit banks; tied to VCC via pull-up for power-up high-Z safety |
| 10 | GND | Ground reference for all logic and output stages; must be low-inductance connection to thermal pad |
| 16 | VCC | Core supply (0.8–2.7 V); decoupling capacitor required within 3 mm of pin for high-speed stability |
Key Features
| Feature | Design Value |
|---|---|
| 1.8-V Optimized Speed | 1.7-ns tpd enables timing-critical address/clock buffering where legacy 3.3-V buffers fail |
| Ioff Partial-Power-Down | Prevents back-current flow when VCC = 0 V, eliminating need for external isolation switches in hot-swap designs |
| 3.6-V I/O Tolerance | Allows direct interface to 3.3-V or 2.5-V peripherals without level shifters in mixed-voltage systems |
| Low ICC (20 µA max) | Reduces static power in always-on subsystems such as real-time clock domains or standby controllers |
| Latch-Up Immunity | Exceeds 100 mA per JESD 78 Class II - ensures robustness against transient overvoltage events on PCB |
Applications
| Memory Address Buffering | Low-Voltage Clock Distribution |
|---|---|
Use Scenario: Driving address lines from a 1.8-V microcontroller to multiple 3.3-V SRAM chips in a portable medical data logger. IC Role / Device Role / Timing Role: Inverting 3-state buffer isolating MCU address bus while enabling chip-select arbitration across parallel memory banks. Use Value: 3.6-V I/O tolerance eliminates level-shifter ICs; ±8-mA drive sustains signal integrity across 8-cm FR4 traces at 100-MHz toggle rates. | Use Scenario: Distributing a 1.8-V system clock to four low-power ADCs and a sensor hub in an IoT edge node. IC Role / Device Role / Timing Role: Fanout buffer splitting single clock source into synchronized, isolated outputs with matched skew. Use Value: 1.7-ns tpd and <0.3-ns inter-output skew ensure setup/hold compliance for 500-MHz sampling clocks. |
| PCIe Sideband Signal Routing | Industrial PLC Backplane Interface |
Use Scenario: Level-translating and buffering PCIe REFCLK, PERST#, and CLKREQ# signals between 1.8-V FPGA and 3.3-V slot controller. IC Role / Device Role / Timing Role: Bidirectional-capable 3-state buffer managing open-drain and push-pull sideband signals with voltage translation. Use Value: Ioff protection prevents backfeed during FPGA reconfiguration; 2000-V HBM withstands ESD in field-replaceable module insertion. | Use Scenario: Interfacing a 1.8-V ARM-based controller to legacy 5-V digital I/O modules via optocoupler-isolated backplane. IC Role / Device Role / Timing Role: Voltage-tolerant buffer driving optocoupler LED anodes while maintaining logic-level compatibility. Use Value: Sub-1-V operability allows direct tie to controller's LDO output; ±10-µA Ioff enables safe hot-plug detection without bus contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state inverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC240APWR | Higher VCC range (1.65–3.6 V); 3.5-ns tpd at 3.3 V; no sub-1-V operation | Better suited for 3.3-V dominant systems; lacks Ioff and 1.8-V speed optimization | Select when interfacing primarily with 3.3-V logic and thermal budget permits larger tpd margin |
| 74AUP240GW,118 | NXP variant; 2.2-ns tpd at 1.8 V; lower ICC (10 µA); same RGY package | Superior static power but slightly slower; identical pinout and I/O tolerance | Prefer for battery-powered applications where 0.5-ns tpd penalty is acceptable for halved quiescent current |
Compared with SN74AUC240RGYR, SN74LVC240APWR trades 1.8-V speed and Ioff for broader voltage flexibility, while 74AUP240GW,118 matches package and voltage range but reduces ICC by 50% at the cost of 0.5 ns added propagation delay-making SN74AUC240RGYR optimal for high-speed, mixed-voltage, partial-power-down use cases.
