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Texas Instruments SN74AUC2G125YZPR
- Part No.:
- SN74AUC2G125YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74AUC2G125YZPR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,960
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Product details
Overview
SN74AUC2G125YZPR from Texas Instruments is a dual 3-state bus buffer gate optimized for 1.65–1.95 V operation, delivering ±8 mA output drive at 1.8 V, sub-1-V operability down to 0.8 V, and 1.8 ns max propagation delay at 1.8 V. It enables bidirectional signal isolation in low-voltage data paths such as mobile memory interfaces and portable SoC interconnects.
For engineers reviewing the SN74AUC2G125YZPR datasheet, SN74AUC2G125YZPR pinout, SN74AUC2G125YZPR application, or SN74AUC2G125YZPR equivalent, key selection criteria include Ioff-enabled partial-power-down support, NanoFree™ DSBGA package footprint (1.02 × 2.02 mm), 3.6-V I/O tolerance for mixed-mode interfacing, and guaranteed 10 μA ICC at 1.8 V.
Technical Context
This device implements two independent noninverting buffers, each with an active-low 3-state enable (OE) controlling output high-impedance state. The Ioff circuitry actively disables outputs during power-down, preventing backflow current when VCC = 0 V.
Designed for sub-1-V to 2.7-V supply range, it operates reliably across 0.8–2.7 V but is characterized and optimized specifically for 1.65–1.95 V - matching core voltages of advanced low-power processors and memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V; fully functional at 0.8 V, optimized for 1.65–1.95 V operation in modern ultra-low-voltage systems |
| Max tpd | 1.8 ns at 1.8 V (CL = 15 pF); ensures timing-critical signal buffering in high-speed serial links and memory channels |
| Output Drive | ±8 mA at 1.65 V; sufficient to drive 50-Ω transmission lines or multiple CMOS loads without external termination |
| Ioff Support | Enabled; blocks current flow between powered/unpowered domains, critical for hot-plug and partial-power-down architectures |
| IOH/IOL | –9 mA / +9 mA at 2.3 V; maintains logic integrity under heavy capacitive loading and fast edge rates |
| Input Thresholds | VIH = 0.65×VCC, VIL = 0.35×VCC (1.1–1.95 V); provides robust noise margin across process/voltage/temperature corners |
| ESD Rating | HBM 2000 V, MM 200 V, CDM 1000 V; meets industrial-grade reliability requirements without external protection |
Pinout & Package
SN74AUC2G125YZPR uses the YZP package: an 8-ball NanoFree™ DSBGA (Die Size Ball Grid Array) measuring 1.02 mm × 2.02 mm with 0.4-mm ball pitch and Pb-free SnAgCu solder bumps. Pin 1 is located at corner A1 (top-left in bottom view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 (Ball 1) | 1OE | Active-low enable for first buffer; must be pulled high via resistor during power-up to ensure defined high-Z state |
| A2 (Ball 2) | 1A | Input for first buffer; accepts 0.8–3.6 V signals, compatible with 1.2-V, 1.8-V, and 3.3-V logic families |
| B1 (Ball 3) | GND | Ground reference for both buffers; requires low-inductance connection to minimize switching noise |
| B2 (Ball 4) | 1Y | Noninverting 3-state output of first buffer; high-Z when 1OE = high, drives rail-to-rail within VCC |
| A3 (Ball 5) | VCC | Supply input for both buffers; decoupling capacitor (100 nF) required within 2 mm of this ball |
| B3 (Ball 6) | 2Y | Noninverting 3-state output of second buffer; electrically isolated from 1Y; shares same VCC/GND |
| A4 (Ball 7) | 2A | Input for second buffer; functionally identical to 1A; supports independent signal routing |
| B4 (Ball 8) | 2OE | Active-low enable for second buffer; independently controllable from 1OE for selective channel gating |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ Packaging | Dies-as-package architecture eliminates leadframe and mold compound, reducing size to 1.02 × 2.02 mm and thermal resistance to 102°C/W |
| 3.6-V I/O Tolerance | Inputs and outputs withstand up to 3.6 V regardless of VCC, enabling safe interfacing with higher-voltage peripherals |
| Sub-1-V Operation | Functional at 0.8 V supply, supporting next-generation ultra-low-power microcontrollers and wearables |
| Low ICC | 10 μA typical at 1.8 V, minimizing quiescent power in always-on system management functions |
| Fast Enable/Disable | 1.1 ns typical enable time (ten) and 1.7 ns typical disable time (tdis) at 1.8 V, critical for dynamic bus arbitration |
Applications
| Mobile Memory Interface | SoC Power-Rail Isolation |
|---|---|
Use Scenario: Buffering address/data lines between an application processor and LPDDR2/LPDDR3 memory in smartphones and tablets. IC Role / Device Role / Timing Role: Dual-channel 3-state buffer providing voltage-level translation and bus contention control during memory refresh cycles. Use Value: Enables 1.8-V processor core to safely interface with 1.2-V memory I/O while maintaining <1.8 ns propagation delay for timing closure. | Use Scenario: Isolating peripheral buses during selective power-down of SoC subsystems (e.g., camera ISP, audio codec). IC Role / Device Role / Timing Role: Bidirectional bus gate enforcing high-impedance state on unpowered domains using Ioff and independent OE control. Use Value: Prevents backfeed current and latch-up risk when VCC drops to 0 V, satisfying JESD78 Class II latch-up immunity (>100 mA). |
| Wearable Sensor Hub | Ultra-Low-Power MCU Peripherals |
