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Texas Instruments SN74AUC2G07YEPR
- Part No.:
- SN74AUC2G07YEPR
- Manufacturer:
- Texas Instruments
- Package:
- 6-XFBGA, DSBGA
- Datasheet:
-
SN74AUC2G07YEPR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 6DSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SN74AUC2G07YEPR from Texas Instruments is a dual buffer/driver IC with open-drain outputs, designed for 1.65-V to 1.95-V operation and 3.6-V I/O tolerant mixed-mode signal interfacing. It delivers ±8-mA sink/source drive at 1.8 V, achieves 2.5 ns max propagation delay, and supports partial-power-down via Ioff. It is used in level-shifting and wired-OR logic applications in portable low-voltage systems.
For engineers reviewing the SN74AUC2G07YEPR datasheet, SN74AUC2G07YEPR pinout, SN74AUC2G07YEPR application, or SN74AUC2G07YEPR equivalent, key selection criteria include open-drain compatibility, sub-1-V operability, Ioff-enabled power sequencing, 1.8-V optimized timing, and NanoFree™ WCSP package footprint constraints.
Technical Context
This device implements two independent non-inverting buffers, each with an open-drain output stage capable of sinking up to 32 mA. Its Ioff circuitry actively disables outputs during power-down, preventing backflow current when VCC = 0 V. Input thresholds scale with VCC (VIH = 0.65×VCC, VIL = 0.35×VCC) across 0.8–2.7 V supply range.
The SN74AUC2G07YEPR operates with guaranteed performance from –40°C to 85°C and supports CL = 15 pF load conditions. Its NanoFree™ DSBGA (YZP) package uses the silicon die as the package body, eliminating wirebonds and leadframe-enabling ultra-small 1.02 mm × 1.52 mm footprint with 0.5-mm pitch ball grid array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - supports sub-1-V startup and 1.8-V nominal rail; not rated for 3.3-V core operation |
| Max tpd | 2.5 ns at 1.8 V, CL = 15 pF - enables high-speed interface bridging in compact portable designs |
| IOL (1.8 V) | ±8 mA - sufficient to drive multiple CMOS inputs or pull down 10-kΩ bus terminations |
| Ioff | ±10 µA at VI/VO = 2.7 V - ensures safe isolation during hot-insertion or staggered power sequencing |
| VIO Tolerance | 3.6-V I/O - allows connection to higher-voltage peripherals without external level shifters |
| ESD Rating | 2000-V HBM, 200-V MM, 1000-V CDM - meets industrial-grade robustness requirements |
| Package | DSBGA-6 (YZP), 1.02 mm × 1.52 mm, 0.5-mm pitch - ultra-compact footprint for space-constrained wearables and IoT sensors |
Pinout & Package
SN74AUC2G07YEPR is packaged in a 6-ball NanoFree™ DSBGA (YZP) with bottom-side terminations. The package height is ≤0.5 mm, and ball pitch is 0.5 mm. Pin 1 is located at corner A1 per JEDEC MO-203AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A1) | 1A - Input of Buffer 1 | CMOS-compatible input with VCC-referenced thresholds; must be tied to VCC or GND if unused |
| 2 (B1) | 1Y - Open-Drain Output of Buffer 1 | Sinks current only; requires external pull-up to define high state; supports wired-AND/OR bus topologies |
| 3 (B2) | GND - Ground Reference | Primary return path for all internal logic and output current; must be low-inductance connection |
| 4 (A2) | 2Y - Open-Drain Output of Buffer 2 | Independent open-drain output; electrically isolated from 1Y but shares same VCC/GND rails |
| 5 (A3) | 2A - Input of Buffer 2 | Functionally identical to 1A; no internal cross-coupling between channels |
| 6 (B3) | VCC - Supply Voltage | Single 0.8–2.7-V supply; powers both buffers; Ioff remains active even when VCC = 0 V |
Key Features
| Feature | Design Value |
|---|---|
| Open-Drain Outputs | Enables active-low wired-OR and active-high wired-AND bus architectures without external diodes or resistors |
| Ioff Partial-Power-Down | Prevents damaging back-current flow when SN74AUC2G07YEPR is unpowered but connected to live buses |
| NanoFree™ Packaging | Eliminates leadframe and wirebonds - reduces parasitic inductance and saves >50% board area vs. SOT-23 |
| Sub-1-V Operability | Functional at 0.8 V - supports emerging ultra-low-power microcontrollers and energy-harvesting systems |
| 3.6-V I/O Tolerance | Allows direct interface to 3.3-V or 2.5-V peripherals while powered from 1.8-V rail - no level shifter needed |
Applications
| USB OTG Host Detection | Low-Power Sensor Interface |
|---|---|
|
Use Scenario: Detecting USB peripheral attachment by monitoring ID pin voltage level in mobile OTG adapters. IC Role / Device Role / Timing Role: SN74AUC2G07YEPR acts as a bidirectional level translator and open-drain driver for the ID line, enabling 1.8-V SoC to sense 3.3-V peripheral presence. Use Value: Leverages 3.6-V I/O tolerance and Ioff to safely interface between unpowered and powered domains during plug/unplug events. |
Use Scenario: Aggregating interrupt signals from multiple ultra-low-power environmental sensors (e.g., temperature, humidity) onto a shared MCU interrupt line. IC Role / Device Role / Timing Role: SN74AUC2G07YEPR provides two independent open-drain drivers that implement active-low wired-OR logic, reducing GPIO count on the host MCU. Use Value: Sub-1-V operability ensures compatibility with sub-1-V sensor outputs; NanoFree™ YZP package fits within tight wearable PCB real estate. |
| Mobile Display Backlight Control | Industrial I²C Bus Extender |
|
Use Scenario: Driving PWM-controlled LED backlight strings in smartphones where main SoC operates at 1.8 V but LEDs require higher-voltage biasing. IC Role / Device Role / Timing Role: SN74AUC2G07YEPR buffers and inverts PWM signals from baseband processor, then sinks current into external MOSFET gate drivers. Use Value: 2.5 ns propagation delay preserves PWM fidelity; ±8-mA drive strength ensures fast MOSFET switching with minimal gate charge delay. |