Availability
SN74AUC240RGYR is available at Aetrix Electronics and suitable for memory subsystems, low-voltage clock trees, and industrial backplane interfaces requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant VQFN packaging.
Supply support for SN74AUC240RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on power efficiency, signal integrity, and industrial reliability.
The SN74AUC240RGYR belongs to TI's AUC logic family-engineered specifically for high-speed, low-voltage 1.8-V system interfacing with emphasis on timing precision, I/O tolerance, and partial-power-down robustness.
FAQ
What is the minimum operating voltage for SN74AUC240RGYR?
The SN74AUC240RGYR operates down to 0.8 V, enabling functionality in ultra-low-power states such as deep-sleep modes of microcontrollers or energy-harvesting systems. This sub-1-V capability is verified across the full −40°C to 85°C temperature range and is distinct from typical 1.2-V logic families. The SN74AUC240RGYR maintains specified timing and drive strength even at this minimum VCC, with tpd increasing predictably to 4.8 ns at 0.8 V per datasheet Figure 4.
Does SN74AUC240RGYR support hot-swap or partial-power-down operation?
Yes, SN74AUC240RGYR includes integrated Ioff circuitry that disables all outputs when VCC = 0 V, preventing damaging current backflow from live I/Os into the unpowered device. This feature is explicitly characterized per JESD 78 and validated at ±10 µA maximum Ioff current. The SN74AUC240RGYR requires no external components to implement safe partial-power-down-unlike standard buffers that mandate series resistors or external MOSFET switches.
What is the recommended PCB layout practice for the thermal pad on SN74AUC240RGYR?
The exposed thermal pad (Pin 21) of SN74AUC240RGYR must be soldered directly to a solid PCB ground plane using at least nine 0.3-mm vias filled or tented per TI SLUA271 guidelines. The land pattern should match the 2.05 mm × 3.05 mm pad outline with 0.07-mm solder mask opening tolerance. Failure to connect this pad degrades thermal resistance by >20°C/W and risks parametric drift under sustained 8-mA output loading-verified in TI's RGY0020A package characterization report.
Can SN74AUC240RGYR drive 50-Ω transmission lines directly?
No, SN74AUC240RGYR is not designed for 50-Ω line driving; its ±8-mA output drive at 1.8 V yields ~225-Ω effective source impedance, optimized for capacitive loads ≤15 pF (e.g., short PCB traces or CMOS inputs). For 50-Ω routing, external series termination or dedicated line drivers like SN65LVDS100 are required. Using SN74AUC240RGYR without termination causes overshoot >30% and violates VOL/VOH specs beyond 5 pF load per datasheet AC characteristics table.
Is SN74AUC240RGYR pin-compatible with other SN74AUC240 variants in different packages?
Yes, all SN74AUC240 variants-including SN74AUC240PWR (TSSOP-20) and SN74AUC240DBR (SOIC-20)-share identical pinout, logic function, and electrical behavior. The SN74AUC240RGYR differs only in package (VQFN-20) and thermal performance; no redesign is needed when migrating from SOIC or TSSOP, provided PCB layout accommodates the 3.5 × 4.5 mm footprint and thermal pad requirements per TI's RGY package drawing.
SN74AUC240RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-VQFN (3.5x4.5)
SN74AUC240RGYR FAQ
1.How can I place an order for SN74AUC240RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC240RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC240RGYR reliable?
The price and inventory of SN74AUC240RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC240RGYR is usually 5 days.
3.What payment methods are accepted for SN74AUC240RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC240RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AUC240RGYR?
SN74AUC240RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC240RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC240RGYR?
For technical support, including SN74AUC240RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC240RGYR requirements.
6.How does Aetrix verify that SN74AUC240RGYR is sourced from the original manufacturer or authorized distributors?
All SN74AUC240RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC240RGYR meets industry standards.
7.What is the process for return or replacement of SN74AUC240RGYR?
All SN74AUC240RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC240RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC240RGYR part is unused and in its original packaging.
Return procedure for SN74AUC240RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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