Use Scenario: Interfacing multiple low-power sensors (accelerometer, gyroscope, ambient light) to a 0.9-V sensor hub MCU. IC Role / Device Role / Timing Role: Voltage-scalable buffer ensuring signal integrity across 0.8–1.2 V supply range with minimal leakage. Use Value: Delivers 10 μA ICC and sub-1-V operation, extending battery life in coin-cell-powered wearables beyond 12 months. | Use Scenario: Driving GPIO expansion or external SPI flash from a 1.1-V ARM Cortex-M0+ MCU in energy-harvesting applications. IC Role / Device Role / Timing Role: Level-shifting buffer with 3.6-V tolerant inputs accepting legacy 3.3-V peripheral signals. Use Value: Eliminates need for discrete level shifters while maintaining 1.8 ns tpd for real-time SPI clocking at 25 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUC2G126YZPR | Inverting output logic (vs. noninverting in SN74AUC2G125YZPR); identical electrical specs, package, and pinout | Required where signal polarity inversion is needed in bus arbitration or feedback paths | Select SN74AUC2G126YZPR only when inverting functionality is explicitly required; otherwise, SN74AUC2G125YZPR is preferred for direct signal pass-through |
| SN74LVC2G125DCUR | VSSOP-8 package (2.3 × 2.0 mm), higher ICC (10 μA vs. 10 μA typical but not guaranteed sub-1-V), 1.65–5.5 V VCC range | Suitable for space-tolerant designs needing wider supply range and hand-solderable package | Choose SN74LVC2G125DCUR if board layout allows larger footprint and 5-V compatibility is required; SN74AUC2G125YZPR remains optimal for ultra-compact, sub-1-V designs |
Compared with SN74AUC2G126YZPR, SN74AUC2G125YZPR provides noninverting signal path essential for transparent bus extension; versus SN74LVC2G125DCUR, it delivers 55% smaller footprint and guaranteed 0.8-V operation - critical for miniaturized, battery-constrained systems.
Availability
SN74AUC2G125YZPR is available at Aetrix Electronics and suitable for mobile memory interfaces, SoC power-rail isolation, wearable sensor hubs, ultra-low-power MCU peripherals, and battery-operated IoT edge nodes requiring stable component supply and long-term lifecycle continuity.
Supply support for SN74AUC2G125YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal technologies, serving industrial, automotive, and consumer markets with high-reliability components.
SN74AUC2G125YZPR belongs to TI's AUC Little Logic family, engineered for sub-1-V operation and ultra-small packaging to meet stringent size and power constraints in portable and wearable electronics.
FAQ
What is the minimum operating voltage for SN74AUC2G125YZPR?
The SN74AUC2G125YZPR operates down to 0.8 V, with full functionality specified across 0.8–2.7 V. Its design is optimized for 1.65–1.95 V, making it ideal for modern low-voltage SoCs and battery-powered devices where supply rails drop below 1.0 V during deep sleep modes. This sub-1-V capability is verified per datasheet Section 6.2.
Does SN74AUC2G125YZPR support mixed-voltage interfacing?
Yes, SN74AUC2G125YZPR supports mixed-voltage interfacing through 3.6-V I/O tolerance: inputs and outputs withstand up to 3.6 V regardless of VCC level. This allows safe connection to 3.3-V peripherals while operating from a 1.8-V supply, eliminating external level shifters in heterogeneous voltage domain systems.
How does the Ioff feature work in SN74AUC2G125YZPR?
The Ioff feature in SN74AUC2G125YZPR disables all outputs when VCC = 0 V, preventing current backflow from live inputs into the unpowered device. This protects downstream circuitry during partial power-down sequences and satisfies JESD78 Class II latch-up immunity requirements (>100 mA), as confirmed in Absolute Maximum Ratings and Applications section of the datasheet.
What is the thermal resistance (θJA) of the YZP package used by SN74AUC2G125YZPR?
The YZP package for SN74AUC2G125YZPR has a thermal resistance θJA of 102°C/W, significantly lower than SSOP (220°C/W) or VSSOP (227°C/W) variants due to its NanoFree™ die-as-package construction. This enables higher power efficiency and improved thermal performance in compact, sealed enclosures.
Can SN74AUC2G125YZPR replace SN74AUC2G125DCTR in an existing design?
SN74AUC2G125YZPR is not a direct drop-in replacement for SN74AUC2G125DCTR due to fundamental package differences: YZP is an 8-ball DSBGA (1.02 × 2.02 mm), while DCTR is an 8-pin SSOP (3.0 × 3.0 mm). PCB redesign is required for land pattern, stencil, and assembly. Electrical behavior is identical, but mechanical integration demands layout revision.
SN74AUC2G125YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74AUC2G125YZPR FAQ
1.How can I place an order for SN74AUC2G125YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC2G125YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC2G125YZPR reliable?
The price and inventory of SN74AUC2G125YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G125YZPR is usually 5 days.
3.What payment methods are accepted for SN74AUC2G125YZPR?
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4.How is shipping managed for SN74AUC2G125YZPR?
SN74AUC2G125YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC2G125YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC2G125YZPR?
For technical support, including SN74AUC2G125YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G125YZPR requirements.
6.How does Aetrix verify that SN74AUC2G125YZPR is sourced from the original manufacturer or authorized distributors?
All SN74AUC2G125YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G125YZPR meets industry standards.
7.What is the process for return or replacement of SN74AUC2G125YZPR?
All SN74AUC2G125YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G125YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC2G125YZPR part is unused and in its original packaging.
Return procedure for SN74AUC2G125YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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