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Texas Instruments SN74AUC245RGYR
- Part No.:
- SN74AUC245RGYR
- Manufacturer:
- Texas Instruments
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
SN74AUC245RGYR.pdf
- Description:
- IC TXRX NON-INVERT 2.7V 20VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,794
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Product details
Overview
SN74AUC245RGYR from Texas Instruments is an octal bus transceiver with 3-state outputs in a 20-pin VQFN (RGY) package, optimized for 1.8-V operation with 3.6-V I/O tolerance, sub-1-V operability, 1.7-ns max propagation delay at 1.8 V, and ±8-mA output drive - used for bidirectional voltage-level translation between low-voltage data buses in portable computing and high-speed memory interfaces.
For engineers reviewing the SN74AUC245RGYR datasheet, SN74AUC245RGYR pinout, SN74AUC245RGYR application, or SN74AUC245RGYR equivalent, key selection criteria include Ioff-enabled partial-power-down support, 0.8-V to 2.7-V operational VCC range, 3.6-V tolerant I/Os for mixed-mode signaling, and thermal performance validated for QFN-20 packaging in space-constrained PCB layouts.
Technical Context
The SN74AUC245RGYR implements asynchronous bidirectional data flow controlled by DIR (direction) and OE (output enable), supporting A→B or B→A transmission with simultaneous 3-state isolation when OE is high. Its logic operates across 0.8–2.7 V VCC but is specifically characterized for 1.65–1.95 V.
It features Ioff circuitry that disables outputs during power-down to prevent backflow current, and meets JESD 78 Class II latch-up (>100 mA) and JESD 22 ESD specifications (2000-V HBM, 200-V MM, 1000-V CDM). The device uses standard CMOS input thresholds scaled to VCC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - enables operation from ultra-low-voltage systems (e.g., battery-powered SoC I/O domains) up to 2.5-V logic rails. |
| Max tpd @ 1.8 V | 1.7 ns - supports >500-MHz data throughput in point-to-point or stub-bus configurations without timing closure issues. |
| Ioff Support | Yes - allows safe partial-power-down of one bus side while the other remains active, critical for hot-swap and power-gating architectures. |
| Output Drive | ±8 mA @ 1.8 V - sufficient to drive 15-pF loads with <2.2 ns tpd under typical conditions, meeting JEDEC-compliant signal integrity targets. |
| I/O Tolerance | 3.6 V - permits interfacing with higher-voltage peripherals (e.g., 3.3-V memory or legacy logic) without external level shifters. |
| ICC Max | 20 µA - minimizes quiescent power in always-on subsystems such as wake-on-LAN or real-time monitoring paths. |
| ESD Rating | 2000-V HBM - exceeds industrial-grade robustness requirements for handheld and field-deployable equipment. |
Pinout & Package
SN74AUC245RGYR is housed in a 3.5 mm × 4.5 mm, 0.5-mm pitch, 20-pin VQFN (RGY) package with exposed thermal pad. Pin 1 is located at top-left corner (Q1 quadrant), and the thermal pad must be soldered to PCB ground for thermal and mechanical reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | OE (Output Enable) | Active-low control: drives all outputs into high-impedance state when high; tie to VCC via pullup for power-up safety. |
| 2–9 | B1–B8 | Bus B-side I/O terminals - bidirectionally connected to B bus; internally buffered with 3-state drivers. |
| 10 | GND | Ground reference for logic and power return - must be low-inductance connection adjacent to thermal pad. |
| 11–18 | A1–A8 | Bus A-side I/O terminals - bidirectionally connected to A bus; electrically identical to B-side pins. |
| 19 | DIR (Direction Control) | Controls data flow direction: DIR = low → B→A; DIR = high → A→B; no internal pullup/pulldown. |
| 20 | VCC | Supply voltage input - decoupling capacitor (0.1 µF) required within 3 mm of pin per TI layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Sub-1-V operability | Functional down to 0.8 V VCC - supports next-generation ultra-low-power microcontrollers and energy-harvesting subsystems. |
| Ioff partial-power-down | Prevents damaging current backflow when VCC = 0 V - eliminates need for external isolation switches in multi-rail power sequencing. |
| 3.6-V I/O tolerance | Allows direct interface to 3.3-V or 2.5-V peripherals without level-shifting components - reduces BOM count and board area. |
| 1.7-ns max tpd @ 1.8 V | Enables reliable 500+ Mbps bidirectional data transfer on compact PCB traces - validated with 15-pF load and 0.15-V switching threshold. |
| JESD 78 Class II latch-up | Withstands >100 mA transient current - ensures robustness in noisy industrial environments with shared ground returns. |
Applications
| Mobile Memory Interface | Low-Power FPGA I/O Bridging |
|---|---|
|
Use Scenario: Bidirectional data transfer between a 1.8-V mobile DDR controller and 3.3-V legacy LPDDR2 memory modules in smartphone baseband subsystems. IC Role / Device Role / Timing Role: Voltage-level translating transceiver managing A/B bus directionality and isolation during memory refresh cycles. Use Value: Eliminates discrete level shifters while maintaining <2 ns timing margin across 16-bit data paths at 400 MHz. |
Use Scenario: Interfacing a 0.85-V FPGA I/O bank with 1.8-V sensor hub MCU in wearable health monitors requiring dynamic voltage scaling. IC Role / Device Role / Timing Role: Asynchronous bus translator enabling runtime VCC domain switching without bus contention or glitch propagation. Use Value: Supports seamless transition between active and retention modes using Ioff, reducing system standby current by >15 µA per channel. |
| USB 2.0 PHY Signal Isolation | Industrial PLC Backplane Buffering |
|