Use Scenario: Isolating and extending I²C bus segments across different voltage domains (e.g., 1.8-V controller to 3.3-V EEPROM) in programmable logic controllers. IC Role / Device Role / Timing Role: SN74AUC2G07YEPR serves as passive bus buffer - its open-drain outputs replicate SDA/SCL lines while blocking reverse current during power faults. Use Value: Ioff prevents backfeed from powered slave devices into unpowered master; 3.6-V I/O tolerance accommodates 3.3-V pull-ups without clamping diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual open-drain buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G07DBVR | Higher ICC (10 µA vs. 10 µA typical), wider VCC range (1.65–5.5 V), slower tpd (3.7 ns @ 3.3 V), SOT-23-6 package | Supports 5-V legacy systems; less suitable for sub-1.8-V operation or ultra-compact layouts | Choose when 5-V compatibility or standard SMT assembly is prioritized over size and speed |
| NC7SZ07P5X | Single-channel, SC-70-5 package, 3.5 ns tpd @ 3.3 V, no Ioff, lower ESD (1500-V HBM) | Lacks dual-channel integration and partial-power-down safety; requires two units for same function | Choose only if single-buffer requirement exists and Ioff is not needed for system-level power sequencing |
Compared with SN74LVC2G07DBVR and NC7SZ07P5X, the SN74AUC2G07YEPR uniquely combines dual-channel open-drain buffering, sub-1-V operation, Ioff protection, and NanoFree™ footprint - making it optimal for next-generation space- and power-constrained portable electronics where reliability during mixed-voltage power sequencing is critical.
Availability
SN74AUC2G07YEPR is available at Aetrix Electronics and suitable for USB OTG detection, low-power sensor aggregation, mobile display control, and industrial I²C extension requiring stable component supply, long-term lifecycle support, and consistent wafer fab sourcing.
Supply support for SN74AUC2G07YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions across industrial, automotive, and personal electronics markets.
The SN74AUC2G07YEPR belongs to TI's AUC logic family - engineered for ultra-low-voltage, high-speed operation in battery-powered portable devices, with emphasis on power sequencing integrity and minimal board space consumption.
FAQ
What is the maximum sink current capability of the SN74AUC2G07YEPR outputs?
The SN74AUC2G07YEPR outputs are rated for a maximum sink current of 32 mA under absolute maximum conditions. However, for reliable continuous operation at 1.8 V, the recommended IOL is ±8 mA per channel - sufficient to drive standard CMOS loads or terminate 10-kΩ pull-up resistors without exceeding VOL specifications or thermal limits.
Does the SN74AUC2G07YEPR support true bidirectional level shifting?
No, the SN74AUC2G07YEPR does not perform active bidirectional level shifting. It is a unidirectional buffer with open-drain outputs. While its 3.6-V I/O tolerance allows connection to higher-voltage pull-ups, signal flow is strictly input-to-output. For true bidirectional translation (e.g., I²C), dedicated level translators like TXS0102 are required.
Can the SN74AUC2G07YEPR be operated with VCC = 0 V while other system rails remain active?
Yes - the SN74AUC2G07YEPR features Ioff circuitry that actively disables outputs when VCC = 0 V. This prevents back-current flow from live I/O lines into the unpowered device, protecting both the SN74AUC2G07YEPR and upstream components during partial-power-down sequences common in portable electronics.
What is the significance of the "YEPR" suffix in SN74AUC2G07YEPR?
The "YEPR" suffix identifies the specific packaging and ordering variant: Y = NanoFree™ DSBGA (YZP), E = tape-and-reel packaging, P = Pb-free finish, R = 3000-unit reel quantity. This matches TI's official orderable part number SN74AUC2G07YZPR, confirming the device is supplied in 0.5-mm pitch, 1.02 mm × 1.52 mm DSBGA format.
How does the NanoFree™ YZP package of the SN74AUC2G07YEPR improve thermal performance compared to SOT-23?
The SN74AUC2G07YEPR's NanoFree™ YZP package has a θJA of 123°C/W, significantly lower than the DBV (SOT-23) variant's 165°C/W. This 25% improvement stems from direct die-to-PCB thermal conduction via solder balls - eliminating leadframe resistance and enabling more efficient heat dissipation in thermally constrained layouts such as multi-layer smartphone PCBs.
SN74AUC2G07YEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 6-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Open Drain
- Current - Output High, Low:
- -, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DSBGA
SN74AUC2G07YEPR FAQ
1.How can I place an order for SN74AUC2G07YEPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC2G07YEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC2G07YEPR reliable?
The price and inventory of SN74AUC2G07YEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G07YEPR is usually 5 days.
3.What payment methods are accepted for SN74AUC2G07YEPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC2G07YEPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AUC2G07YEPR?
SN74AUC2G07YEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC2G07YEPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC2G07YEPR?
For technical support, including SN74AUC2G07YEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G07YEPR requirements.
6.How does Aetrix verify that SN74AUC2G07YEPR is sourced from the original manufacturer or authorized distributors?
All SN74AUC2G07YEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G07YEPR meets industry standards.
7.What is the process for return or replacement of SN74AUC2G07YEPR?
All SN74AUC2G07YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G07YEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC2G07YEPR part is unused and in its original packaging.
Return procedure for SN74AUC2G07YEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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