Use Scenario: Isolating USB 2.0 D+/D− lines between host controller (3.3-V) and peripheral port (1.8-V) during suspend/resume sequences. IC Role / Device Role / Timing Role: 3-state enabled transceiver providing OE-controlled break-before-make switching to prevent signal contention on shared differential pairs. Use Value: Meets USB 2.0 eye diagram mask requirements with <1.4 ns tpd variation across temperature, ensuring signal integrity at 480 Mbps. |
Use Scenario: Buffering MODBUS RTU serial data between 2.5-V isolated UART and 1.8-V microcontroller in programmable logic controller backplanes. IC Role / Device Role / Timing Role: Robust bidirectional bus driver with ESD-hardened I/Os surviving >2 kV contact discharge in factory-floor EMI environments. Use Value: Replaces dual discrete MOSFET-based translators with single-chip solution, improving MTBF by eliminating 12 passive components per channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVC245RGR | Higher speed (1.1 ns tpd @ 1.8 V), wider VCC range (1.2–3.6 V), but no sub-1-V operation support. | Preferred for 500+ MHz clock-domain crossing where setup/hold margins are tighter; not suitable for 0.8–1.0 V systems. | Select when maximum speed is prioritized over ultra-low-VCC compatibility and Ioff is not required. |
| SN74LVC245APW | Operates from 1.65–3.6 V only; lacks Ioff and sub-1-V capability; 3.5 ns tpd @ 1.8 V; TSSOP-20 package. | Suitable for cost-sensitive industrial boards where thermal pad soldering is impractical and 2.5-V logic dominates. | Choose when board assembly favors leaded packages and mixed 2.5/3.3-V signaling is primary - not for battery-critical or ultra-low-VCC designs. |
Compared with SN74AVC245RGR and SN74LVC245APW, SN74AUC245RGYR uniquely supports 0.8-V operation and Ioff-enabled partial-power-down - making it the only option among the three for energy-constrained, dynamically powered systems requiring guaranteed bus isolation during rail collapse.
Availability
SN74AUC245RGYR is available at Aetrix Electronics and suitable for portable computing, high-speed memory interfaces, and industrial PLC backplane buffering requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant VQFN packaging.
Supply support for SN74AUC245RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed logic and low-power interface solutions.
The SN74AUC245RGYR belongs to TI's AUC (Advanced Ultra-low-voltage CMOS) logic family, designed specifically for sub-2-V bidirectional bus translation in power-sensitive, high-density portable and embedded systems.
FAQ
What is the minimum operating voltage for SN74AUC245RGYR?
The SN74AUC245RGYR is fully specified down to 0.8 V VCC and functions reliably in that range, with timing and drive strength characterized per TI's SCES419A datasheet. Below 0.8 V, behavior is undefined and not guaranteed. This makes SN74AUC245RGYR suitable for ultra-low-power domains such as energy-harvesting sensors or deep-sleep MCU states where supply drops near 0.8 V.
Does SN74AUC245RGYR support hot insertion or partial-power-down?
Yes, SN74AUC245RGYR includes Ioff circuitry that actively disables outputs when VCC = 0 V, preventing damaging current backflow from live buses into the unpowered device. This feature is explicitly validated per JESD 78 and enables safe hot-plug operation in modular systems - a capability not present in standard LVC or AVC variants.
Can SN74AUC245RGYR interface between 1.8-V and 3.3-V logic without external components?
Yes, SN74AUC245RGYR has 3.6-V tolerant I/Os, allowing its A or B ports to safely accept 3.3-V signals while operating at 1.8-V VCC. No external resistors or level shifters are needed - the device maintains valid logic thresholds and drive strength across both voltage domains, as confirmed in the Absolute Maximum Ratings and Recommended Operating Conditions tables.
What is the thermal pad requirement for SN74AUC245RGYR?
The exposed thermal pad (Pin 21) of SN74AUC245RGYR must be soldered to a PCB copper pour tied to GND. TI specifies this for both thermal dissipation (θJA = 37°C/W) and mechanical stability. Omitting the pad connection risks exceeding junction temperature limits under sustained 8-mA per-pin loading and may cause solder joint fatigue in thermal cycling environments.
How does the DIR and OE pin interaction affect bus isolation in SN74AUC245RGYR?
In SN74AUC245RGYR, OE is dominant: when OE = high, all outputs go high-impedance regardless of DIR state - fully isolating both A and B buses. When OE = low, DIR selects direction (low = B→A, high = A→B). This two-level control enables fail-safe isolation during power sequencing or fault conditions, as OE can be held high via pullup until system initialization completes.
SN74AUC245RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-VQFN (3.5x4.5)
SN74AUC245RGYR FAQ
1.How can I place an order for SN74AUC245RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC245RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC245RGYR reliable?
The price and inventory of SN74AUC245RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC245RGYR is usually 5 days.
3.What payment methods are accepted for SN74AUC245RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC245RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AUC245RGYR?
SN74AUC245RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC245RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC245RGYR?
For technical support, including SN74AUC245RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC245RGYR requirements.
6.How does Aetrix verify that SN74AUC245RGYR is sourced from the original manufacturer or authorized distributors?
All SN74AUC245RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC245RGYR meets industry standards.
7.What is the process for return or replacement of SN74AUC245RGYR?
All SN74AUC245RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC245RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC245RGYR part is unused and in its original packaging.
Return procedure for SN74AUC245RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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